Europe LED Packaging Market By Packaging Material (Substrates, Ceramic Packages System, Lead Frames, Bonding Wire), Package Type (Surface Mount Device, Chip on Board, Chip Scale Package), Application (General Lighting, Backlighting, Automotive Lighting)
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Market Report Description
The Europe LED Packaging Market would witness market growth of 5.7% CAGR during the forecast period (2017 - 2023). The factor driving the adoption of substrates is the high-power density of devices. The market for encapsulation resins is witnessing significant adoption due to increased use of silicon material which offers reliability and lifespan over traditional epoxy materials. Saturation levels in the market would limit the market growth to a certain extent. The global market for LED packaging would witness significant growth due to large number of players in the technology landscape, with higher focus of Research and Development activities. Filing of patents related to different LED technologies is also in the rise.
Based on Packaging Material, the market report segments the market into Substrates, Ceramic Packages, Lead Frames, Bonding Wire, and Others. Based on Package Type, the market report segments the market into Surface Mount Device, Chip on Board, Chip Scale Package, and Other Package Types. Based on Application, the market report segments the market into General Lighting, Backlighting, Automotive Lighting, and Other Applications. Based on Countries, the Data Center Virtualization market segments the market into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the Data Center Virtualization Market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Cree Inc., OSRAM Licht AG, Koninklijke Philips N.V. (Lumileds), Nichia Corporation, LG Corporation (LG Innotek), Epistar Corporation,Stanley Electric Co. Ltd., Everlight Electronics, and TT Electronics.