Europe Wafer Backgrinding Tape Market

Europe Wafer Backgrinding Tape Market Size, Share & Industry Trends Analysis Report By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Historical Data and Growth Forecast, 2021 - 2027

Report Id: KBV-7754 Publication Date: February-2022 Number of Pages: 62
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Market Report Description

The Europe Wafer Backgrinding Tape Market would witness market growth of 3.3% CAGR during the forecast period (2021-2027).

Wafers are laminated with various types of backgrinding tapes prior to the backgrinding process to avoid surface damage during the backgrinding process and to protect against wafer surface contamination caused by grinding fluid penetration. In addition, wafer backgrinding is used extensively to reduce the size of various semiconductor components.

As a result of technology advancements and the use of smaller, more portable machines, backgrinding has become an important stage of wafer design and integration. Due to the necessity of wafer backgrinding in semiconductor manufacturing, wafer backgrinding tape is required to maintain the wafer's surface, hence fuelling market growth.

As people's disposable income rises across various nations of this region, sales of equipped wafers, chips, and ICs rise, which would create opportunities for the manufacturers to innovate their products. In addition, governments across this region are framing various strategies and campaigns that would attract more manufacturers across this region. In addition, governments across this region are framing various strategies and campaigns that would attract more manufacturers in this region to expand their business.

The Germany market dominated the Europe Wafer Backgrinding Tape Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $12.8 million by 2027. The UK market would showcase a CAGR of 2.5% during (2021 - 2027). Additionally, The France market is expected to witness a CAGR of 4% during (2021 - 2027).

Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

Free Valuable Insights: The Global Wafer Backgrinding Tape Market Size will Hit $245.8 Million by 2027, at a CAGR of 3.8%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.

Scope of the Study

Market Segments Covered in the Report:

By Type

  • Non-UV and
  • UV-Curable

By Wafer Size

  • 12-Inch
  • 8-Inch
  • 6-Inch
  • Others

By Country

  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players

List of Companies Profiled in the Report:

  • Furukawa Electric Co., Ltd.
  • Mitsui Chemicals, Inc.
  • Lintec Corporation
  • Nitto Denko Corporation
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Co., Ltd.
  • Denka Company Limited
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