Asia Pacific LED Packaging Market By Packaging Material (Substrates, Ceramic Packages System, Lead Frames, Bonding Wire), Package Type (Surface Mount Device, Chip on Board, Chip Scale Package), Application (General Lighting, Backlighting, Automotive Lighting)
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Market Report Description
The Asia Pacific LED Packaging Market would witness market growth of 6.6% CAGR during the forecast period (2017 - 2023). Regionally, the Asia Pacific dominates the LED packaging market. Saving energy on a large scale is the factor that is contributing to the growth of LEDs in the general lighting applications.
The market for the industrial lighting application is anticipated to grow at the highest growth rate and would be a major segment which would drive the LED packaging market. The market for encapsulation resins is witnessing significant adoption due to increased use of silicon material which offers reliability and lifespan over traditional epoxy materials. Based on Packaging Material, the market report segments the market into Substrates, Ceramic Packages, Lead Frames, Bonding Wire, and Others.
Based on Package Type, the market report segments the market into Surface Mount Device, Chip on Board, Chip Scale Package, and Other Package Types. Based on Application, the market report segments the market into General Lighting, Backlighting, Automotive Lighting, and Other Applications. Based on Countries, the Data Center Virtualization market segments the market into China, Japan, India, South Korea, Singapore, Taiwan, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the Data Center Virtualization Market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Cree Inc., OSRAM Licht AG, Koninklijke Philips N.V. (Lumileds), Nichia Corporation, LG Corporation (LG Innotek), Epistar Corporation,Stanley Electric Co. Ltd., Everlight Electronics, and TT Electronics.