The Asia Pacific Quad-Flat-No-Lead Packaging Market would witness market growth of 8.7% CAGR during the forecast period (2022-2028).
Consumers who want to stay connected in the digital environment require smaller, lighter items as international mobility increases. Consumer electronics manufacturers are attempting to make their products smaller to meet this demand. Smaller, thinner, and more insulated containers enable the miniaturization of items.
Multiple studies have shown that QFN packages surpass dual in-line surface-mount technology (SMT) packages in terms of thermal performance. Compared to typical leaded packages, QFN packages have no external leads, a short board routing area, low inductance, and low capacitance. To achieve product simplification, organizations have chosen QFN packaging as one of the strategies for electronic component manufacturing.
The Asia-Pacific region has a disproportionately high concentration of semiconductor manufacturers and is a major user of the QFN packaging technology. Several government initiatives are also being launched to expand the industry for semiconductor manufacturing technology. For instance, the governments of Asian countries with developing economies are committed to securing FDI for their national economies' growth. The government authorities set up some FDI attraction strategies to achieve this. These significant investments support various businesses, including the semiconductor industry, while enabling the development of new products and services. Therefore, this element would contribute to the regional quad-flat-no-lead packaging market expanding more quickly.
The China market dominated the Asia Pacific Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $82.3 Thousands by 2028. The Japan market is estimated to grow a CAGR of 8% during (2022 - 2028). Additionally, The India market would experience a CAGR of 9.3% during (2022 - 2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Quad-Flat-No-Lead Packaging Market is Projected to reach USD 749.2 Million by 2028, at a CAGR of 8.4%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
By Moulding Method
By Terminal Pads
By Type
By Vertical
By Country
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