Published Date: 23-Sep-2022
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According to a new report, published by KBV research, The Global Outsourced Semiconductor Assembly and Testing Market size is expected to reach $47.3 billion by 2028, rising at a market growth of 4.9% CAGR during the forecast period.
The Telecommunications segment is showcasing CAGR of 4.6% during (2022 - 2028). To power everything such as computers and smartphones infrastructure and networking equipment, semiconductors which are composed of chemical elements like silicon, gallium arsenide, and germanium are essential. Due to the expansion of the telecommunication industry, the demand for semiconductors in the sector increases. This serves as an opportunity for market growth in this segment.
The Ball Grid Array segment acquired maximum revenue share in the Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type in 2021 achieving a market value of $17.2 billion by 2028. On the back of the printed circuit board, globular solder is used rather than arrayed leads. On the surface of the printed circuit board, an LSI chip is mounted and sealed with potting or mold resin. There is no risk of the leads becoming malformed, and the package body size can be smaller than that of QFP.
The Assembly segment has shown the growth rate of 6.1% during (2022 - 2028). This is because of the advancements in technologies like silicon interposer assembly and organic-substrate-interposer technology, among others. Due to their shortened test times, increased scalability, and low cost, these developments are beneficial for integrated circuits, 3D packages, and image sensors.
The Asia Pacific market dominated the Global Outsourced Semiconductor Assembly and Testing Market by Region in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $18.2 billion by 2028. The Europe market is exhibiting a CAGR of 4.4% during (2022 - 2028). Additionally, The North America market would display a CAGR of 4.3% during (2022 - 2028).
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the globe with country wise analysis in each discussed region. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.
By Packaging Type
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