The Asia Pacific Embedded Die Packaging Technology Market would witness market growth of 18.9% CAGR during the forecast period (2022-2028).
Embedded die packaging has excellent electrical performance at high frequencies, making it a potential method for developing microwave applications. The need for compact electrical circuitry is growing as electronic gadgets become smaller to make them more accessible for people to operate.
This desire is satisfied by embedded die packaging technology, which has benefits including excellent reliability, higher signal density, smaller size, signal inductance, and power inductance, as well as increased functionality and efficiency of the electronic circuit. In addition, with embedded die packaging, unlike previous approaches, the die is embedded and takes up no space on the chip.
The need for disruptive technologies such as IOT in the area would be driven by the need for smart building and space solutions in highly populated regions. Therefore, much money is being invested in the internet of things solutions by the rapidly rising economies of China, Japan, South Korea, Singapore, and India. Additionally, to enhance safety and quality of life, the regulatory organizations of these nations are working very hard to build smart city initiatives. The government of Singapore released a Smart Nation Plan in 2017 to develop into a global digital center. The government is attempting to use IoT technology to enhance city living. These components are anticipated to provide growth opportunities for embedded die packaging technology in the local market.
The China market dominated the Asia Pacific Embedded Die Packaging Technology Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $27,074.5 Thousands by 2028.The Japan market is estimated to grow a CAGR of 18.2% during (2022 - 2028). Additionally, The India market would experience a CAGR of 19.7% during (2022 - 2028).
Based on Vertical, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Healthcare and Others. Based on Platform, the market is segmented into Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Embedded Die Packaging Technology Market is Projected to reach USD 214.1 Million by 2028, at a CAGR of 18.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.
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