North America Smartphone 3D Camera Market By Technology (Stereoscopic Camera, Time of Flight), Resolution Type (Below 8 MP, 8 MP to 16 MP, Above 16 MP)
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Market Report Description
The North America Smartphone 3D Camera market size is poised to grow at growth rate of 49.3% CAGR during the forecast period.
The picture quality of the latest smartphones is of superior quality, as the smart phones are already integrated with 3D cameras which have the capability to sense movements. 3D cameras in smartphones have gained widespread acceptance, majorly among the younger generation, as the smartphones come with sensational features such as real sensing of the object, clarity and HD performance. 3D camera technology nevertheless requires advanced hardware support in smartphones, namely better storage space and advanced processors. Increasing adoption of smartphones and rapid technological advancements has led to the growth of the North America smartphone 3D camera market. Several companies are heavily investing in research and development activities to launch advanced and innovative smartphone 3D cameras. Extensive R&D activities by different organizations would substantially contribute to the growth of the smartphone 3D camera market, in North America.
Based on the technology, the Smartphone 3D Camera market is segmented into Stereoscopic Camera and Time of Flight. Based on Resolution Type, the market is segmented into Below 8MP, 8MP to 16 MP and Above 16 MP. Based on Country, North America Smartphone 3D Camera market is segmented into US, Canada, Mexico and Rest of North America. US remained the dominant Country in the North America Smartphone 3D Camera market in 2015. Canada would witness promising CAGR during the forecast period (2016-2022).
The report covers the analysis of key stake holders of the Smartphone 3D Camera market. Key companies profiled in the report include Toshiba Corporation, NXP Semiconductors N.V, Texas Instruments Incorporated, Samsung Electronics Co. Ltd., Sony Corporation, Panasonic Corporation, Microsoft Corporation, Intel Corporation and Infineon Technologies AG.