According to a new report, published by KBV research, The Global Advanced Packaging Market size is expected to reach $73.16 billion by 2031, rising at a market growth of 9.2% CAGR during the forecast period.
The Flip-Chip Ball Grid Array segment is leading the Global Advanced Packaging Market by Type in 2023; thereby, achieving a market value of $18.05 billion by 2031. Flip-chip ball grid array (FCBGA) technology connects a semiconductor die directly to a substrate using solder bumps, bypassing traditional wire bonding. This approach enhances electrical performance, reduces signal interference, and improves heat dissipation, making it ideal for high-power and high-speed applications.
The Industrial segment captures a CAGR of 9.7% during (2024 - 2031). The adoption of advanced electronics in automation, robotics, and smart manufacturing systems drives the segment. Industrial applications often require rugged and reliable semiconductor solutions capable of withstanding harsh environments and operating conditions. The rise of Industry 4.0, characterized by integrating IoT, artificial intelligence (AI), and machine learning (ML) in manufacturing, has significantly boosted the demand for advanced semiconductor solutions.
Full Report: https://www.kbvresearch.com/advanced-packaging-market/
The Asia Pacific market dominated the Global Advanced Packaging Market by Region in 2023; thereby, achieving a market value of $34.37 billion by 2031. The North America region is expected to witness a CAGR of 8.4% during (2024 - 2031). Additionally, The Europe region would register a CAGR of 8.9% during (2024 - 2031).
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