LAMEA 3D Sensor Market By Type (Image Sensors, Position Sensors, Acoustic Sensors, Accelerometers Sensors), Technology (Stereo Vision Technology, Structured Light Technology, Time of Flight, Ultrasound), Application (Entertainment, Healthcare, Consumer Electronics, Automotive, Aerospace & Defense, Industrial Robotics, Security & Surveillance)

3D sensing represents a dynamic technology with significant applications in a wide range of industry verticals including consumer electronics, automotive, industrial robotics, security and surveillance, healthcare, and others. The largest product market, 3D image sensors, will continue to benefit from widespread applications in autonomous navigation, automotive safety, human machine interface, microscopy, oceanography, astronomy, virtual reality, biomedical image analysis, robot guidance, and industrial inspection, among others. The major drivers for this growth are the increasing demand for virtual reality, motion detection, and gesture recognition in the gaming sector. The report highlights the adoption of 3D Sensor.

Based on the Type, the 3D Sensor market is segmented into Image Sensors, Position Sensors, Acoustic Sensors and Accelerometer Sensors. Depending on Technology Type, the 3D Sensor Market is segmented into Stereo Vision Technology, Structured Light Technology, Time of Flight Technology and Ultrasound Technology. The different Applications highlighted in the 3D Sensor market are Entertainment, Healthcare, Consumer Electronics, Automotive, Aerospace & Defense, Industrial Robotics, Security & Surveillance and others. Based on country, LAMEA 3D Sensor market is segmented Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria and Rest of LAMEA. South Africa remained the dominant region in the LAMEA 3D Sensor market in 2015. Nigeria would witness highest CAGR during the forecast period (2016-2022).

The report covers the analysis of key stake holders of the 3D Sensor market. Key companies profiled in the report include Microsoft Corporation, Intel Corporation, Infineon Technologies AB, Toshiba Corporation, NXP Semiconductor N.V., Texas Instruments Incorporated, STMicroElectronics N.V. and Samsung Electronics Co. Ltd.