LAMEA Quad-Flat-No-Lead Packaging Market Size, Share & Industry Trends Analysis Report By Moulding Method (Punched and Sawn), By Terminal Pads, By Type (Air Cavity, Plastic-moulded and Others), By Vertical, By Country and Growth Forecast, 2022 - 2028
Special Offering: Industry Insights | Market Trends | Highest number of Tables | 24/7 Analyst Support
Get in-depth analysis of the COVID-19 impact on the LAMEA Quad-Flat-No-Lead Packaging Market
Market Report Description
The Latin America, Middle East and Africa Quad-Flat-No-Lead Packaging Market would witness market growth of 12.3% CAGR during the forecast period (2022-2028).
The need for live video broadcasting has recently increased. Events like riots, accidents, conflict, sports, and political meetings draw large crowds who want to see them live. This demand has compelled and tested broadcasters and internet news professionals to explore fresh approaches to provide their audiences with continuous live HD content.
With large TV production trucks, getting to the event places as soon as feasible becomes impossible. Therefore, multiple cameras are needed to record sporting events held in huge stadiums from various perspectives. The solution for these issues as forwarded by the product designers include portable handheld gadgets that transmit real-time video through cellular technology.
These gadgets can take the place of the large TV production truck and lower the risk of equipment and human life loss. To quickly reach the event place or flee, such portable device may be carried on backpacks with ease. A high-end professional camera can be connected using multiple high-speed connections, such as SDI and HDMI, owing to the use of latest generation of GPU and DSP processors.
Given the abundance of electronics manufacturing firms in nations like Brazil, Latin America is projected to be the most alluring market for QFN packages. Consumer electronics consumption has expanded due to the rising desire for high-end, advanced technology-based products and falling prices for gadgets. Additionally, the region's electronic goods consumption is supported by technical advancements like the Internet of Things (IoT) and Long-Term Evolution (LTE), which will assist the region's semiconductor market's growth over the next years. Additionally, the Latin American market would gain from the increased use of cell phones, televisions, and laptops in Brazil. As their discretionary income continues to increase, consumers in this region are spending on expensive electronics. Therefore, this element would contribute to the regional quad-flat-no-lead packaging market expanding more quickly.
The Brazil market dominated the LAMEA Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $12.4 Thousands by 2028. The Argentina market is experiencing a CAGR of 12.9% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 12% during (2022 - 2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
Free Valuable Insights: The Global Quad-Flat-No-Lead Packaging Market is Predict to reach $749.2 Million by 2028, at a CAGR of 8.4%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
Market Segments Covered in the Report:
By Moulding Method
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
- Air Cavity
- Consumer Electronics
- Computing / Networking
- Saudi Arabia
- South Africa
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings from KBV Research
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Global Quad-Flat-No-Lead Packaging Market Report 2022-2028
North America Quad-Flat-No-Lead Packaging Market Report 2022-2028
Asia Pacific Quad-Flat-No-Lead Packaging Market Report 2022-2028