North America Embedded Die Packaging Technology Market Size, Share & Industry Trends Analysis Report By Vertical, By Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board), By Country and Growth Forecast, 2022 - 2028
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Market Report Description
The North America Embedded Die Packaging Technology Market would witness market growth of 17.9% CAGR during the forecast period (2022-2028).
The advantages of embedded die packaging technology include enhanced electrical and thermal performance, heterogeneous integration, simplified OEM logistics, and potential cost savings. In addition, laminate substrates often have embedded passive components. As a result, switching noise in high-speed digital packages has been reduced.
In the semiconductor business, embedded die packaging technology has improved technology, boosted yield, and raised the need for heterogeneous integration. As a result, the market need for embedded die packaging technology is anticipated to rise.
Additionally, customer desire for greater mobility, utility, and usability has fueled the rise of the electronics business for goods like portable handsets, tablets, and networking equipment. As a result, the need for functional convergence and integration of integrated circuit devices has increased, necessitating sophisticated packaging strategies. As a result, manufacturers can now apply integrated die packaging technology.
One of the key nations promoting market expansion in the region is the US, further followed by Canada. The significant demand for cutting-edge convertible & detachable dual-screen laptops for business applications is blamed for the development. The e-commerce industry is expected to continue generating large revenues in the future. In addition, the availability of product knowledge, choice, and generally lower prices offered by online shopping are anticipated to draw customers to purchase consumer electronics through online platforms. This expanding demand for consumer electronics is further anticipated to support the regional market growth for embedded die packaging die technology.
The US market dominated the North America Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $43,807.2 Thousands by 2028.The Canada market is poised to grow at a CAGR of 20.6% during (2022 - 2028). Additionally, The Mexico market would witness a CAGR of 19.5% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Global Embedded Die Packaging Technology Market is Estimated to reach $214.1 Million by 2028, at a CAGR of 18.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
Scope of the Study
Market Segments Covered in the Report:
- Consumer Electronics
- IT & Telecommunication
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- General Electric (GE) Co.
- Infineon Technologies AG
- TDK Corporation
- Fujikura Ltd.
- Amkor Technology, Inc.
- Taiwan Semiconductor Manufacturing Company Limited
- ASE Group (ASE Technology Holding)
- Microsemi Corporation (Microchip Technology)
- Schweizer Electronic AG (Wus Printed Circuit)
- AT&S Group
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