Asia Pacific Outsourced Semiconductor Assembly and Testing Market Size, Share & Industry Trends Analysis Report By Application, By Packaging Type (Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die), By Process, By Country and Growth Forecast, 2022 - 2028
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Market Report Description
The Asia Pacific Outsourced Semiconductor Assembly and Testing Market would witness market growth of 5.2% CAGR during the forecast period (2022-2028).
Numerous other applications, including those in communications, computing, transportation, healthcare, military systems, and clean energy, have advanced due to semiconductors. Additionally, they are fostering the development of cutting-edge technologies like brain-inspired computing, the Internet of Things, virtual reality, energy-efficient sensing, robotics, automated devices, and artificial intelligence that have the potential to positively impact society.
The wafer from the wafer pre-process is cut into small wafers through the scribing process, and the cut wafer is then mounted with glue onto the corresponding substrate (lead frame) frame island in the semiconductor assembly and test process flow. Following that, conductive resin or ultra-fine metal (gold, tin, copper, aluminum) wires are used to connect the bond pad of the wafer to the corresponding lead of the substrate.
One of the largest markets for semiconductors in the world is China. China is also the world's second-largest final consumer market for semiconductor-embedded electronic devices. Additionally, the nation is seeing a number of initiatives relating to the manufacturing and research of semiconductor equipment, as well as investments to promote import-export trade and set up assembly & testing services facilities across the nation. The increase in investments made by various businesses to broaden their product lines is another factor fueling the growth of this region.
The China market dominated the Asia Pacific Outsourced Semiconductor Assembly and Testing Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $4,976.2 million by 2028. The Japan market is estimated to grow a CAGR of 4.6% during (2022 - 2028). Additionally, The India market would experience a CAGR of 5.8% during (2022 - 2028).
Based on Application, the market is segmented into Consumer Electronics, Industrial, Telecommunications, Medical & Healthcare, Automotive, Aerospace & Defense, and Logistics & Transportation. Based on Packaging Type, the market is segmented into Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die. Based on Process, the market is segmented into Testing, Sorting, Sawing, Assembly. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.
Scope of the Study
Market Segments Covered in the Report:
- Consumer Electronics
- Medical & Healthcare
- Aerospace & Defense
- Logistics & Transportation
By Packaging Type
- Ball Grid Array
- Quad & Dual
- Chip Scale Package
- Stacked Die
- South Korea
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Amkor Technology, Inc.
- Advanced Silicon S.A
- Alphacore, Inc.
- Device Engineering, Inc.
- HiDensity Group
- Luminar Technologies, Inc.
- Presto Engineering
- Sencio BV
- Shortlink AB
- SiFive, Inc.
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