Asia Pacific Wafer Backgrinding Tape Market

Asia Pacific Wafer Backgrinding Tape Market Size, Share & Industry Trends Analysis Report By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Historical Data and Growth Forecast, 2021 - 2027

Report Id: KBV-7753 Publication Date: February-2022 Number of Pages: 62
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Market Report Description

The Asia Pacific Wafer Backgrinding Tape Market would witness market growth of 3.9% CAGR during the forecast period (2021-2027).

The principal protection of the wafer against mechanical grinding pressures is Wafer BG tape. BG tape would not only cover the active circuit of the wafer, but it would also assist minimise water penetration, breaking, or cushioning absorption during the grinding process, as well as maintain uniformity after the grind, as seen by total thickness variance (TTV). Wafer breakage or adhesive contamination will occur if the adhesion strength of the BG tape is not carefully assessed.

Also, BG tapes are divided into two varieties based on their adhesive material: conventional non-ultraviolet (non-UV) tape and UV curable tape. Because SOI wafers contain inherent wafer warpage, the two different varieties were tested to see if they could aid adsorb grinding stress and avoid wafer breakage during the grinding/detaping process. Both BG tapes have a tape thickness of 124-74 125m, however the adhesive substance used is different.

Because of the growing population across this region, the demand for consumer electronics would also increase in this region. This would rise the usage of wafer backgrinding tape in consumer electronics. Along with that, the presence of major semiconductor companies is also increasing in this region. In addition, the growing number of suppliers of the semiconductor material needed to make ICs is boosting memory IC output and hence, accelerate the demand for wafer backgrinding tap across this region.

The China market dominated the Asia Pacific Wafer Backgrinding Tape Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $42 million by 2027. The Japan market is anticipated to grow a CAGR of 3.2% during (2021 - 2027). Additionally, The India market would experience a CAGR of 4.8% during (2021 - 2027).

Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Wafer Backgrinding Tape Market is Projected to reach USD 245.8 Million by 2027, at a CAGR of 3.8%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.

Scope of the Study

Market Segments Covered in the Report:

By Type

  • Non-UV and
  • UV-Curable

By Wafer Size

  • 12-Inch
  • 8-Inch
  • 6-Inch
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Furukawa Electric Co., Ltd.
  • Mitsui Chemicals, Inc.
  • Lintec Corporation
  • Nitto Denko Corporation
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Co., Ltd.
  • Denka Company Limited
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