The North America Silicon on Insulator (SOI) Market would witness market growth of 16.2% CAGR during the forecast period (2022-2028).
SOI substrate can co-exist with most of the conventional fabrication processes, if seen from a manufacturer’s perspective. Generally, an SOI-based process can be implemented without any special equipment or any prominent retooling of an existing factory.
An SOI MOSFET is a metal oxide semiconductor field effect transistor (MOSFET) device in which a germanium or silicon semiconductor layer is created on an insulator layer which may be a buried oxide (BOX) layer created in a semiconductor substrate. SOI MOSFET devices have been modified for the computer industry’s application. The buried oxide layer can be utilized in the SRAM designs.
The SOI devices are of two types; FDSOI (fully depleted SOI) MOSFETs and PDSOI (partially depleted SOI). For PDSOI MOSFET that are n-type the sandwiched n-type film between the gate oxide (GOX) and buried oxide (BOX) is large, that’s why the depletion region can’t cover the complete region. PDSOI acts like bulk MOSFET to some extent.
In United States, the silicon on insulator (SOI)-based technology will be used to develop high-priority electronic components which will be aimed to enhance the reliability of the high-temperature electronic components that are used in the downhole “smart drilling” tools, to improve their drilling efficiency and success rate at 20,000 feet depths and below where temperatures are more than 225C.
The US market dominated the North America Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $698.9 million by 2028. The Canada market is poised to grow at a CAGR of 18.8% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 17.8% during (2022 - 2028).
Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Global Silicon on Insulator (SOI) Market is Estimated to reach $3.5 Billion by 2028, at a CAGR of 16.7%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
By Wafer Size
By Wafer Type
By Application
By Technology
By Product
By Country
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