Global 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Regional Outlook and Forecast, 2023 - 2029

The Global 3D IC and 2.5D IC Packaging Market size is expected to reach $83 billion by 2029, rising at a market growth of 10.1% CAGR during the forecast period.

The logic segment is the growing application of 3D IC and 2.5D IC Packaging due to the expansion of smart city projects worldwide, growing safety concerns, and rising demand for improved high-level access control systems. For example, the Indian government invested a large amount of money to create 100 smart cities from existing ones. The United States government also pledged to invest in technology for smart cities in 2016. It is therefore expected that smart city projects will aid in the growth of the IoT industry in these locations. The creation and application of technology for smart cities can benefit greatly from using 3D IC packaging. These systems and devices can be made smaller, more powerful, and energy-efficient by utilizing 3D IC packaging. Some of the factors impacting the market are increasing demand for gaming devices and consumer electronics, growing industry-wide use of semiconductor devices, and higher level of integration-related thermal problems along with reliability challenges.

E-book readers, tablet computers, gaming devices, 3D smart glass, virtual reality, and augmented reality goods are just a few examples of the many new types of consumer electronics that are becoming available on the market due to recent developments in technology. Therefore, the rapidly increasing demand for these ICs is aiding in expanding the market throughout the forecast period. Advanced semiconductor devices are required to offer a variety of new capabilities due to rising digitization, expanding patterns of remote operations, and remote work. Therefore, all these elements are developing the market. However, High-density multi-level assembly per unit footprint is offered by 3D IC. This is appealing for numerous applications where downsizing is required, but it also poses problems for thermal management because increasing integration raises the on-chip temperature. Hence, all these elements may lead to slowed market growth.

End User Outlook

By end user, the market is divided into consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others. The telecommunications segment procured a remarkable growth rate in the market in 2022. 3D ICs and 2.5D ICs offer significant benefits for telecommunications applications, including higher performance, lower power consumption, space savings, improved thermal performance, and better signal integrity. These advantages make them an attractive option for telecommunication device designers and manufacturers. 3D IC and 2.5D IC packaging enable the integration of multiple components in a smaller form factor, making them ideal for applications where space is limited, such as in mobile devices.

Packaging Technology Outlook

Based on packaging technology, the market is characterized into 3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D. The 3D wafer-level chip-scale packaging (WLCSP) segment procured a considerable growth rate in the market in 2022. 3D WLCSP is one of the most compact package options, offering greater functionality and better thermal performance in most PCBs or printed circuit boards. Using polymers that can withstand high temperatures, 3D WLCSP offers a simplified process architecture for producing 3D ICs, overcoming the thermal issue.

Application Outlook

On the basis of application, the market is classified into logic, imaging & optoelectronics, memory, MEMS/Sensors, LED, and others. The MEMS/sensors segment recorded a significant revenue share in the market in 2022. Microactuators, microsensors, and microelectronics are the functional parts of MEMS. Among other things, MEMS' cutting-edge components include gyroscopes, digital compasses, accelerometers, inertial modules, humidity sensors, microphones, pressure sensors, and smart sensors. All of these components and sensors must have a structure that has been reduced in size.

The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Acquisitions, and Partnerships & Collaborations.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

3D IC and 2.5D IC Packaging Market Report Coverage

Report Attribute	Details
Market size value in 2022	USD 42.8 Billion
Market size forecast in 2029	USD 83 Billion
Base Year	2022
Historical Period	2019 to 2021
Forecast Period	2023 to 2029
Revenue Growth Rate	CAGR of 10.1% from 2023 to 2029
Number of Pages	262
Number of Table	410
Report coverage	Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Regional and Country Breakdown, Market Share Analysis, Companies Strategic Developments, Company Profiling
Segments covered	Packaging Technology, Application, End User, Region
Country scope	US, Canada, Mexico, Germany, UK, France, Russia, Spain, Italy, China, Japan, India, South Korea, Singapore, Taiwan, Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria
Growth Drivers	Increasing demand for gaming devices and consumer electronics Growing industry-wide use of semiconductor devices
Restraints	Higher level of integration-related thermal problems along with reliability challenges

Regional Outlook

Region wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment recorded the highest revenue share in the market in 2022. Due to its wide range of consumer electronics uses, the Asia Pacific region is among the major markets. This is mostly due to the region's dense population, which makes it the four primary region with the highest potential market. Additionally, advancements and expansion of telecommunication and automotive sectors are also increasingly using ICs.

Free Valuable Insights: Global 3D IC and 2.5D IC Packaging Market size to reach USD 83 Billion by 2029

Scope of the Study

Market Segments Covered in the Report:

By Packaging Technology

• 2.5D
• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)

By End User

• Consumer Electronics
• Automotive
• Industrial
• Military & Aerospace
• Telecommunications
• Medical Devices & Others

By Application

• Memory
• Imaging & Optoelectronics
• MEMS/Sensors
• Logic
• LED
• Others

By Geography

• North America
  • US
  • Canada
  • Mexico
  • Rest of North America
• Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific
• LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• ASE Group (ASE Technology Holding Co., Ltd.)
• Amkor Technology, Inc.
• Broadcom, Inc.
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• United Microelectronics Corporation

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 Global 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 Global 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 Global 3D IC and 2.5D IC Packaging Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 Market Share Analysis, 2022

Chapter 4. Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 Global 2.5D Market by Region
4.2 Global 3D wafer-level chip-scale packaging (WLCSP) Market by Region
4.3 Global 3D Through-silicon via (TSV) Market by Region

Chapter 5. Global 3D IC and 2.5D IC Packaging Market by End User
5.1 Global Consumer Electronics Market by Region
5.2 Global Automotive Market by Region
5.3 Global Industrial Market by Region
5.4 Global Military & Aerospace Market by Region
5.5 Global Telecommunications Market by Region
5.6 Global Medical Devices & Others Market by Region

Chapter 6. Global 3D IC and 2.5D IC Packaging Market by Application
6.1 Global Memory Market by Region
6.2 Global Imaging & Optoelectronics Market by Region
6.3 Global MEMS/Sensors Market by Region
6.4 Global Logic Market by Region
6.5 Global LED Market by Region
6.6 Global Others Market by Region

Chapter 7. Global 3D IC and 2.5D IC Packaging Market by Region
7.1 North America 3D IC and 2.5D IC Packaging Market
7.1.1 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.1.1 North America 2.5D Market by Country
7.1.1.2 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country
7.1.1.3 North America 3D Through-silicon via (TSV) Market by Country
7.1.2 North America 3D IC and 2.5D IC Packaging Market by End User
7.1.2.1 North America Consumer Electronics Market by Country
7.1.2.2 North America Automotive Market by Country
7.1.2.3 North America Industrial Market by Country
7.1.2.4 North America Military & Aerospace Market by Country
7.1.2.5 North America Telecommunications Market by Country
7.1.2.6 North America Medical Devices & Others Market by Country
7.1.3 North America 3D IC and 2.5D IC Packaging Market by Application
7.1.3.1 North America Memory Market by Country
7.1.3.2 North America Imaging & Optoelectronics Market by Country
7.1.3.3 North America MEMS/Sensors Market by Country
7.1.3.4 North America Logic Market by Country
7.1.3.5 North America LED Market by Country
7.1.3.6 North America Others Market by Country
7.1.4 North America 3D IC and 2.5D IC Packaging Market by Country
7.1.4.1 US 3D IC and 2.5D IC Packaging Market
7.1.4.1.1 US 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.4.1.2 US 3D IC and 2.5D IC Packaging Market by End User
7.1.4.1.3 US 3D IC and 2.5D IC Packaging Market by Application
7.1.4.2 Canada 3D IC and 2.5D IC Packaging Market
7.1.4.2.1 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.4.2.2 Canada 3D IC and 2.5D IC Packaging Market by End User
7.1.4.2.3 Canada 3D IC and 2.5D IC Packaging Market by Application
7.1.4.3 Mexico 3D IC and 2.5D IC Packaging Market
7.1.4.3.1 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.4.3.2 Mexico 3D IC and 2.5D IC Packaging Market by End User
7.1.4.3.3 Mexico 3D IC and 2.5D IC Packaging Market by Application
7.1.4.4 Rest of North America 3D IC and 2.5D IC Packaging Market
7.1.4.4.1 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.4.4.2 Rest of North America 3D IC and 2.5D IC Packaging Market by End User
7.1.4.4.3 Rest of North America 3D IC and 2.5D IC Packaging Market by Application
7.2 Europe 3D IC and 2.5D IC Packaging Market
7.2.1 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.1.1 Europe 2.5D Market by Country
7.2.1.2 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country
7.2.1.3 Europe 3D Through-silicon via (TSV) Market by Country
7.2.2 Europe 3D IC and 2.5D IC Packaging Market by End User
7.2.2.1 Europe Consumer Electronics Market by Country
7.2.2.2 Europe Automotive Market by Country
7.2.2.3 Europe Industrial Market by Country
7.2.2.4 Europe Military & Aerospace Market by Country
7.2.2.5 Europe Telecommunications Market by Country
7.2.2.6 Europe Medical Devices & Others Market by Country
7.2.3 Europe 3D IC and 2.5D IC Packaging Market by Application
7.2.3.1 Europe Memory Market by Country
7.2.3.2 Europe Imaging & Optoelectronics Market by Country
7.2.3.3 Europe MEMS/Sensors Market by Country
7.2.3.4 Europe Logic Market by Country
7.2.3.5 Europe LED Market by Country
7.2.3.6 Europe Others Market by Country
7.2.4 Europe 3D IC and 2.5D IC Packaging Market by Country
7.2.4.1 Germany 3D IC and 2.5D IC Packaging Market
7.2.4.1.1 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.1.2 Germany 3D IC and 2.5D IC Packaging Market by End User
7.2.4.1.3 Germany 3D IC and 2.5D IC Packaging Market by Application
7.2.4.2 UK 3D IC and 2.5D IC Packaging Market
7.2.4.2.1 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.2.2 UK 3D IC and 2.5D IC Packaging Market by End User
7.2.4.2.3 UK 3D IC and 2.5D IC Packaging Market by Application
7.2.4.3 France 3D IC and 2.5D IC Packaging Market
7.2.4.3.1 France 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.3.2 France 3D IC and 2.5D IC Packaging Market by End User
7.2.4.3.3 France 3D IC and 2.5D IC Packaging Market by Application
7.2.4.4 Russia 3D IC and 2.5D IC Packaging Market
7.2.4.4.1 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.4.2 Russia 3D IC and 2.5D IC Packaging Market by End User
7.2.4.4.3 Russia 3D IC and 2.5D IC Packaging Market by Application
7.2.4.5 Spain 3D IC and 2.5D IC Packaging Market
7.2.4.5.1 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.5.2 Spain 3D IC and 2.5D IC Packaging Market by End User
7.2.4.5.3 Spain 3D IC and 2.5D IC Packaging Market by Application
7.2.4.6 Italy 3D IC and 2.5D IC Packaging Market
7.2.4.6.1 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.6.2 Italy 3D IC and 2.5D IC Packaging Market by End User
7.2.4.6.3 Italy 3D IC and 2.5D IC Packaging Market by Application
7.2.4.7 Rest of Europe 3D IC and 2.5D IC Packaging Market
7.2.4.7.1 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.4.7.2 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User
7.2.4.7.3 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application
7.3 Asia Pacific 3D IC and 2.5D IC Packaging Market
7.3.1 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.1.1 Asia Pacific 2.5D Market by Country
7.3.1.2 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country
7.3.1.3 Asia Pacific 3D Through-silicon via (TSV) Market by Country
7.3.2 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User
7.3.2.1 Asia Pacific Consumer Electronics Market by Country
7.3.2.2 Asia Pacific Automotive Market by Country
7.3.2.3 Asia Pacific Industrial Market by Country
7.3.2.4 Asia Pacific Military & Aerospace Market by Country
7.3.2.5 Asia Pacific Telecommunications Market by Country
7.3.2.6 Asia Pacific Medical Devices & Others Market by Country
7.3.3 Asia Pacific 3D IC and 2.5D IC Packaging Market by Application
7.3.3.1 Asia Pacific Memory Market by Country
7.3.3.2 Asia Pacific Imaging & Optoelectronics Market by Country
7.3.3.3 Asia Pacific MEMS/Sensors Market by Country
7.3.3.4 Asia Pacific Logic Market by Country
7.3.3.5 Asia Pacific LED Market by Country
7.3.3.6 Asia Pacific Others Market by Country
7.3.4 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country
7.3.4.1 China 3D IC and 2.5D IC Packaging Market
7.3.4.1.1 China 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.1.2 China 3D IC and 2.5D IC Packaging Market by End User
7.3.4.1.3 China 3D IC and 2.5D IC Packaging Market by Application
7.3.4.2 Japan 3D IC and 2.5D IC Packaging Market
7.3.4.2.1 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.2.2 Japan 3D IC and 2.5D IC Packaging Market by End User
7.3.4.2.3 Japan 3D IC and 2.5D IC Packaging Market by Application
7.3.4.3 Taiwan 3D IC and 2.5D IC Packaging Market
7.3.4.3.1 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.3.2 Taiwan 3D IC and 2.5D IC Packaging Market by End User
7.3.4.3.3 Taiwan 3D IC and 2.5D IC Packaging Market by Application
7.3.4.4 India 3D IC and 2.5D IC Packaging Market
7.3.4.4.1 India 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.4.2 India 3D IC and 2.5D IC Packaging Market by End User
7.3.4.4.3 India 3D IC and 2.5D IC Packaging Market by Application
7.3.4.5 South Korea 3D IC and 2.5D IC Packaging Market
7.3.4.5.1 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.5.2 South Korea 3D IC and 2.5D IC Packaging Market by End User
7.3.4.5.3 South Korea 3D IC and 2.5D IC Packaging Market by Application
7.3.4.6 Singapore 3D IC and 2.5D IC Packaging Market
7.3.4.6.1 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.6.2 Singapore 3D IC and 2.5D IC Packaging Market by End User
7.3.4.6.3 Singapore 3D IC and 2.5D IC Packaging Market by Application
7.3.4.7 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market
7.3.4.7.1 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.4.7.2 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User
7.3.4.7.3 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application
7.4 LAMEA 3D IC and 2.5D IC Packaging Market
7.4.1 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.1.1 LAMEA 2.5D Market by Country
7.4.1.2 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country
7.4.1.3 LAMEA 3D Through-silicon via (TSV) Market by Country
7.4.2 LAMEA 3D IC and 2.5D IC Packaging Market by End User
7.4.2.1 LAMEA Consumer Electronics Market by Country
7.4.2.2 LAMEA Automotive Market by Country
7.4.2.3 LAMEA Industrial Market by Country
7.4.2.4 LAMEA Military & Aerospace Market by Country
7.4.2.5 LAMEA Telecommunications Market by Country
7.4.2.6 LAMEA Others Market by Country
7.4.3 LAMEA 3D IC and 2.5D IC Packaging Market by Application
7.4.3.1 LAMEA Memory Market by Country
7.4.3.2 LAMEA Imaging & Optoelectronics Market by Country
7.4.3.3 LAMEA MEMS/Sensors Market by Country
7.4.3.4 LAMEA Logic Market by Country
7.4.3.5 LAMEA LED Market by Country
7.4.3.6 LAMEA Others Market by Country
7.4.4 LAMEA 3D IC and 2.5D IC Packaging Market by Country
7.4.4.1 Brazil 3D IC and 2.5D IC Packaging Market
7.4.4.1.1 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.1.2 Brazil 3D IC and 2.5D IC Packaging Market by End User
7.4.4.1.3 Brazil 3D IC and 2.5D IC Packaging Market by Application
7.4.4.2 Argentina 3D IC and 2.5D IC Packaging Market
7.4.4.2.1 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.2.2 Argentina 3D IC and 2.5D IC Packaging Market by End User
7.4.4.2.3 Argentina 3D IC and 2.5D IC Packaging Market by Application
7.4.4.3 UAE 3D IC and 2.5D IC Packaging Market
7.4.4.3.1 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.3.2 UAE 3D IC and 2.5D IC Packaging Market by End User
7.4.4.3.3 UAE 3D IC and 2.5D IC Packaging Market by Application
7.4.4.4 Saudi Arabia 3D IC and 2.5D IC Packaging Market
7.4.4.4.1 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.4.2 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User
7.4.4.4.3 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application
7.4.4.5 South Africa 3D IC and 2.5D IC Packaging Market
7.4.4.5.1 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.5.2 South Africa 3D IC and 2.5D IC Packaging Market by End User
7.4.4.5.3 South Africa 3D IC and 2.5D IC Packaging Market by Application
7.4.4.6 Nigeria 3D IC and 2.5D IC Packaging Market
7.4.4.6.1 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.6.2 Nigeria 3D IC and 2.5D IC Packaging Market by End User
7.4.4.6.3 Nigeria 3D IC and 2.5D IC Packaging Market by Application
7.4.4.7 Rest of LAMEA 3D IC and 2.5D IC Packaging Market
7.4.4.7.1 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.4.7.2 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User
7.4.4.7.3 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application

Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses

TABLE 1 Global 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 2 Global 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 3 Global 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 4 Global 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 5 Global 2.5D Market by Region, 2019 - 2022, USD Million
TABLE 6 Global 2.5D Market by Region, 2023 - 2029, USD Million
TABLE 7 Global 3D wafer-level chip-scale packaging (WLCSP) Market by Region, 2019 - 2022, USD Million
TABLE 8 Global 3D wafer-level chip-scale packaging (WLCSP) Market by Region, 2023 - 2029, USD Million
TABLE 9 Global 3D Through-silicon via (TSV) Market by Region, 2019 - 2022, USD Million
TABLE 10 Global 3D Through-silicon via (TSV) Market by Region, 2023 - 2029, USD Million
TABLE 11 Global 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 12 Global 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 13 Global Consumer Electronics Market by Region, 2019 - 2022, USD Million
TABLE 14 Global Consumer Electronics Market by Region, 2023 - 2029, USD Million
TABLE 15 Global Automotive Market by Region, 2019 - 2022, USD Million
TABLE 16 Global Automotive Market by Region, 2023 - 2029, USD Million
TABLE 17 Global Industrial Market by Region, 2019 - 2022, USD Million
TABLE 18 Global Industrial Market by Region, 2023 - 2029, USD Million
TABLE 19 Global Military & Aerospace Market by Region, 2019 - 2022, USD Million
TABLE 20 Global Military & Aerospace Market by Region, 2023 - 2029, USD Million
TABLE 21 Global Telecommunications Market by Region, 2019 - 2022, USD Million
TABLE 22 Global Telecommunications Market by Region, 2023 - 2029, USD Million
TABLE 23 Global Medical Devices & Others Market by Region, 2019 - 2022, USD Million
TABLE 24 Global Medical Devices & Others Market by Region, 2023 - 2029, USD Million
TABLE 25 Global 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 26 Global 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 27 Global Memory Market by Region, 2019 - 2022, USD Million
TABLE 28 Global Memory Market by Region, 2023 - 2029, USD Million
TABLE 29 Global Imaging & Optoelectronics Market by Region, 2019 - 2022, USD Million
TABLE 30 Global Imaging & Optoelectronics Market by Region, 2023 - 2029, USD Million
TABLE 31 Global MEMS/Sensors Market by Region, 2019 - 2022, USD Million
TABLE 32 Global MEMS/Sensors Market by Region, 2023 - 2029, USD Million
TABLE 33 Global Logic Market by Region, 2019 - 2022, USD Million
TABLE 34 Global Logic Market by Region, 2023 - 2029, USD Million
TABLE 35 Global LED Market by Region, 2019 - 2022, USD Million
TABLE 36 Global LED Market by Region, 2023 - 2029, USD Million
TABLE 37 Global Others Market by Region, 2019 - 2022, USD Million
TABLE 38 Global Others Market by Region, 2023 - 2029, USD Million
TABLE 39 Global 3D IC and 2.5D IC Packaging Market by Region, 2019 - 2022, USD Million
TABLE 40 Global 3D IC and 2.5D IC Packaging Market by Region, 2023 - 2029, USD Million
TABLE 41 North America 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 42 North America 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 43 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 44 North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 45 North America 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 46 North America 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 47 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 48 North America 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 49 North America 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 50 North America 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 51 North America 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 52 North America 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 53 North America Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 54 North America Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 55 North America Automotive Market by Country, 2019 - 2022, USD Million
TABLE 56 North America Automotive Market by Country, 2023 - 2029, USD Million
TABLE 57 North America Industrial Market by Country, 2019 - 2022, USD Million
TABLE 58 North America Industrial Market by Country, 2023 - 2029, USD Million
TABLE 59 North America Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 60 North America Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 61 North America Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 62 North America Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 63 North America Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 64 North America Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 65 North America 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 66 North America 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 67 North America Memory Market by Country, 2019 - 2022, USD Million
TABLE 68 North America Memory Market by Country, 2023 - 2029, USD Million
TABLE 69 North America Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 70 North America Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 71 North America MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 72 North America MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 73 North America Logic Market by Country, 2019 - 2022, USD Million
TABLE 74 North America Logic Market by Country, 2023 - 2029, USD Million
TABLE 75 North America LED Market by Country, 2019 - 2022, USD Million
TABLE 76 North America LED Market by Country, 2023 - 2029, USD Million
TABLE 77 North America Others Market by Country, 2019 - 2022, USD Million
TABLE 78 North America Others Market by Country, 2023 - 2029, USD Million
TABLE 79 North America 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 80 North America 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 81 US 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 82 US 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 83 US 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 84 US 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 85 US 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 86 US 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 87 US 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 88 US 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 89 Canada 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 90 Canada 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 91 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 92 Canada 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 93 Canada 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 94 Canada 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 95 Canada 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 96 Canada 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 97 Mexico 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 98 Mexico 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 99 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 100 Mexico 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 101 Mexico 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 102 Mexico 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 103 Mexico 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 104 Mexico 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 105 Rest of North America 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 106 Rest of North America 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 107 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 108 Rest of North America 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 109 Rest of North America 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 110 Rest of North America 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 111 Rest of North America 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 112 Rest of North America 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 113 Europe 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 114 Europe 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 115 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 116 Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 117 Europe 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 118 Europe 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 119 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 120 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 121 Europe 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 122 Europe 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 123 Europe 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 124 Europe 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 125 Europe Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 126 Europe Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 127 Europe Automotive Market by Country, 2019 - 2022, USD Million
TABLE 128 Europe Automotive Market by Country, 2023 - 2029, USD Million
TABLE 129 Europe Industrial Market by Country, 2019 - 2022, USD Million
TABLE 130 Europe Industrial Market by Country, 2023 - 2029, USD Million
TABLE 131 Europe Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 132 Europe Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 133 Europe Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 134 Europe Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 135 Europe Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 136 Europe Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 137 Europe 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 138 Europe 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 139 Europe Memory Market by Country, 2019 - 2022, USD Million
TABLE 140 Europe Memory Market by Country, 2023 - 2029, USD Million
TABLE 141 Europe Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 142 Europe Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 143 Europe MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 144 Europe MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 145 Europe Logic Market by Country, 2019 - 2022, USD Million
TABLE 146 Europe Logic Market by Country, 2023 - 2029, USD Million
TABLE 147 Europe LED Market by Country, 2019 - 2022, USD Million
TABLE 148 Europe LED Market by Country, 2023 - 2029, USD Million
TABLE 149 Europe Others Market by Country, 2019 - 2022, USD Million
TABLE 150 Europe Others Market by Country, 2023 - 2029, USD Million
TABLE 151 Europe 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 152 Europe 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 153 Germany 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 154 Germany 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 155 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 156 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 157 Germany 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 158 Germany 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 159 Germany 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 160 Germany 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 161 UK 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 162 UK 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 163 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 164 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 165 UK 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 166 UK 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 167 UK 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 168 UK 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 169 France 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 170 France 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 171 France 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 172 France 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 173 France 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 174 France 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 175 France 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 176 France 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 177 Russia 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 178 Russia 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 179 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 180 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 181 Russia 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 182 Russia 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 183 Russia 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 184 Russia 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 185 Spain 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 186 Spain 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 187 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 188 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 189 Spain 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 190 Spain 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 191 Spain 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 192 Spain 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 193 Italy 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 194 Italy 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 195 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 196 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 197 Italy 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 198 Italy 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 199 Italy 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 200 Italy 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 201 Rest of Europe 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 202 Rest of Europe 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 203 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 204 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 205 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 206 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 207 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 208 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 209 Asia Pacific 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 210 Asia Pacific 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 211 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 212 Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 213 Asia Pacific 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 214 Asia Pacific 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 215 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 216 Asia Pacific 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 217 Asia Pacific 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 218 Asia Pacific 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 219 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 220 Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 221 Asia Pacific Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 222 Asia Pacific Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 223 Asia Pacific Automotive Market by Country, 2019 - 2022, USD Million
TABLE 224 Asia Pacific Automotive Market by Country, 2023 - 2029, USD Million
TABLE 225 Asia Pacific Industrial Market by Country, 2019 - 2022, USD Million
TABLE 226 Asia Pacific Industrial Market by Country, 2023 - 2029, USD Million
TABLE 227 Asia Pacific Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 228 Asia Pacific Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 229 Asia Pacific Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 230 Asia Pacific Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 231 Asia Pacific Medical Devices & Others Market by Country, 2019 - 2022, USD Million
TABLE 232 Asia Pacific Medical Devices & Others Market by Country, 2023 - 2029, USD Million
TABLE 233 Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 234 Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 235 Asia Pacific Memory Market by Country, 2019 - 2022, USD Million
TABLE 236 Asia Pacific Memory Market by Country, 2023 - 2029, USD Million
TABLE 237 Asia Pacific Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 238 Asia Pacific Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 239 Asia Pacific MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 240 Asia Pacific MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 241 Asia Pacific Logic Market by Country, 2019 - 2022, USD Million
TABLE 242 Asia Pacific Logic Market by Country, 2023 - 2029, USD Million
TABLE 243 Asia Pacific LED Market by Country, 2019 - 2022, USD Million
TABLE 244 Asia Pacific LED Market by Country, 2023 - 2029, USD Million
TABLE 245 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
TABLE 246 Asia Pacific Others Market by Country, 2023 - 2029, USD Million
TABLE 247 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 248 Asia Pacific 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 249 China 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 250 China 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 251 China 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 252 China 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 253 China 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 254 China 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 255 China 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 256 China 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 257 Japan 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 258 Japan 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 259 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 260 Japan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 261 Japan 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 262 Japan 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 263 Japan 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 264 Japan 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 265 Taiwan 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 266 Taiwan 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 267 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 268 Taiwan 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 269 Taiwan 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 270 Taiwan 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 271 Taiwan 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 272 Taiwan 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 273 India 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 274 India 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 275 India 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 276 India 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 277 India 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 278 India 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 279 India 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 280 India 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 281 South Korea 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 282 South Korea 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 283 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 284 South Korea 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 285 South Korea 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 286 South Korea 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 287 South Korea 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 288 South Korea 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 289 Singapore 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 290 Singapore 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 291 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 292 Singapore 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 293 Singapore 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 294 Singapore 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 295 Singapore 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 296 Singapore 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 297 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 298 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 299 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 300 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 301 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 302 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 303 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 304 Rest of Asia Pacific 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 305 LAMEA 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 306 LAMEA 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 307 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 308 LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 309 LAMEA 2.5D Market by Country, 2019 - 2022, USD Million
TABLE 310 LAMEA 2.5D Market by Country, 2023 - 2029, USD Million
TABLE 311 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2019 - 2022, USD Million
TABLE 312 LAMEA 3D wafer-level chip-scale packaging (WLCSP) Market by Country, 2023 - 2029, USD Million
TABLE 313 LAMEA 3D Through-silicon via (TSV) Market by Country, 2019 - 2022, USD Million
TABLE 314 LAMEA 3D Through-silicon via (TSV) Market by Country, 2023 - 2029, USD Million
TABLE 315 LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 316 LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 317 LAMEA Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 318 LAMEA Consumer Electronics Market by Country, 2023 - 2029, USD Million
TABLE 319 LAMEA Automotive Market by Country, 2019 - 2022, USD Million
TABLE 320 LAMEA Automotive Market by Country, 2023 - 2029, USD Million
TABLE 321 LAMEA Industrial Market by Country, 2019 - 2022, USD Million
TABLE 322 LAMEA Industrial Market by Country, 2023 - 2029, USD Million
TABLE 323 LAMEA Military & Aerospace Market by Country, 2019 - 2022, USD Million
TABLE 324 LAMEA Military & Aerospace Market by Country, 2023 - 2029, USD Million
TABLE 325 LAMEA Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 326 LAMEA Telecommunications Market by Country, 2023 - 2029, USD Million
TABLE 327 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 328 LAMEA Others Market by Country, 2023 - 2029, USD Million
TABLE 329 LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 330 LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 331 LAMEA Memory Market by Country, 2019 - 2022, USD Million
TABLE 332 LAMEA Memory Market by Country, 2023 - 2029, USD Million
TABLE 333 LAMEA Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
TABLE 334 LAMEA Imaging & Optoelectronics Market by Country, 2023 - 2029, USD Million
TABLE 335 LAMEA MEMS/Sensors Market by Country, 2019 - 2022, USD Million
TABLE 336 LAMEA MEMS/Sensors Market by Country, 2023 - 2029, USD Million
TABLE 337 LAMEA Logic Market by Country, 2019 - 2022, USD Million
TABLE 338 LAMEA Logic Market by Country, 2023 - 2029, USD Million
TABLE 339 LAMEA LED Market by Country, 2019 - 2022, USD Million
TABLE 340 LAMEA LED Market by Country, 2023 - 2029, USD Million
TABLE 341 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 342 LAMEA Others Market by Country, 2023 - 2029, USD Million
TABLE 343 LAMEA 3D IC and 2.5D IC Packaging Market by Country, 2019 - 2022, USD Million
TABLE 344 LAMEA 3D IC and 2.5D IC Packaging Market by Country, 2023 - 2029, USD Million
TABLE 345 Brazil 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 346 Brazil 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 347 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 348 Brazil 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 349 Brazil 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 350 Brazil 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 351 Brazil 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 352 Brazil 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 353 Argentina 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 354 Argentina 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 355 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 356 Argentina 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 357 Argentina 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 358 Argentina 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 359 Argentina 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 360 Argentina 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 361 UAE 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 362 UAE 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 363 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 364 UAE 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 365 UAE 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 366 UAE 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 367 UAE 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 368 UAE 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 369 Saudi Arabia 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 370 Saudi Arabia 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 371 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 372 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 373 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 374 Saudi Arabia 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 375 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 376 Saudi Arabia 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 377 South Africa 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 378 South Africa 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 379 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 380 South Africa 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 381 South Africa 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 382 South Africa 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 383 South Africa 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 384 South Africa 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 385 Nigeria 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 386 Nigeria 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 387 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 388 Nigeria 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 389 Nigeria 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 390 Nigeria 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 391 Nigeria 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 392 Nigeria 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 393 Rest of LAMEA 3D IC and 2.5D IC Packaging Market, 2019 - 2022, USD Million
TABLE 394 Rest of LAMEA 3D IC and 2.5D IC Packaging Market, 2023 - 2029, USD Million
TABLE 395 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2022, USD Million
TABLE 396 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2023 - 2029, USD Million
TABLE 397 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2022, USD Million
TABLE 398 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by End User, 2023 - 2029, USD Million
TABLE 399 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2022, USD Million
TABLE 400 Rest of LAMEA 3D IC and 2.5D IC Packaging Market by Application, 2023 - 2029, USD Million
TABLE 401 Key Information – Samsung Electronics Co., Ltd.
TABLE 402 Key Information– Taiwan Semiconductor Manufacturing Company Limited
TABLE 403 Key Information – Intel Corporation
TABLE 404 Key Information – ASE Group
TABLE 405 Key Information – Amkor Technology, Inc.
TABLE 406 Key Information – Broadcom, Inc.
TABLE 407 Key Information – Texas Instruments, Inc.
TABLE 408 Key Information – JCET Group
TABLE 409 Key Information – Powertech Technology Inc.
TABLE 410 Key Information – United Microelectronics Corporation

List of Figures
FIG 1 Methodology for the research
FIG 2 Market Share Analysis, 2022
FIG 3 Global 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2022
FIG 4 Global 3D IC and 2.5D IC Packaging Market share by Packaging Technology, 2029
FIG 5 Global 3D IC and 2.5D IC Packaging Market by Packaging Technology, 2019 - 2029, USD Million
FIG 6 Global 3D IC and 2.5D IC Packaging Market share by End User, 2022
FIG 7 Global 3D IC and 2.5D IC Packaging Market share by End User, 2029
FIG 8 Global 3D IC and 2.5D IC Packaging Market by End User, 2019 - 2029, USD Million
FIG 9 Global 3D IC and 2.5D IC Packaging Market share by Application, 2022
FIG 10 Global 3D IC and 2.5D IC Packaging Market share by Application, 2029
FIG 11 Global 3D IC and 2.5D IC Packaging Market by Application, 2019 - 2029, USD Million
FIG 12 Global 3D IC and 2.5D IC Packaging Market share by Region, 2022
FIG 13 Global 3D IC and 2.5D IC Packaging Market share by Region, 2029
FIG 14 Global 3D IC and 2.5D IC Packaging Market by Region, 2019 - 2029, USD Million
FIG 15 SWOT Analysis: Samsung Electronics CO. Ltd.
FIG 16 SWOT analysis: Intel corporation
FIG 17 SWOT Analysis: Broadcom, Inc.