LAMEA Wafer Backgrinding Tape Market

LAMEA Wafer Backgrinding Tape Market Size, Share & Industry Trends Analysis Report By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Historical Data and Growth Forecast, 2021 - 2027

Report Id: KBV-7755 Publication Date: February-2022 Number of Pages: 62
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Market Report Description

The Latin America, Middle East and Africa Wafer Backgrinding Tape Market would witness market growth of 7.7% CAGR during the forecast period (2021-2027).

Wafer backgrinding tapes completely protect the wafer surface during backgrinding while also preventing contamination from grinding fluid intrusion. The use of wafer backgrinding tapes in wafer fabrication ensures that the thickness of the wafer after backgrinding is precise. Wafer backgrinding tapes are most commonly employed in the manufacturing of semiconductor wafers comprised of silicon or glass.

There are different types of wafers available in the market. The thickest wafers, which are 100 m thick, are used for logic gates. Instead, semiconductor wafers with a thickness of 50 m are commonly used in DRAM memory. MEMS memory is approximately 30 millimetres thick. Backgrinding removes a precise quantity of material to produce the correct thickness, but also damages the wafer's surface in the process. As a result, polishing is also done for same.

In the Middle East and Africa, the availability of competent labour resources, together with significant technological advancements, will boost the growth of the wafer backgrinding tape market during the forecast period. In addition, there is a rising demand for advanced industrial electronics and high-end computing technologies across this region.

The Brazil market dominated the LAMEA Wafer Backgrinding Tape Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $3.1 million by 2027. The Argentina market would exhibit a CAGR of 8.3% during (2021 - 2027). Additionally, The UAE market is experiencing a CAGR of 7.4% during (2021 - 2027).

Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

Free Valuable Insights: The Global Wafer Backgrinding Tape Market is Predict to reach $245.8 Million by 2027, at a CAGR of 3.8%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.

Scope of the Study

Market Segments Covered in the Report:

By Type

  • Non-UV and
  • UV-Curable

By Wafer Size

  • 12-Inch
  • 8-Inch
  • 6-Inch
  • Others

By Country

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • Furukawa Electric Co., Ltd.
  • Mitsui Chemicals, Inc.
  • Lintec Corporation
  • Nitto Denko Corporation
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Co., Ltd.
  • Denka Company Limited
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