LAMEA Power over Ethernet Chipsets Market Analysis (2018-2024)
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The Latin America, Middle East and Africa Power over Ethernet Chipsets Market would witness market growth of 13% CAGR during the forecast period (2018-2024). The adoption of PoE would change the landscape for mass adoption of small screen signage in a retail shelf, as well as in the hospitality applications. With the aforementioned advantages, Power over Ethernet could almost nullify the costly electrical construction when using smaller-sized display screens. The rapid growth of the IoT is driving the demand for PoE+ connectivity in IP cameras, smart lighting luminaires, feature-rich video IP phones, advanced 802.11 wireless access points and smart home appliances. All these powerful applications need higher wattage, as a result, driving the demand for PD devices which support the PoE+ standard.
Based on the type, the Power over Ethernet Chipsets market is segmented into PoE Power Sourcing Equipment Chipset and PoE Powered Devices Chipset. Based on the device type, the market is segmented into VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector and Others. The Applications highlighted in this report include Connectivity, LED Lighting, Infotainment, Security, and Others. Based on Deployment Type, the market is segmented into Cloud based and On-Premise. The end users covered under the report include Commercial and Industrial & Residential. The commercial segment is further segmented into Office Buildings & Small Offices, Hospitality, Retail and Healthcare. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments incorporated, Robert Bosch GmbH, NXP Semiconductor N.V., Microsemi Corporation, and Honeywell International, Inc.