Europe High-Density Interconnect (HDI) PCB Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications), By Application, By Country and Growth Forecast, 2023 - 2030
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Market Report Description
The Europe High-Density Interconnect (HDI) PCB Market would witness market growth of 10.4% CAGR during the forecast period (2023-2030).
A bright picture for the industry is also being created by the rising medical expenditures that are leading to a greater uptake of medical equipment and gadgets. Advanced electronic medical devices, including equipment for imaging, monitoring, surgical operations, laboratory analysis, etc., contain HDI boards. HDI PCBs are also notably used in medical devices. The high-density technology encourages better performance and smaller, more affordable gadgets, which could increase the precision of monitoring and medical tests.
Additionally, a crucial growth-inducing element for the market is the increasing manufacturing rates of technological aircraft parts and components. In addition, the market is anticipated to benefit from increased adoption of HDI technology through lucrative expansion prospects. HDI technology will probably take on a bigger role as automotive technology develops.
The widespread use of sophisticated safety systems, the growing popularity of autonomous driving, the rising sales of gaming consoles and smart devices, rising disposable income levels, and intensive research & development (R&D) efforts are a few other factors boosting market growth. IoT devices are becoming more prevalent in warehousing, manufacturing, and other sectors. Industrial automation necessitates extensive computerization.
One of the biggest automakers is Europe, which is made up of a number of top-performing automotive nations. The region's economy is greatly impacted by the car sector, notably in Italy. According to the International Trade Administration, 2019 saw around €106 billion, or 6.2% of Italy's GDP and 11% of its industrial turnover. In Italy, roughly 914,000 vehicles were produced in 2019, while 1,381,496 new vehicles were registered in 2020. German firms make up a sizable 20% of the top 75 global automotive suppliers. The region's market has a ton of potential, given the expanding vehicle industry of the neighbouring countries.
The Germany market dominated the Europe High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,596.4 million by 2029. The UK market is exhibiting a CAGR of 9.5% during (2023 - 2030). Additionally, The France market would experience a CAGR of 11.2% during (2023 - 2030).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
Market Segments Covered in the Report:
By End User
- Consumer Electronics
- Industrial Electronics
- IT & Telecommunications
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
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