Asia Pacific Power over Ethernet Chipsets Market By Type (PoE Power Sourcing Equipment Chipset, PoE Powered Devices Chipset), Device Type (VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector), Application (Connectivity, LED Lighting, Infotainment, Security), End User (Enterprise - Office Buildings & Small Offices, Hospitality, Retail, Healthcare; Individual)
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The Asia Pacific Power over Ethernet Chipsets Market would witness market growth of 11.6% CAGR during the forecast period (2018 - 2024). Increasing deployment of proximity sensors, cameras, and RFID readers for network security purposes within residential applications would drive the demand for PoE chipsets. Spiraling applications of IP cameras in VoIP, security systems, and webcams would contribute to the market growth.
Surging demand for PoE-based products in office buildings, especially for security & access control, along with connectivity applications, would have a positive influence on the overall market growth. Based on the type, the Power over Ethernet Chipsets market is segmented into PoE Power Sourcing Equipment Chipset and PoE Powered Devices Chipset.
Based on the device type, the market is segmented into VoIP Phone, Wireless Radio Access Point, Proximity Sensor, Network Cameras, Ethernet Switch & Injector and Others. The Applications highlighted in this report include Connectivity, LED Lighting, Infotainment, Security, and Others. Based on Deployment Type, the market is segmented into Cloud-based and On-Premise. The end users covered under the report include Commercial and Industrial & Residential. The commercial segment is further segmented into Office Buildings & Small Offices, Hospitality, Retail and Healthcare.
Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include STMicroelectronics N.V., Silicon Laboratories, Inc., On Semiconductor, Maxim Integrated Products, Inc., Microchip Technology Incorporated, Texas Instruments Incorporated, Robert Bosch GmbH, NXP Semiconductor N.V., Microsemi Corporation, and Honeywell International, Inc.