Asia Pacific 3D IC and 2.5D IC Packaging Market

Asia Pacific 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

Report Id: KBV-15317 Publication Date: May-2023 Number of Pages: 111
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Market Report Description

The Asia Pacific 3D IC and 2.5D IC Packaging Market would witness market growth of 10.4% CAGR during the forecast period (2023-2029).

3D and 2.5D ICs have lately become well-liked as suitable chipset integration platforms due to their advantages in achieving extraordinarily high package density as well as excellent energy efficiency. Data center networking, autonomous vehicles, and high-performance computing are driving the market under consideration's technological development, which is influencing implementation statistics. At the device, edge computing, and cloud levels, massive computational resources are at present in demand.

The development of advanced items rises as the range of market competitors does. Companies are beginning to include 3D IC and 2.5D IC in various programmable logic to provide operational efficiency with additional convenience and increased productivity. In-field programming gate arrays, for instance, are a market leader for Intel Corp. Additionally, there is a considerable need for 2.5D and 3D IC packaging technology in the expanding consumer electronics industry, particularly for cellphones and tablets. The computing burden has changed significantly during the last few decades. Previously a back-end process and a hassle, packaging technology is now being prioritized for innovation and is essential to the cost, function, and performance of products.

China intends to extend its 5G mobile network by having 2.64 million base stations by the end of 2023, as stated by the Ministry of Industry and Information Technology (MIIT). By the end of March, the 5G base stations will be able to accommodate all 620 million 5G cellphone customers in the country. In addition, Chinese manufacturers will need more 2.5D IC and 3D IC semiconductor packaging due to the region's expanding 5G deployment, which is also anticipated to boost demand for 5G-enabled gadgets. Likewise, according to the China Academy of Information and Communications Technology (CAICT), the nation's shipments of cell phones compatible with 5G networks rose sharply in 2021.

The China market dominated the Asia Pacific 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $10,074.5 Million by 2029. The Japan market is experiencing a CAGR of 9.7% during (2023 - 2029). Additionally, The Taiwan market would showcase a CAGR of 11.1% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into China, Japan, Taiwan, India, South Korea, Singapore and Rest of Asia Pacific.

Free Valuable Insights: The Worldwide 3D IC and 2.5D IC Packaging Market is Projected to reach USD 83 Billion by 2029, at a CAGR of 10.1%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments Covered in the Report:

By Packaging Technology

  • 2.5D
  • 3D wafer-level chip-scale packaging (WLCSP)
  • 3D Through-silicon via (TSV)

By End User

  • Consumer Electronics
  • Automotive
  • Industrial
  • Military & Aerospace
  • Telecommunications
  • Medical Devices & Others

By Application

  • Memory
  • Imaging & Optoelectronics
  • MEMS/Sensors
  • Logic
  • LED
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • ASE Group (ASE Technology Holding Co., Ltd.)
  • Amkor Technology, Inc.
  • Broadcom, Inc.
  • Texas Instruments, Inc.
  • JCET Group
  • Powertech Technology, Inc.
  • United Microelectronics Corporation
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