North America Power over Ethernet Chipsets Market Analysis (2018-2024)
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The North America Power over Ethernet Chipsets Market would witness market growth of 9.6% CAGR during the forecast period (2018-2024). The market is expected to witness significant growth during the forecast period, and it is due to growing use of Internet Protocol (IP) technologies and rapidly growing trend of transmitting data and power via a single cable to distant areas, using PoE switches and PoE injectors. Use of PoE with LED lighting supports various applications of the Internet of Things (IoT) and smart buildings. PoE LED lighting is relatively a new technology; therefore, the adoption of the same in the commercial setup is very limited. Nonetheless, with competitive cost propositions over other lighting technologies, the PoE lighting would witness rapid market adoption, and as a result, driving the growth of the market.
Based on the type, the Power over Ethernet Chipsets market is segmented into PoE Power Sourcing Equipment Chipset and PoE Powered Devices Chipset. Based on the device type, the market is segmented into VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector and Others. The Applications highlighted in this report include Connectivity, LED Lighting, Infotainment, Security, and Others. Based on Deployment Type, the market is segmented into Cloud based and On-Premise. The end users covered under the report include Commercial and Industrial & Residential. The commercial segment is further segmented into Office Buildings & Small Offices, Hospitality, Retail and Healthcare. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America. The market research report covers the analysis of key stake holders of the market.
Key companies profiled in the report include STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments incorporated, Robert Bosch GmbH, NXP Semiconductor N.V., Microsemi Corporation, and Honeywell International, Inc.