LAMEA Quad-Flat-No-Lead Packaging Market

LAMEA Quad-Flat-No-Lead Packaging Market Size, Share & Industry Trends Analysis Report By Moulding Method (Punched and Sawn), By Terminal Pads, By Type (Air Cavity, Plastic-moulded and Others), By Vertical, By Country and Growth Forecast, 2022 - 2028

Report Id: KBV-14074 Publication Date: February-2023 Number of Pages: 101
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Market Report Description

The Latin America, Middle East and Africa Quad-Flat-No-Lead Packaging Market would witness market growth of 12.3% CAGR during the forecast period (2022-2028).

The need for live video broadcasting has recently increased. Events like riots, accidents, conflict, sports, and political meetings draw large crowds who want to see them live. This demand has compelled and tested broadcasters and internet news professionals to explore fresh approaches to provide their audiences with continuous live HD content.

With large TV production trucks, getting to the event places as soon as feasible becomes impossible. Therefore, multiple cameras are needed to record sporting events held in huge stadiums from various perspectives. The solution for these issues as forwarded by the product designers include portable handheld gadgets that transmit real-time video through cellular technology.

These gadgets can take the place of the large TV production truck and lower the risk of equipment and human life loss. To quickly reach the event place or flee, such portable device may be carried on backpacks with ease. A high-end professional camera can be connected using multiple high-speed connections, such as SDI and HDMI, owing to the use of latest generation of GPU and DSP processors.

Given the abundance of electronics manufacturing firms in nations like Brazil, Latin America is projected to be the most alluring market for QFN packages. Consumer electronics consumption has expanded due to the rising desire for high-end, advanced technology-based products and falling prices for gadgets. Additionally, the region's electronic goods consumption is supported by technical advancements like the Internet of Things (IoT) and Long-Term Evolution (LTE), which will assist the region's semiconductor market's growth over the next years. Additionally, the Latin American market would gain from the increased use of cell phones, televisions, and laptops in Brazil. As their discretionary income continues to increase, consumers in this region are spending on expensive electronics. Therefore, this element would contribute to the regional quad-flat-no-lead packaging market expanding more quickly.

The Brazil market dominated the LAMEA Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $12.4 Thousands by 2028. The Argentina market is experiencing a CAGR of 12.9% during (2022 - 2028). Additionally, The UAE market would display a CAGR of 12% during (2022 - 2028).

Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

Free Valuable Insights: The Global Quad-Flat-No-Lead Packaging Market is Predict to reach $749.2 Million by 2028, at a CAGR of 8.4%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.

Scope of the Study

Market Segments Covered in the Report:

By Moulding Method

  • Punched
  • Sawn

By Terminal Pads

  • Fully Exposed Terminal Ends
  • Pull-back Terminal Ends
  • Side Wettable Flank Terminal Ends

By Type

  • Air Cavity
  • Plastic-moulded
  • Others

By Vertical

  • Automotive
  • Consumer Electronics
  • Industrial
  • Computing / Networking
  • Communications

By Country

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Toshiba Corporation
  • Fujitsu Limited
  • NXP Semiconductors N.V.
  • ASE Group (ASE Technology Holding)
  • Amkor Technology, Inc.
  • Microchip Technology Incorporated
  • Texas Instruments, Inc.
  • JCET Group
  • Powertech Technology, Inc.
  • Tianshui Huatian Technology Co.,Ltd
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