According to a new report, published by KBV research, The Global Silicon on Insulator (SOI) Market size is expected to reach $3.5 billion by 2028, rising at a market growth of 16.7% CAGR during the forecast period.
The 200 mm & less than 200 mm segment is showcasing a CAGR of 16.1% during (2022 - 2028). The 200 mm wafers have been around for an extended period, and many chipmakers operate with them. 200 mm wafers manufacture devices using established process technologies ranging from 6nm to 110 nm nodes. Chips created under the 200 mm wafers are used in every significant electronic product, for instance, display ICs, microcontrollers (MCUs), radio frequency, and power management ICs (PMICs).
The RF SOI segment acquired maximum revenue share in the Global Silicon on Insulator (SOI) Market by Wafer Type in 2021 thereby, achieving a market value of $1.1 billion by 2028. This is because of the wide implementation of RF-SOI in the SOI technology. Many companies are developing advanced RF-SOI platforms, which include power amplifiers, RF switches, phased array antennas, and low-noise amplifiers for advanced 4G LTE. The key players are concentrating on enhancing the performance of their power amplifiers and switching to meet specifications with the help of an optimized RF-SOI technology, boosting the market segment’s growth.
The Automotive segment has shown the growth rate of 17% during (2022 - 2028). Because of the prominent automotive manufacturers' rising investments in driverless automobile technologies like the Advanced Driver Assistance System (ADAS). Also, cars with SOI require low power, provide high speed, and utilize compact electronic devices for their operations. As a result, the demand for SOI-based wafers will also rise, and with such developments, the segment's growth is anticipated in the projected period.
The Smart Cut segment is leading the Global Silicon on Insulator (SOI) Market by Technology in 2021 thereby, achieving a market value of $1.8 billion by 2028. The segment’s growth is result of the technological enhancement. This method joins the flexibility of Bonded and Etched-Back Silicon-On-Insulator (BESOI) with the repeatability of separation by implantation of oxygen (SIMOX), enabling different oxide film thicknesses. At the same time, maintain a high uniformity across other wafers. Furthermore, unlike the BESOI, the bonded wafer can be recycled, making this method more cost-effective.
The MEMS Devices segment is exhibiting a CAGR of 16.9% during (2022 - 2028). This is due to the increasing use of SOI wafers in MEMS devices for industrial applications, consumer electronics, and automotive, which is why the segment is observing growth in the projected period. Also, the presence of key players providing MEMS based on SOI wafers and their constant development will further boost the demand thus leading to market expansion.
The Asia Pacific market dominated the Global Silicon on Insulator (SOI) Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1.3 billion by 2028. The Europe market is exhibiting a CAGR of 16% during (2022 - 2028). Additionally, The North America market would display a CAGR of 16.2% during (2022 - 2028).
Full Report: https://www.kbvresearch.com/silicon-on-insulator-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
By Wafer Size
By Wafer Type
By Application
By Technology
By Product
By Geography
Companies Profiled
Unique Offerings 
