Published Date: 28-Feb-2022
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According to a new report Global Wafer Backgrinding Tape Market, published by KBV research, The Global Wafer Backgrinding Tape Market size is expected to reach $245.8 million by 2027, rising at a market growth of 3.8% CAGR during the forecast period.
The Non-UV market shows high market share in the Global Wafer Backgrinding Tape Market by Type 2020, thereby, achieving a market value of $182.1 million by 2027. The non-UV curable adhesive on the second side of the tape is applied to the UV transparent support substrate, resulting in a laminated semiconductor wafer structure made up of a semiconductor wafer, a double-sided adhesive tape, and a UV transparent support substrate.
The 8-Inch market shows highest growth rate of 3.3% during (2021 - 2027). It is because 8-inch wafer is widely utilized in automotive electronics and other similar components. Because the cost of producing an 8-inch (203 millimetres) semiconductor wafer is quite costly, it is desirable to minimize losses due to wafer fracturing as a result of being exceedingly thin.
The Asia Pacific market is the fastest growing region in the Global Wafer Backgrinding Tape Market by Region 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $110.3 million by 2027. The Europe market is expected to witness a CAGR of 3.3% during (2021 - 2027). Additionally, The North America market is expected to witness a CAGR of 3.6% during (2021 - 2027).
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.
By Wafer Size
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