Asia Pacific Quad-Flat-No-Lead Packaging Market Size, Share & Industry Trends Analysis Report By Moulding Method (Punched and Sawn), By Terminal Pads, By Type (Air Cavity, Plastic-moulded and Others), By Vertical, By Country and Growth Forecast, 2022 - 2028

The Asia Pacific Quad-Flat-No-Lead Packaging Market would witness market growth of 8.7% CAGR during the forecast period (2022-2028).

Consumers who want to stay connected in the digital environment require smaller, lighter items as international mobility increases. Consumer electronics manufacturers are attempting to make their products smaller to meet this demand. Smaller, thinner, and more insulated containers enable the miniaturization of items.

Multiple studies have shown that QFN packages surpass dual in-line surface-mount technology (SMT) packages in terms of thermal performance. Compared to typical leaded packages, QFN packages have no external leads, a short board routing area, low inductance, and low capacitance. To achieve product simplification, organizations have chosen QFN packaging as one of the strategies for electronic component manufacturing.

The Asia-Pacific region has a disproportionately high concentration of semiconductor manufacturers and is a major user of the QFN packaging technology. Several government initiatives are also being launched to expand the industry for semiconductor manufacturing technology. For instance, the governments of Asian countries with developing economies are committed to securing FDI for their national economies' growth. The government authorities set up some FDI attraction strategies to achieve this. These significant investments support various businesses, including the semiconductor industry, while enabling the development of new products and services. Therefore, this element would contribute to the regional quad-flat-no-lead packaging market expanding more quickly.

The China market dominated the Asia Pacific Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $82.3 Thousands by 2028. The Japan market is estimated to grow a CAGR of 8% during (2022 - 2028). Additionally, The India market would experience a CAGR of 9.3% during (2022 - 2028).

Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Quad-Flat-No-Lead Packaging Market is Projected to reach USD 749.2 Million by 2028, at a CAGR of 8.4%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.

Scope of the Study

Market Segments Covered in the Report:

By Moulding Method

• Punched
• Sawn

By Terminal Pads

• Fully Exposed Terminal Ends
• Pull-back Terminal Ends
• Side Wettable Flank Terminal Ends

By Type

• Air Cavity
• Plastic-moulded
• Others

By Vertical

• Automotive
• Consumer Electronics
• Industrial
• Computing / Networking
• Communications

By Country

• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

• Toshiba Corporation
• Fujitsu Limited
• NXP Semiconductors N.V.
• ASE Group (ASE Technology Holding)
• Amkor Technology, Inc.
• Microchip Technology Incorporated
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• Tianshui Huatian Technology Co.,Ltd

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 Asia Pacific Punched Market by Country
3.2 Asia Pacific Sawn Market by Country

Chapter 4. Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 Asia Pacific Fully Exposed Terminal Ends Market by Country
4.2 Asia Pacific Pull-back Terminal Ends Market by Country
4.3 Asia Pacific Side Wettable Flank Terminal Ends Market by Country

Chapter 5. Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
5.1 Asia Pacific Air Cavity Market by Country
5.2 Asia Pacific Plastic-moulded Market by Country
5.3 Asia Pacific Others Market by Country

Chapter 6. Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical
6.1 Asia Pacific Automotive Market by Country
6.2 Asia Pacific Consumer Electronics Market by Country
6.3 Asia Pacific Industrial Market by Country
6.4 Asia Pacific Computing / Networking Market by Country
6.5 Asia Pacific Communications Market by Country

Chapter 7. Asia Pacific Quad-Flat-No-Lead Packaging Market by Country
7.1 China Quad-Flat-No-Lead Packaging Market
7.1.1 China Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.2 China Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.3 China Quad-Flat-No-Lead Packaging Market by Type
7.1.4 China Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Japan Quad-Flat-No-Lead Packaging Market
7.2.1 Japan Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.2 Japan Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.3 Japan Quad-Flat-No-Lead Packaging Market by Type
7.2.4 Japan Quad-Flat-No-Lead Packaging Market by Vertical
7.3 India Quad-Flat-No-Lead Packaging Market
7.3.1 India Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.2 India Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.3 India Quad-Flat-No-Lead Packaging Market by Type
7.3.4 India Quad-Flat-No-Lead Packaging Market by Vertical
7.4 South Korea Quad-Flat-No-Lead Packaging Market
7.4.1 South Korea Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.2 South Korea Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.3 South Korea Quad-Flat-No-Lead Packaging Market by Type
7.4.4 South Korea Quad-Flat-No-Lead Packaging Market by Vertical
7.5 Singapore Quad-Flat-No-Lead Packaging Market
7.5.1 Singapore Quad-Flat-No-Lead Packaging Market by Moulding Method
7.5.2 Singapore Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.5.3 Singapore Quad-Flat-No-Lead Packaging Market by Type
7.5.4 Singapore Quad-Flat-No-Lead Packaging Market by Vertical
7.6 Malaysia Quad-Flat-No-Lead Packaging Market
7.6.1 Malaysia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.6.2 Malaysia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.6.3 Malaysia Quad-Flat-No-Lead Packaging Market by Type
7.6.4 Malaysia Quad-Flat-No-Lead Packaging Market by Vertical
7.7 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market
7.7.1 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
7.7.2 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.7.3 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
7.7.4 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical

Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview

TABLE 1 Asia Pacific Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 2 Asia Pacific Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 3 Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 4 Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 5 Asia Pacific Punched Market by Country, 2018 - 2021, USD Thousands
TABLE 6 Asia Pacific Punched Market by Country, 2022 - 2028, USD Thousands
TABLE 7 Asia Pacific Sawn Market by Country, 2018 - 2021, USD Thousands
TABLE 8 Asia Pacific Sawn Market by Country, 2022 - 2028, USD Thousands
TABLE 9 Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 10 Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 11 Asia Pacific Fully Exposed Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 12 Asia Pacific Fully Exposed Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 13 Asia Pacific Pull-back Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 14 Asia Pacific Pull-back Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 15 Asia Pacific Side Wettable Flank Terminal Ends Market by Country, 2018 - 2021, USD Thousands
TABLE 16 Asia Pacific Side Wettable Flank Terminal Ends Market by Country, 2022 - 2028, USD Thousands
TABLE 17 Asia Pacific Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 18 Asia Pacific Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 19 Asia Pacific Air Cavity Market by Country, 2018 - 2021, USD Thousands
TABLE 20 Asia Pacific Air Cavity Market by Country, 2022 - 2028, USD Thousands
TABLE 21 Asia Pacific Plastic-moulded Market by Country, 2018 - 2021, USD Thousands
TABLE 22 Asia Pacific Plastic-moulded Market by Country, 2022 - 2028, USD Thousands
TABLE 23 Asia Pacific Others Market by Country, 2018 - 2021, USD Thousands
TABLE 24 Asia Pacific Others Market by Country, 2022 - 2028, USD Thousands
TABLE 25 Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 26 Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 27 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Thousands
TABLE 28 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Thousands
TABLE 29 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
TABLE 30 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
TABLE 31 Asia Pacific Industrial Market by Country, 2018 - 2021, USD Thousands
TABLE 32 Asia Pacific Industrial Market by Country, 2022 - 2028, USD Thousands
TABLE 33 Asia Pacific Computing / Networking Market by Country, 2018 - 2021, USD Thousands
TABLE 34 Asia Pacific Computing / Networking Market by Country, 2022 - 2028, USD Thousands
TABLE 35 Asia Pacific Communications Market by Country, 2018 - 2021, USD Thousands
TABLE 36 Asia Pacific Communications Market by Country, 2022 - 2028, USD Thousands
TABLE 37 Asia Pacific Quad-Flat-No-Lead Packaging Market by Country, 2018 - 2021, USD Thousands
TABLE 38 Asia Pacific Quad-Flat-No-Lead Packaging Market by Country, 2022 - 2028, USD Thousands
TABLE 39 China Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 40 China Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 41 China Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 42 China Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 43 China Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 44 China Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 45 China Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 46 China Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 47 China Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 48 China Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 49 Japan Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 50 Japan Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 51 Japan Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 52 Japan Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 53 Japan Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 54 Japan Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 55 Japan Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 56 Japan Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 57 Japan Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 58 Japan Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 59 India Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 60 India Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 61 India Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 62 India Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 63 India Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 64 India Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 65 India Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 66 India Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 67 India Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 68 India Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 69 South Korea Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 70 South Korea Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 71 South Korea Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 72 South Korea Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 73 South Korea Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 74 South Korea Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 75 South Korea Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 76 South Korea Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 77 South Korea Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 78 South Korea Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 79 Singapore Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 80 Singapore Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 81 Singapore Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 82 Singapore Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 83 Singapore Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 84 Singapore Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 85 Singapore Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 86 Singapore Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 87 Singapore Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 88 Singapore Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 89 Malaysia Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 90 Malaysia Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 91 Malaysia Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 92 Malaysia Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 93 Malaysia Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 94 Malaysia Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 95 Malaysia Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 96 Malaysia Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 97 Malaysia Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 98 Malaysia Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 99 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market, 2018 - 2021, USD Thousands
TABLE 100 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market, 2022 - 2028, USD Thousands
TABLE 101 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method, 2018 - 2021, USD Thousands
TABLE 102 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method, 2022 - 2028, USD Thousands
TABLE 103 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2018 - 2021, USD Thousands
TABLE 104 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads, 2022 - 2028, USD Thousands
TABLE 105 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Type, 2018 - 2021, USD Thousands
TABLE 106 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Type, 2022 - 2028, USD Thousands
TABLE 107 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical, 2018 - 2021, USD Thousands
TABLE 108 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical, 2022 - 2028, USD Thousands
TABLE 109 Key Information – Toshiba Corporation
TABLE 110 Key Information – Fujitsu Limited
TABLE 111 Key Information – NXP Semiconductors N.V.
TABLE 112 Key Information – ASE Group
TABLE 113 Key Information – Amkor Technology, Inc.
TABLE 114 Key Information – Microchip Technology Incorporated
TABLE 115 Key Information – Texas Instruments, Inc.
TABLE 116 Key Information – JCET Group
TABLE 117 Key Information – Powertech Technology Inc.
TABLE 118 Key Information – Tianshui Huatian Technology Co.,Ltd

List of Figures
FIG 1 Methodology for the research
FIG 2 SWOT Analysis: Toshiba Corporation
FIG 3 SWOT Analysis: Fujitsu Limited
FIG 4 Swot analysis: NXP semiconductors N.V.