Asia Pacific Radiation Hardened Electronics Market

Asia Pacific Radiation Hardened Electronics Market Size, Share & Industry Trends Analysis Report By Component, By Manufacturing Technique, By Product Type, By Application (Space, Aerospace & Defense, Nuclear Power Plant, Medical), By Country and Growth Forecast, 2022 - 2028

Report Id: KBV-9857 Publication Date: June-2022 Number of Pages: 128
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Market Report Description

The Asia Pacific Radiation Hardened Electronics Market would witness market growth of 4.8% CAGR during the forecast period (2022-2028).

Radiation is a driving force in the design of radiation-hardened electronics, although radiation hardening and radiation acceptance testing are relevant for a variety of materials. Excessive radiation exposure can lead a nuclear structure to become structurally unsafe due to changes in its physical qualities, which are especially prone to neutron capture and radiation damage. A material subjected to radiation can swell due to thermal creep, which is especially problematic for materials under pressure. The thermal and electric conductivity of a material can be reduced by exposure to radiation.

DRAM-based on capacitors is frequently replaced by SRAM, which is more durable. A substrate with a large band gap, such as silicon or gallium nitride, is preferred because it is more resistant to deep-level flaws. It is shielded to safeguard the naked device from radiation. The passive layer, which shields the chip, is made of borophosphosilicate glass, which is depleted of boron. Boron-10, which is readily available in nature, is affected by neutrons as it undergoes alpha decay.

China aspires to be a leader in nuclear power development by constructing and running nuclear power stations (NPPs). The domestic aviation parts and assembly production industry in China is developing. There are roughly 200 small aviation component manufacturers in Shanghai, Chengdu, Xi'an, Nanchang, Harbin, Shenyang, and Shijiazhuang, as well as numerous regionally-based significant producers. Even though significant aircraft and engine producers have continued to increase domestic procurement activities for long-term development, the most technically complex and sophisticated parts are still imported. Over 8,000 Boeing airplanes, for example, travel internationally with parts and assemblies made in China. All Boeing aero plane models currently in production have components from China.

The Chinese military tightly controls the airspace, and the airspace classification scheme does not distinguish between GA and other aviation activities. The main single issue restricting this industry's expansion is stringent military control over nearly 70% of all Chinese airspace. As a result, GA in China is yet developing. Furthermore, some potential buyers may find the optics of GA ownership hard due to ongoing government austerity policies.

The China market dominated the Asia Pacific Radiation Hardened Electronics Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $125.5 million by 2028. The Japan market is experiencing a CAGR of 4.2% during (2022 - 2028). Additionally, The India market would exhibit a CAGR of 5.5% during (2022 - 2028).

Based on Component, the market is segmented into Power Management, Mixed Signal ICs, Processors & Controllers, and Memory. Based on Manufacturing Technique, the market is segmented into Radiation-Hardening by Design (RHBD) and Radiation-Hardening by Process (RHBP). Based on Product Type, the market is segmented into Commercial-off-the-Shelf (COTS) and Custom Made. Based on Application, the market is segmented into Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Australia, Malaysia, and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide Radiation Hardened Electronics Market is Projected to reach USD 1.8 Billion by 2028, at a CAGR of 3.9%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Renesas Electronics Corporation, STMicroelectronics N.V., Infineon Technologies AG, Texas Instruments, Inc., Microchip Technology, Inc., Teledyne Technologies, Inc., Honeywell International, Inc., BAE Systems PLC, Xilinx, Inc., and TTM Technologies, Inc.

Scope of the Study

Market Segments Covered in the Report:

By Component

  • Power Management
  • Mixed Signal ICs
  • Processors & Controllers
  • Memory

By Manufacturing Technique

  • Radiation-Hardening by Design (RHBD)
  • Radiation-Hardening by Process (RHBP)

By Product Type

  • Commercial-off-the-Shelf (COTS)
  • Custom Made

By Application

  • Space
  • Aerospace & Defense
  • Nuclear Power Plant
  • Medical
  • Space

By Country

  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Microchip Technology, Inc.
  • Teledyne Technologies, Inc.
  • Honeywell International, Inc.
  • BAE Systems PLC
  • Xilinx, Inc.
  • TTM Technologies, Inc.
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