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North America Wafer Backgrinding Tape Market Size, Share & Industry Trends Analysis Report By Type (Non-UV and UV-Curable), By Wafer Size (12-Inch, 8-Inch, 6-Inch, and Others), By Country, Historical Data and Growth Forecast, 2021 - 2027

Published Date : 28-Feb-2022

Pages: 55

Formats: PDF

The North America Wafer Backgrinding Tape Market would witness market growth of 3.6% CAGR during the forecast period (2021-2027).

Wafer backgrinding is the initial stage of semiconductor packing, which is the process of protecting one or more discrete semiconductor devices or integrated circuits (ICs). Backgrinding, also known as wafer thinning or wafer lapping, decreases the thickness of wafers to allow stacking and high-density IC packaging. Package height is also determined by wafer thickness, which is essential to make smartphones, laptops, and other electronic devices slimmer.

Wafer strength must be optimised for both fabrication and packaging to provide reliability. Grinding, on the other hand, leaves defects on the surface of the wafer, which can damage both the wafer and the individual dice cut from it. These faults may subsequently grow into active regions and break the die if subjected to heat or mechanical stress.

The growth of the U.S. wafer backgrinding tape market is fuelled by the semiconductor industry's expansion, as well as rising trends in data processing and power transfer. Because the United States is the fastest adopter of wafer backgrinding technology, consumer electronics devices, impending transportation technology such as electric and hybrid vehicles, healthcare monitoring systems, and other products are growing rapidly across this region.

The US market dominated the North America Wafer Backgrinding Tape Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $58.8 million by 2027. The Canada market is poised to grow a CAGR of 6.7% during (2021 - 2027). Additionally, The Mexico market would witness a CAGR of 6.1% during (2021 - 2027).

Based on Type, the market is segmented into Non-UV and UV-Curable. Based on Wafer Size, the market is segmented into 12-Inch, 8-Inch, 6-Inch, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

Free Valuable Insights: The Global Wafer Backgrinding Tape Market is Estimated to reach $245.8 Million by 2027, at a CAGR of 3.8%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Furukawa Electric Co., Ltd., Mitsui Chemicals, Inc., Lintec Corporation, Nitto Denko Corporation, AI Technology, Inc., AMC Co., Ltd., Force-One Applied Materials Co., Ltd., and Denka Company Limited.

Scope of the Study

Market Segments Covered in the Report:

By Type

  • Non-UV and
  • UV-Curable

By Wafer Size

  • 12-Inch
  • 8-Inch
  • 6-Inch
  • Others

By Country

  • US
  • Canada
  • Mexico
  • Rest of North America

Key Market Players

List of Companies Profiled in the Report:

  • Furukawa Electric Co., Ltd.
  • Mitsui Chemicals, Inc.
  • Lintec Corporation
  • Nitto Denko Corporation
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Co., Ltd.
  • Denka Company Limited
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Wafer Backgrinding Tape Market, by Type
1.4.2 North America Wafer Backgrinding Tape Market, by Wafer Size
1.4.3 North America Wafer Backgrinding Tape Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. North America Wafer Backgrinding Tape Market by Type
3.1 North America Non-UV Wafer Backgrinding Tape Market by Country
3.2 North America UV Curable Wafer Backgrinding Tape Market by Country

Chapter 4. North America Wafer Backgrinding Tape Market by Wafer Size
4.1 North America 12-Inch Wafer Backgrinding Tape Market by Country
4.2 North America 8-Inch Wafer Backgrinding Tape Market by Country
4.3 North America 6-Inch Wafer Backgrinding Tape Market by Country
4.4 North America Others Wafer Backgrinding Tape Market by Country

Chapter 5. North America Wafer Backgrinding Tape Market by Country
5.1 US Wafer Backgrinding Tape Market
5.1.1 US Wafer Backgrinding Tape Market by Type
5.1.2 US Wafer Backgrinding Tape Market by Wafer Size
5.2 Canada Wafer Backgrinding Tape Market
5.2.1 Canada Wafer Backgrinding Tape Market by Type
5.2.2 Canada Wafer Backgrinding Tape Market by Wafer Size
5.3 Mexico Wafer Backgrinding Tape Market
5.3.1 Mexico Wafer Backgrinding Tape Market by Type
5.3.2 Mexico Wafer Backgrinding Tape Market by Wafer Size
5.4 Rest of North America Wafer Backgrinding Tape Market
5.4.1 Rest of North America Wafer Backgrinding Tape Market by Type
5.4.2 Rest of North America Wafer Backgrinding Tape Market by Wafer Size

Chapter 6. Company Profiles
6.1 Furukawa Electric Co., Ltd.
6.1.1 Company Overview
6.1.2 Financial Analysis
6.1.3 Segmental and Regional Analysis
6.1.4 Research & Development Expense
6.2 Mitsui Chemicals, Inc.
6.2.1 Company Overview
6.2.2 Financial Analysis
6.2.3 Segmental and Regional Analysis
6.2.4 Research & Development Expense
6.2.5 Recent Strategies and developments:
6.2.5.1 Geographical Expansions:
6.3 Lintec Corporation
6.3.1 Company Overview
6.3.2 Financial Analysis
6.3.3 Regional & Segmental Analysis
6.3.4 Research & Development Expenses
6.3.5 Recent Strategies and developments:
6.3.5.1 Product Launches and Product Expansions:
6.4 Nitto Denko Corporation
6.4.1 Company Overview
6.4.2 Financial Analysis
6.4.3 Segmental and Regional Analysis
6.4.4 Research & Development Expense
6.5 AI Technology, Inc.
6.5.1 Company Overview
6.6 AMC Co., Ltd.
6.6.1 Company Overview
6.7 Force-One Applied Materials Co., Ltd.
6.7.1 Company Overview
6.8 Denka Company Limited
6.8.1 Company Overview
6.8.2 Financial Analysis
6.8.3 Regional & Segmental Analysis
6.8.4 Research and Development Expenses
TABLE 1 North America Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
TABLE 2 North America Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
TABLE 3 North America Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
TABLE 4 North America Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
TABLE 5 North America Non-UV Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 6 North America Non-UV Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 7 North America UV Curable Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 8 North America UV Curable Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 9 North America Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
TABLE 10 North America Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
TABLE 11 North America 12-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 12 North America 12-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 13 North America 8-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 14 North America 8-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 15 North America 6-Inch Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 16 North America 6-Inch Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 17 North America Others Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 18 North America Others Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 19 North America Wafer Backgrinding Tape Market by Country, 2017 - 2020, USD Million
TABLE 20 North America Wafer Backgrinding Tape Market by Country, 2021 - 2027, USD Million
TABLE 21 US Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
TABLE 22 US Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
TABLE 23 US Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
TABLE 24 US Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
TABLE 25 US Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
TABLE 26 US Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
TABLE 27 Canada Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
TABLE 28 Canada Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
TABLE 29 Canada Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
TABLE 30 Canada Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
TABLE 31 Canada Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
TABLE 32 Canada Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
TABLE 33 Mexico Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
TABLE 34 Mexico Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
TABLE 35 Mexico Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
TABLE 36 Mexico Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
TABLE 37 Mexico Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
TABLE 38 Mexico Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
TABLE 39 Rest of North America Wafer Backgrinding Tape Market, 2017 - 2020, USD Million
TABLE 40 Rest of North America Wafer Backgrinding Tape Market, 2021 - 2027, USD Million
TABLE 41 Rest of North America Wafer Backgrinding Tape Market by Type, 2017 - 2020, USD Million
TABLE 42 Rest of North America Wafer Backgrinding Tape Market by Type, 2021 - 2027, USD Million
TABLE 43 Rest of North America Wafer Backgrinding Tape Market by Wafer Size, 2017 - 2020, USD Million
TABLE 44 Rest of North America Wafer Backgrinding Tape Market by Wafer Size, 2021 - 2027, USD Million
TABLE 45 Key Information –Furukawa Electric Co., Ltd.
TABLE 46 Key Information – Mitsui Chemicals, Inc.
TABLE 47 Key information – Lintec Corporation
TABLE 48 Key Information –Nitto Denko Corporation
TABLE 49 Key information – AI TECHNOLOGY, INC.
TABLE 50 Key information – AMC Co., Ltd.
TABLE 51 Key information – FORCE-ONE APPLIED MATERIALS CO., LTD.
TABLE 52 Key information – DENKA COMPANY LIMITED

List of Figures
FIG 1 Methodology for the research

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