The North America Quad-Flat-No-Lead Packaging Market would witness market growth of 7.7% CAGR during the forecast period (2022-2028).
The rapidly growing IC packaging solution currently available is quad-flat no-lead packaging technology. The versatile form factor of QFN packaging lets the technology service all markets while meeting unique dimensions and application requirements. The QFN packaging option is employed in a variety of markets to overcome space and functionality issues. MLF is becoming popular and versatile in microelectromechanical and sensor systems applications.
The automobile sector continues to rely on QFN technology for improvements in the adoption of vehicle electronics. Automatic windscreen wiper systems, battery control management systems, and sophisticated moisture-sensing systems are examples of QFN applications. Usually, IC packaging marks the final phase in the fabrication of semiconductor devices. During this crucial stage, the block of the semiconductor is encased in a packaging that shields the integrated circuit from potentially harmful external factors and the destructive effects of time.
The package is an enclosure created to safeguard the block and stimulate the electrical connections that transmit signals to an electronic device's circuit board. Lead frame IC packages are the most prevalent variety. This packaging would be used for wire-bonded linked dies with gold or silver plating. Manufacturers commonly employ copper lead-frame materials for surface-mount plastic containers. Copper is very conductive and highly malleable. Hence it can be advantageous for this application.
The four industries strategically significant to the United States are semiconductors, photovoltaic products, advanced batteries, and pharmaceuticals. All electronic devices require integrated circuits, which are the essential building blocks. These advancements in information technology have greatly increased production in all local businesses. Technology developments in the defense industry depend on American dominance in semiconductors. The fundamental component of solar energy, photovoltaic cells are also a key renewable energy source that can advance American national objectives by reducing reliance on foreign oil and greenhouse gas emissions. These elements significantly impact the regional quad-flat-no-lead market's explosive expansion.
The US market dominated the North America Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $155.5 Thousands by 2028. The Canada market is poised to grow at a CAGR of 10.1% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 9.2% during (2022 - 2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Global Quad-Flat-No-Lead Packaging Market is Estimated to reach $749.2 Million by 2028, at a CAGR of 8.4%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
By Moulding Method
By Terminal Pads
By Type
By Vertical
By Country
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