LAMEA High-Density Interconnect (HDI) PCB Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications), By Application, By Country and Growth Forecast, 2023 - 2030
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Market Report Description
The Latin America, Middle East and Africa High-Density Interconnect (HDI) PCB Market would witness market growth of 14.0% CAGR during the forecast period (2023-2030).
PCB boards are employed in the development of four types of communication networks: fixed-line broadband, data communications, wireless networks, and transmission networks. Particularly for backplanes, high-frequency PCB boards, as well as high-speed multilayer PCBs, PCBs were in great demand during the early stages of 5G construction for wireless networks as well as transmission networks. The increasing number of 5G high-bandwidth commercial applications, including mobile high-definition video, automobile networking, and AR/VR, will significantly affect the capacity of data centers for data processing and interchange in the middle and end phases of 5G development.
Domestic data centers are anticipated to transition from 10G - 100G and 400G ultra-large data centers in the upcoming years. All of these developments will also propel the development and expansion of the HDI PCB technology, providing the market with lucrative growth prospects. Electrical performance is enhanced with HDI PCB. Electrical performance may be enhanced by closer spacing between parts and more transistors. Signal integrity is improved as a result of these features reduced power requirements. Greater reductions in total signal losses as well as crossing delays are associated with smaller diameters, which also speed up the signal transmission. The dependability of the board or the product may be increased by the reduced aspect ratios and the premium microvia construction.
By installing 5G networks, Latin American businesses may boost agricultural output, raise productivity, and improve the availability of services like health care, education, and other essentials in outlying locations. Brazil's switch to 5G wireless broadband will have a positive impact, especially on the Amazon region. By fusing the benefits of incredibly quick 5G networks with new opportunities for Brazilian companies to build network components, the strategy will increase employment and strengthen the country's economy. All of these elements are causing the regional market to grow.
The Brazil market dominated the LAMEA High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $481.7 million by 2029. The Argentina market is showcasing a CAGR of 14.7% during (2023 - 2030). Additionally, The UAE market would register a CAGR of 13.7% during (2023 - 2030).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Industrial Electronics
- IT & Telecommunications
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Saudi Arabia
- South Africa
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
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