According to a new report, published by KBV research, The Global Semiconductor Bonding Market size is expected to reach $1.1 billion by 2030, rising at a market growth of 3.6% CAGR during the forecast period.
The LED segment is leading the Global Semiconductor Bonding Market by Application in 2022; thereby, achieving a market value of $411.7 million by 2030. In the past five years, the widespread use of LED in sectors such as consumer electronics, automobile, commercial and residential has led to a significant increase in LED usage. Numerous advantages of LED lights, including their extended lifespan, low heat emission, and energy efficiency, have pushed their use in commercial and industrial lighting. Utilizing thin wafers in LED lighting and equipment increases energy efficiency and reduces power consumption. Consequently, the LED segment is anticipated to dominate during the forecast period.
The Die Bonder segment is exhibiting a CAGR of 4% during (2023 - 2030). Die bonding is a semiconductor wrapping production procedure. Die attachment is attaching a die (or chip) to a material or package using adhesive or a sinter. It is also known as die placement. Selecting a die from a waffle container and positioning it on the material is the initial step in the process. The die is inserted into a previously applied epoxy. The increasing adoption of this bonding type is the primary factor propelling the growth of the market.
The Die Bonding Technology segment acquired maximum revenue share in the Global Semiconductor Bonding Market by Bonding Technology in 2022; thereby, achieving a market value of $708.2 million by 2030. One of the main elements anticipated to fuel future demand for the die-bonding technology is the increase in demand for semiconductor integrated circuits. A healthy demand for integrated circuits (ICs) will result from growing electronic system adoption due to increased end-use applications.
The Die To Wafer Bonding segment is experiencing a CAGR of 4.6% during (2023 - 2030). Its demonstrated success in CMOS image sensors and other memory & logic systems is responsible for the expansion of the segment. The segment will grow further because of the rising use of die-to-wafer bonding during the heterogeneous integration phase.
The North America region dominated the Global Semiconductor Bonding Market by Region in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $308.2 million by 2030. The Europe region is estimated to witness a CAGR of 3.4% during (2023 - 2030). Additionally, The Asia Pacific region would register a CAGR of 3.8% during (2023 - 2030).
Full Report: https://www.kbvresearch.com/semiconductor-bonding-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country-wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
By Application
By Type
By Bonding Technology
By Process Type
By Geography
Companies Profiled
Unique Offerings 
