According to a new report, published by KBV research, The Global Quad-Flat-No-Lead Packaging Market size is expected to reach $749.2 million by 2028, rising at a market growth of 8.4% CAGR during the forecast period.
The Sawn segment is showcasing a CAGR of 9.9% during (2022 - 2028). Sawn QFN is often supported by high-volume production. It possess electrical and thermal properties that are comparable. In sawn-type packaging, the package is sawed to cut enormous volumes of packaging into smaller pieces in order to separate QFNs. In recent years, the market is rapidly moving towards the adoption of saw singulation method.
The Fully Exposed Terminal Ends segment is leading the Global Quad-Flat-No-Lead Packaging Market by Terminal Pads in 2021 thereby, achieving a market value of $321.4 Thousands by 2028. The conventional packaging used for industrial and consumer items has a terminal end that is completely visible. The ends of fully exposed terminals are visible to the edge of the packaging and may be seen from the bottom of the box. On the side of the packaging, the lead ends are visible. If the terminal end is sufficiently wet and generated up the component's side, a solder fillet can fail.
The Plastic-moulded segment has shown the growth rate of 8.5% during (2022 - 2028). A mold compound made of epoxy surrounds the chip in a QFN that has been plastic molded. The package could be molded with a lid or enclosed in a shrink tube during manufacturing. Less expensive plastic-molded QFNs are often restricted to frequencies between 2 and 3 GHz. It typically only has two parts: a plastic compound and a copper lead frame.
The Automotive segment acquired maximum revenue share in the Global Quad-Flat-No-Lead Packaging Market by Vertical in 2021 thereby, achieving a market value of $230.4 Thousands by 2028. Significant progress has been made in the automotive sector, namely in the field of car accessories. In addition, automobile technology, such as infotainment systems, steering controls' magnetic sensors, moisture sensor technology for automatic windscreen wipers, and other regularly used features by manufacturers, generates interest in inexpensive packages such as QFN. These reasons are projected to increase the automotive segment's need for quad-flat, no-lead packaging.
The Asia Pacific market dominated the Global Quad-Flat-No-Lead Packaging Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $288.6 Thousands by 2028. The Europe market is experiencing a CAGR of 7.9% during (2022 - 2028). Additionally, The North America market would display a CAGR of 7.7% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/quad-flat-no-lead-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Toshiba Corporation, Fujitsu Limited, NXP Semiconductors N.V., ASE Group (ASE Technology Holding), Amkor Technology, Inc., Microchip Technology Incorporated, Texas Instruments, Inc., JCET Group, Powertech Technology, Inc., and Tianshui Huatian Technology Co.,Ltd.
By Moulding Method
By Terminal Pads
By Type
By Vertical
By Geography
Companies Profiled
Unique Offerings 
