Asia Pacific Silicon on Insulator (SOI) Market

Asia Pacific Silicon on Insulator (SOI) Market Size, Share & Industry Trends Analysis Report By Wafer Size, By Wafer Type, By Application, By Technology (Smart Cut, Bonding SOI and Layer Transfer SOI), By Product, By Country and Growth Forecast, 2022 - 2028

Report Id: KBV-13047 Publication Date: December-2022 Number of Pages: 129
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Market Report Description

The Asia Pacific Silicon on Insulator (SOI) Market would witness market growth of 17.1% CAGR during the forecast period (2022-2028).

Silicon on Insulator (SOI) is a semiconductor wafer technology that creates lower power (dynamics) and higher performing devices than the devices made from traditional bulk silicon techniques. SOI operates by placing a thin, insulating layer, for instance, a silicon oxide, between a thin silicon layer and a silicon substrate. This process helps decrease the junction capacitance, which allows higher speed and lower power consumption.

As a result, SOI chips use 20 percent less power and are up to 15 percent faster when compared to chips based on present-day bulk complementary metal oxide semiconductors (CMOS). In the mixed signal applications and radio frequency (RF) field, SOI provides the benefit of high-quality passives and low noise.

The incorporation of silicide layers like WSi2 enables the SOI to be customized, forming a Ground Plane Silicon on Insulator (GPSOI), further enhancing cross-talk reduction. Keeping a silicide layer between the buried oxide and the top silicon device layer changes the SOI into Silicon on Silicide on Insulator (SSOI). This technique is concentrated primarily at the bipolar transistor with the inclusion of the silicide layer minimizing the resistance of the collector series.

China stands among the top sellers and producers of consumer electronics globally because of the country’s enhanced brand-building and innovation capacity. China is an essential manufacturer of consumer electronic products, attracting the world’s major electronic producers to establish research, development, and manufacturing base. The Ministry will increase the cultivation of pillar and pioneer industries in the sector and promote the development of the virtual reality industry and new-generation audio-visual technology.

The China market dominated the Asia Pacific Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $386.2 million by 2028. The Japan market is estimated to grow a CAGR of 16.4% during (2022 - 2028). Additionally, The India market would experience a CAGR of 18% during (2022 - 2028).

Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Silicon on Insulator (SOI) Market is Projected to reach USD 3.5 Billion by 2028, at a CAGR of 16.7%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Wafer Size

  • 300 mm
  • 200 mm & less than 200 mm

By Wafer Type

  • RF SOI
  • FD SOI
  • Emerging SOI
  • PD SOI

By Application

  • Consumer Electronics
  • Automotive
  • Datacom & Telecom
  • Industrial
  • Military, Defense & Aerospace

By Technology

  • Smart Cut
  • Bonding SOI
  • Layer Transfer SOI

By Product

  • RF FEM Products
  • Power Products
  • MEMS Devices
  • Optical Communication
  • Image Sensing
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Soitec
  • Shin-Etsu Chemical Co., Ltd.
  • GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
  • SUMCO Corporation
  • STMicroelectronics N.V.
  • NXP Semiconductors N.V.
  • Murata Manufacturing Co., Ltd.
  • Skyworks Solutions, Inc.
  • Qorvo, Inc.
  • Sony Corporation
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