Asia Pacific 3D Sensor Market By Type (Image Sensors, Position Sensors, Acoustic Sensors, Accelerometers Sensors), Technology (Stereo Vision Technology, Structured Light Technology, Time of Flight, Ultrasound), Application (Entertainment, Healthcare, Consumer Electronics, Automotive, Aerospace & Defense, Industrial Robotics, Security & Surveillance)
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Market Report Description
The growing prominence of 3D technology is mirrored by the continuous rise in the number of 3D-enabled electronic devices being launched in the market each year. In the coming years, rapid adoption of 3D technology coupled with technological advancements will spur growth in the market. Rising demand for 3D sensing capability in devices such as tablets, laptops, and smartphones will spur growth in the consumer electronics end-use sector.
Significant application opportunities exist in gaming devices such as handheld game consoles that require advanced tracking and gesture recognition capabilities. The report highlights the adoption of 3D Sensor. Based on the Type, the 3D Sensor market is segmented into Image Sensors, Position Sensors, Acoustic Sensors and Accelerometer Sensors. Depending on Technology Type, the 3D Sensor Market is segmented into Stereo Vision Technology, Structured Light Technology, Time of Flight Technology and Ultrasound Technology.
The different Applications highlighted in the 3D Sensor market are Entertainment, Healthcare, Consumer Electronics, Automotive, Aerospace & Defense, Industrial Robotics, Security & Surveillance, and others. Based on the country, Asia-Pacific 3D Sensor market is segmented China, Japan, India, South Korea, Singapore, Malaysia and Rest of Asia-Pacific. China remained the dominant region in the Asia-Pacific 3D Sensor market in 2015. Malaysia would witness highest CAGR during the forecast period (2016-2022).
The report covers the analysis of key stake holders of the 3D Sensor market. Key companies profiled in the report include Microsoft Corporation, Intel Corporation, Infineon Technologies AB, Toshiba Corporation, NXP Semiconductor N.V., Texas Instruments Incorporated, STMicroElectronics N.V. and Samsung Electronics Co. Ltd.