The North America Quad-Flat-No-Lead Packaging Market would witness market growth of 7.7% CAGR during the forecast period (2022-2028).
The rapidly growing IC packaging solution currently available is quad-flat no-lead packaging technology. The versatile form factor of QFN packaging lets the technology service all markets while meeting unique dimensions and application requirements. The QFN packaging option is employed in a variety of markets to overcome space and functionality issues. MLF is becoming popular and versatile in microelectromechanical and sensor systems applications.
The automobile sector continues to rely on QFN technology for improvements in the adoption of vehicle electronics. Automatic windscreen wiper systems, battery control management systems, and sophisticated moisture-sensing systems are examples of QFN applications. Usually, IC packaging marks the final phase in the fabrication of semiconductor devices. During this crucial stage, the block of the semiconductor is encased in a packaging that shields the integrated circuit from potentially harmful external factors and the destructive effects of time.
The package is an enclosure created to safeguard the block and stimulate the electrical connections that transmit signals to an electronic device's circuit board. Lead frame IC packages are the most prevalent variety. This packaging would be used for wire-bonded linked dies with gold or silver plating. Manufacturers commonly employ copper lead-frame materials for surface-mount plastic containers. Copper is very conductive and highly malleable. Hence it can be advantageous for this application.
The four industries strategically significant to the United States are semiconductors, photovoltaic products, advanced batteries, and pharmaceuticals. All electronic devices require integrated circuits, which are the essential building blocks. These advancements in information technology have greatly increased production in all local businesses. Technology developments in the defense industry depend on American dominance in semiconductors. The fundamental component of solar energy, photovoltaic cells are also a key renewable energy source that can advance American national objectives by reducing reliance on foreign oil and greenhouse gas emissions. These elements significantly impact the regional quad-flat-no-lead market's explosive expansion.
The US market dominated the North America Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $155.5 Thousands by 2028. The Canada market is poised to grow at a CAGR of 10.1% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 9.2% during (2022 - 2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Global Quad-Flat-No-Lead Packaging Market is Estimated to reach $749.2 Million by 2028, at a CAGR of 8.4%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
Market Segments Covered in the Report:
By Moulding Method
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 North America Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 North America Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 North America Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 North America Quad-Flat-No-Lead Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. North America Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 North America Punched Market by Country
3.2 North America Sawn Market by Country
Chapter 4. North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 North America Fully Exposed Terminal Ends Market by Country
4.2 North America Pull-back Terminal Ends Market by Country
4.3 North America Side Wettable Flank Terminal Ends Market by Country
Chapter 5. North America Quad-Flat-No-Lead Packaging Market by Type
5.1 North America Air Cavity Market by Country
5.2 North America Plastic-moulded Market by Country
5.3 North America Others Market by Country
Chapter 6. North America Quad-Flat-No-Lead Packaging Market by Vertical
6.1 North America Automotive Market by Country
6.2 North America Consumer Electronics Market by Country
6.3 North America Industrial Market by Country
6.4 North America Computing / Networking Market by Country
6.5 North America Communications Market by Country
Chapter 7. North America Quad-Flat-No-Lead Packaging Market by Country
7.1 US Quad-Flat-No-Lead Packaging Market
7.1.1 US Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.2 US Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.3 US Quad-Flat-No-Lead Packaging Market by Type
7.1.4 US Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Canada Quad-Flat-No-Lead Packaging Market
7.2.1 Canada Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.2 Canada Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.3 Canada Quad-Flat-No-Lead Packaging Market by Type
7.2.4 Canada Quad-Flat-No-Lead Packaging Market by Vertical
7.3 Mexico Quad-Flat-No-Lead Packaging Market
7.3.1 Mexico Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.2 Mexico Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.3 Mexico Quad-Flat-No-Lead Packaging Market by Type
7.3.4 Mexico Quad-Flat-No-Lead Packaging Market by Vertical
7.4 Rest of North America Quad-Flat-No-Lead Packaging Market
7.4.1 Rest of North America Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.2 Rest of North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.3 Rest of North America Quad-Flat-No-Lead Packaging Market by Type
7.4.4 Rest of North America Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview
TABLE 1 North America Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 2 North America Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 3 North America Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 4 North America Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 5 North America Punched Market by Country, 2018 - 2021, USD Thousands
TABLE 6 North America Punched Market by Country, 2022 - 2028, USD Thousands
TABLE 7 North America Sawn Market by Country, 2018 - 2021, USD Thousands
TABLE 8 North America Sawn Market by Country, 2022 - 2028, USD Thousands
TABLE 9 North America Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 10 North America Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 11 North America Fully Exposed Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 12 North America Fully Exposed Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 13 North America Pull-back Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 14 North America Pull-back Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 15 North America Side Wettable Flank Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 16 North America Side Wettable Flank Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 17 North America Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 18 North America Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 19 North America Air Cavity Market by Country, 2018 - 2021, USD Thousands
TABLE 20 North America Air Cavity Market by Country, 2022 - 2028, USD Thousands
TABLE 21 North America Plastic-moulded Market by Country, 2018 - 2021, USD Thousands
TABLE 22 North America Plastic-moulded Market by Country, 2022 - 2028, USD Thousands
TABLE 23 North America Others Market by Country, 2018 - 2021, USD Thousands
TABLE 24 North America Others Market by Country, 2022 - 2028, USD Thousands
TABLE 25 North America Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 26 North America Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 27 North America Automotive Market by Country, 2018 - 2021, USD Thousands
TABLE 28 North America Automotive Market by Country, 2022 - 2028, USD Thousands
TABLE 29 North America Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
TABLE 30 North America Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
TABLE 31 North America Industrial Market by Country, 2018 - 2021, USD Thousands
TABLE 32 North America Industrial Market by Country, 2022 - 2028, USD Thousands
TABLE 33 North America Computing / Networking Market by Country, 2018 - 2021, USD Thousands
TABLE 34 North America Computing / Networking Market by Country, 2022 - 2028, USD Thousands
TABLE 35 North America Communications Market by Country, 2018 - 2021, USD Thousands
TABLE 36 North America Communications Market by Country, 2022 - 2028, USD Thousands
TABLE 37 North America Quad-Flat-No-Lead Packaging Market by Country, 2018 - 2021, USD Thousands
TABLE 38 North America Quad-Flat-No-Lead Packaging Market by Country, 2022 - 2028, USD Thousands
TABLE 39 US Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 40 US Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 41 US Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 42 US Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 43 US Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 44 US Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 45 US Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 46 US Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 47 US Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 48 US Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 49 Canada Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 50 Canada Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 51 Canada Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 52 Canada Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 53 Canada Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 54 Canada Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 55 Canada Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 56 Canada Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 57 Canada Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 58 Canada Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 59 Mexico Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 60 Mexico Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 61 Mexico Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 62 Mexico Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 63 Mexico Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 64 Mexico Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 65 Mexico Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 66 Mexico Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 67 Mexico Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 68 Mexico Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 69 Rest of North America Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 70 Rest of North America Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 71 Rest of North America Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 72 Rest of North America Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 73 Rest of North America Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 74 Rest of North America Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 75 Rest of North America Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 76 Rest of North America Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 77 Rest of North America Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 78 Rest of North America Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 79 Key Information – Toshiba Corporation
TABLE 80 Key Information – Fujitsu Limited
TABLE 81 Key Information – NXP Semiconductors N.V.
TABLE 82 Key Information – ASE Group
TABLE 83 Key Information – Amkor Technology, Inc.
TABLE 84 Key Information – Microchip Technology Incorporated
TABLE 85 Key Information – Texas Instruments, Inc.
TABLE 86 Key Information – JCET Group
TABLE 87 Key Information – Powertech Technology Inc.
TABLE 88 Key Information – Tianshui Huatian Technology Co.,Ltd
List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Toshiba Corporation
FIG 3 SWOT Analysis: Fujitsu Limited
FIG 4 Swot analysis: NXP semiconductors N.V.