The North America Semiconductor Bonding Market would witness market growth of 3.2% CAGR during the forecast period (2023-2030).
The emergence of innovative technologies, including artificial intelligence, energy-efficient sensing equipment, brain-inspired computing, robotics, and automated machinery, has significantly fueled the market's growth. Additionally, semiconductor bonding is very complex and is used in consumer electronics, computing, communications, aerospace, medical, retail, and aerospace industries.
The market is anticipated to be driven in the near future by the rising use of 3D chip modules. By vertically stacking two or more semiconductors and employing various bonding techniques, including adhesive, soft soldering, and eutectic, 3D ICs are created. In addition to occupying less space, 3D packaging provides superior product performance and reduced energy consumption. Die bonders provide the micro-level accuracy required to produce 3D chip modules, ensuring a smooth bonding process.
The market is anticipated to grow faster due to the expanding use of 3D semiconductor components, increasing Outsourced Semiconductor Assembly and Test (OSAT) company and foundry competition, and increasing demand for MEMS and MOEMS from the automotive industry. RF transmitters and transceivers, vital parts of mobile devices, are made with 3D ICs.
The US government is providing numerous growth prospects for the semiconductor industry. For example, the CHIPS for America initiative funds companies aiming to produce semiconductor chips nationwide. Recently funding announcement by the National Institute of Standards and Technology was expanded till June 2023 to include requests for proposals for facilities that will be used to manufacture semiconductor materials and materials-related equipment, for which the cost of capital will be $300 million or more. With rise in the EV sector along with the North government support for semiconductor chip production, in North America region, the market is estimated to grow in the upcoming years.
The US market dominated the North America Semiconductor Bonding Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $220.8 million by 2030. The Canada market is estimated to witness a CAGR of 5.5% during (2023 - 2030). Additionally, The Mexico market would showcase a CAGR of 4.6% during (2023 - 2030).
Based on Application, the market is segmented into LED, Mems & Sensors, RF Devices, CMOS Image Sensors, and 3D NAND. Based on Type, the market is segmented into Wafer Bonder, Die Bonder, and Flip Chip Bonder. Based on Bonding Technology, the market is segmented into Die Bonding Technology, and Wafer Bonding Technology (Direct & Anodic Wafer Bonding, and Indirect Wafer Bonding). Based on Process Type, the market is segmented into Die To Die Bonding, Wafer To Wafer Bonding, and Die To Wafer Bonding. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
Free Valuable Insights: The Worldwide Semiconductor Bonding Market is Projected to reach USD 1.1 Billion by 2030, at a CAGR of 3.6%
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Mycronic AB, TDK Corporation, EV Group, Panasonic Holdings Corporation, Tokyo Electron Ltd., Mitsubishi Electric Corporation, Intel Corporation, SÜSS MicroTec SE, Fuji Corporation (Fasford Technology Co., Ltd.), Shibuara Mechatronics Corporation
Scope of the Study
Market Segments Covered in the Report:
By Application
- LED
- Mems & Sensors
- RF Devices
- CMOS Image Sensors
- 3D NAND
By Type
- Wafer Bonder
- Die Bonder
- Flip Chip Bonder
By Bonding Technology
- Die Bonding Technology
- Wafer Bonding Technology
- Direct & Anodic Wafer Bonding
- Indirect Wafer Bonding
By Process Type
- Die To Die Bonding
- Wafer To Wafer Bonding
- Die To Wafer Bonding
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Mycronic AB
- TDK Corporation
- EV Group
- Panasonic Holdings Corporation
- Tokyo Electron Ltd.
- Mitsubishi Electric Corporation
- Intel Corporation
- SÜSS MicroTec SE
- Fuji Corporation (Fasford Technology Co., Ltd.)
- Shibuara Mechatronics Corporation
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Semiconductor Bonding Market, by Application
1.4.2 North America Semiconductor Bonding Market, by Type
1.4.3 North America Semiconductor Bonding Market, by Bonding Technology
1.4.4 North America Semiconductor Bonding Market, by Process Type
1.4.5 North America Semiconductor Bonding Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter’s Five Force Analysis
Chapter 4. Strategies Deployed in Semiconductor Bonding Market
Chapter 5. North America Semiconductor Bonding Market by Application
5.1 North America LED Market by Country
5.2 North America Mems & Sensors Market by Country
5.3 North America RF Devices Market by Country
5.4 North America CMOS Image Sensors Market by Country
5.5 North America 3D NAND Market by Country
Chapter 6. North America Semiconductor Bonding Market by Type
6.1 North America Wafer Bonder Market by Country
6.2 North America Die Bonder Market by Country
6.3 North America Flip Chip Bonder Market by Country
Chapter 7. North America Semiconductor Bonding Market by Bonding Technology
7.1 North America Die Bonding Technology Market by Country
7.2 North America Wafer Bonding Technology Market by Country
7.3 North America Semiconductor Bonding Market by Wafer Bonding Technology Type
7.3.1 North America Direct & Anodic Wafer Bonding Market by Country
7.3.2 North America Indirect Wafer Bonding Market by Country
Chapter 8. North America Semiconductor Bonding Market by Process Type
8.1 North America Die To Die Bonding Market by Country
8.2 North America Wafer To Wafer Bonding Market by Country
8.3 North America Die To Wafer Bonding Market by Country
Chapter 9. North America Semiconductor Bonding Market by Country
9.1 US Semiconductor Bonding Market
9.1.1 US Semiconductor Bonding Market by Application
9.1.2 US Semiconductor Bonding Market by Type
9.1.3 US Semiconductor Bonding Market by Bonding Technology
9.1.3.1 US Semiconductor Bonding Market by Wafer Bonding Technology Type
9.1.4 US Semiconductor Bonding Market by Process Type
9.2 Canada Semiconductor Bonding Market
9.2.1 Canada Semiconductor Bonding Market by Application
9.2.2 Canada Semiconductor Bonding Market by Type
9.2.3 Canada Semiconductor Bonding Market by Bonding Technology
9.2.3.1 Canada Semiconductor Bonding Market by Wafer Bonding Technology Type
9.2.4 Canada Semiconductor Bonding Market by Process Type
9.3 Mexico Semiconductor Bonding Market
9.3.1 Mexico Semiconductor Bonding Market by Application
9.3.2 Mexico Semiconductor Bonding Market by Type
9.3.3 Mexico Semiconductor Bonding Market by Bonding Technology
9.3.3.1 Mexico Semiconductor Bonding Market by Wafer Bonding Technology Type
9.3.4 Mexico Semiconductor Bonding Market by Process Type
9.4 Rest of North America Semiconductor Bonding Market
9.4.1 Rest of North America Semiconductor Bonding Market by Application
9.4.2 Rest of North America Semiconductor Bonding Market by Type
9.4.3 Rest of North America Semiconductor Bonding Market by Bonding Technology
9.4.3.1 Rest of North America Semiconductor Bonding Market by Wafer Bonding Technology Type
9.4.4 Rest of North America Semiconductor Bonding Market by Process Type
Chapter 10. Company Profiles
10.1 Mycronic AB
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Segmental and Regional Analysis
10.1.4 Research & Development Expenses
10.1.5 SWOT Analysis
10.2 TDK Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Regional & Segmental Analysis
10.2.4 Research & Development Expenses
10.2.5 SWOT Analysis
10.3 EV Group
10.3.1 Company Overview
10.3.2 Recent strategies and developments:
10.3.2.1 Partnerships, Collaborations, and Agreements:
10.3.3 SWOT Analysis
10.4 Panasonic Holdings Corporation
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Segmental and Regional Analysis
10.4.4 Research & Development Expenses
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.4.6 SWOT Analysis
10.5 Tokyo Electron Ltd.
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Segmental and Regional Analysis
10.5.4 Research & Development Expenses
10.5.5 Recent strategies and developments:
10.5.5.1 Product Launches and Product Expansions:
10.5.6 SWOT Analysis
10.6 Mitsubishi Electric Corporation
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Research & Development Expense
10.6.5 Recent strategies and developments:
10.6.5.1 Partnerships, Collaborations, and Agreements:
10.6.6 SWOT Analysis
10.7 Intel Corporation
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Segmental and Regional Analysis
10.7.4 Research & Development Expenses
10.7.5 SWOT Analysis
10.8 SÜSS MicroTec SE
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Partnerships, Collaborations, and Agreements:
10.8.5.2 Product Launches and Product Expansions:
10.8.6 SWOT Analysis
10.9 Fuji Corporation (Fasford Technology Co., Ltd.)
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Segmental and Regional Analysis
10.9.4 Research & Development Expenses
10.9.5 SWOT Analysis
10.10. Shibuara Mechatronics Corporation
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental Analysis
10.10.4 Research & Development-Related Investments
10.10.5 SWOT Analysis
TABLE 1 North America Semiconductor Bonding Market, 2019 - 2022, USD Million
TABLE 2 North America Semiconductor Bonding Market, 2023 - 2030, USD Million
TABLE 3 North America Semiconductor Bonding Market by Application, 2019 - 2022, USD Million
TABLE 4 North America Semiconductor Bonding Market by Application, 2023 - 2030, USD Million
TABLE 5 North America LED Market by Country, 2019 - 2022, USD Million
TABLE 6 North America LED Market by Country, 2023 - 2030, USD Million
TABLE 7 North America Mems & Sensors Market by Country, 2019 - 2022, USD Million
TABLE 8 North America Mems & Sensors Market by Country, 2023 - 2030, USD Million
TABLE 9 North America RF Devices Market by Country, 2019 - 2022, USD Million
TABLE 10 North America RF Devices Market by Country, 2023 - 2030, USD Million
TABLE 11 North America CMOS Image Sensors Market by Country, 2019 - 2022, USD Million
TABLE 12 North America CMOS Image Sensors Market by Country, 2023 - 2030, USD Million
TABLE 13 North America 3D NAND Market by Country, 2019 - 2022, USD Million
TABLE 14 North America 3D NAND Market by Country, 2023 - 2030, USD Million
TABLE 15 North America Semiconductor Bonding Market by Type, 2019 - 2022, USD Million
TABLE 16 North America Semiconductor Bonding Market by Type, 2023 - 2030, USD Million
TABLE 17 North America Wafer Bonder Market by Country, 2019 - 2022, USD Million
TABLE 18 North America Wafer Bonder Market by Country, 2023 - 2030, USD Million
TABLE 19 North America Die Bonder Market by Country, 2019 - 2022, USD Million
TABLE 20 North America Die Bonder Market by Country, 2023 - 2030, USD Million
TABLE 21 North America Flip Chip Bonder Market by Country, 2019 - 2022, USD Million
TABLE 22 North America Flip Chip Bonder Market by Country, 2023 - 2030, USD Million
TABLE 23 North America Semiconductor Bonding Market by Bonding Technology, 2019 - 2022, USD Million
TABLE 24 North America Semiconductor Bonding Market by Bonding Technology, 2023 - 2030, USD Million
TABLE 25 North America Die Bonding Technology Market by Country, 2019 - 2022, USD Million
TABLE 26 North America Die Bonding Technology Market by Country, 2023 - 2030, USD Million
TABLE 27 North America Wafer Bonding Technology Market by Country, 2019 - 2022, USD Million
TABLE 28 North America Wafer Bonding Technology Market by Country, 2023 - 2030, USD Million
TABLE 29 North America Semiconductor Bonding Market by Wafer Bonding Technology Type, 2019 - 2022, USD Million
TABLE 30 North America Semiconductor Bonding Market by Wafer Bonding Technology Type, 2023 - 2030, USD Million
TABLE 31 North America Direct & Anodic Wafer Bonding Market by Country, 2019 - 2022, USD Million
TABLE 32 North America Direct & Anodic Wafer Bonding Market by Country, 2023 - 2030, USD Million
TABLE 33 North America Indirect Wafer Bonding Market by Country, 2019 - 2022, USD Million
TABLE 34 North America Indirect Wafer Bonding Market by Country, 2023 - 2030, USD Million
TABLE 35 North America Semiconductor Bonding Market by Process Type, 2019 - 2022, USD Million
TABLE 36 North America Semiconductor Bonding Market by Process Type, 2023 - 2030, USD Million
TABLE 37 North America Die To Die Bonding Market by Country, 2019 - 2022, USD Million
TABLE 38 North America Die To Die Bonding Market by Country, 2023 - 2030, USD Million
TABLE 39 North America Wafer To Wafer Bonding Market by Country, 2019 - 2022, USD Million
TABLE 40 North America Wafer To Wafer Bonding Market by Country, 2023 - 2030, USD Million
TABLE 41 North America Die To Wafer Bonding Market by Country, 2019 - 2022, USD Million
TABLE 42 North America Die To Wafer Bonding Market by Country, 2023 - 2030, USD Million
TABLE 43 North America Semiconductor Bonding Market by Country, 2019 - 2022, USD Million
TABLE 44 North America Semiconductor Bonding Market by Country, 2023 - 2030, USD Million
TABLE 45 US Semiconductor Bonding Market, 2019 - 2022, USD Million
TABLE 46 US Semiconductor Bonding Market, 2023 - 2030, USD Million
TABLE 47 US Semiconductor Bonding Market by Application, 2019 - 2022, USD Million
TABLE 48 US Semiconductor Bonding Market by Application, 2023 - 2030, USD Million
TABLE 49 US Semiconductor Bonding Market by Type, 2019 - 2022, USD Million
TABLE 50 US Semiconductor Bonding Market by Type, 2023 - 2030, USD Million
TABLE 51 US Semiconductor Bonding Market by Bonding Technology, 2019 - 2022, USD Million
TABLE 52 US Semiconductor Bonding Market by Bonding Technology, 2023 - 2030, USD Million
TABLE 53 US Semiconductor Bonding Market by Wafer Bonding Technology Type, 2019 - 2022, USD Million
TABLE 54 US Semiconductor Bonding Market by Wafer Bonding Technology Type, 2023 - 2030, USD Million
TABLE 55 US Semiconductor Bonding Market by Process Type, 2019 - 2022, USD Million
TABLE 56 US Semiconductor Bonding Market by Process Type, 2023 - 2030, USD Million
TABLE 57 Canada Semiconductor Bonding Market, 2019 - 2022, USD Million
TABLE 58 Canada Semiconductor Bonding Market, 2023 - 2030, USD Million
TABLE 59 Canada Semiconductor Bonding Market by Application, 2019 - 2022, USD Million
TABLE 60 Canada Semiconductor Bonding Market by Application, 2023 - 2030, USD Million
TABLE 61 Canada Semiconductor Bonding Market by Type, 2019 - 2022, USD Million
TABLE 62 Canada Semiconductor Bonding Market by Type, 2023 - 2030, USD Million
TABLE 63 Canada Semiconductor Bonding Market by Bonding Technology, 2019 - 2022, USD Million
TABLE 64 Canada Semiconductor Bonding Market by Bonding Technology, 2023 - 2030, USD Million
TABLE 65 Canada Semiconductor Bonding Market by Wafer Bonding Technology Type, 2019 - 2022, USD Million
TABLE 66 Canada Semiconductor Bonding Market by Wafer Bonding Technology Type, 2023 - 2030, USD Million
TABLE 67 Canada Semiconductor Bonding Market by Process Type, 2019 - 2022, USD Million
TABLE 68 Canada Semiconductor Bonding Market by Process Type, 2023 - 2030, USD Million
TABLE 69 Mexico Semiconductor Bonding Market, 2019 - 2022, USD Million
TABLE 70 Mexico Semiconductor Bonding Market, 2023 - 2030, USD Million
TABLE 71 Mexico Semiconductor Bonding Market by Application, 2019 - 2022, USD Million
TABLE 72 Mexico Semiconductor Bonding Market by Application, 2023 - 2030, USD Million
TABLE 73 Mexico Semiconductor Bonding Market by Type, 2019 - 2022, USD Million
TABLE 74 Mexico Semiconductor Bonding Market by Type, 2023 - 2030, USD Million
TABLE 75 Mexico Semiconductor Bonding Market by Bonding Technology, 2019 - 2022, USD Million
TABLE 76 Mexico Semiconductor Bonding Market by Bonding Technology, 2023 - 2030, USD Million
TABLE 77 Mexico Semiconductor Bonding Market by Wafer Bonding Technology Type, 2019 - 2022, USD Million
TABLE 78 Mexico Semiconductor Bonding Market by Wafer Bonding Technology Type, 2023 - 2030, USD Million
TABLE 79 Mexico Semiconductor Bonding Market by Process Type, 2019 - 2022, USD Million
TABLE 80 Mexico Semiconductor Bonding Market by Process Type, 2023 - 2030, USD Million
TABLE 81 Rest of North America Semiconductor Bonding Market, 2019 - 2022, USD Million
TABLE 82 Rest of North America Semiconductor Bonding Market, 2023 - 2030, USD Million
TABLE 83 Rest of North America Semiconductor Bonding Market by Application, 2019 - 2022, USD Million
TABLE 84 Rest of North America Semiconductor Bonding Market by Application, 2023 - 2030, USD Million
TABLE 85 Rest of North America Semiconductor Bonding Market by Type, 2019 - 2022, USD Million
TABLE 86 Rest of North America Semiconductor Bonding Market by Type, 2023 - 2030, USD Million
TABLE 87 Rest of North America Semiconductor Bonding Market by Bonding Technology, 2019 - 2022, USD Million
TABLE 88 Rest of North America Semiconductor Bonding Market by Bonding Technology, 2023 - 2030, USD Million
TABLE 89 Rest of North America Semiconductor Bonding Market by Wafer Bonding Technology Type, 2019 - 2022, USD Million
TABLE 90 Rest of North America Semiconductor Bonding Market by Wafer Bonding Technology Type, 2023 - 2030, USD Million
TABLE 91 Rest of North America Semiconductor Bonding Market by Process Type, 2019 - 2022, USD Million
TABLE 92 Rest of North America Semiconductor Bonding Market by Process Type, 2023 - 2030, USD Million
TABLE 93 Key Information – Mycronic AB
TABLE 94 Key information – TDK Corporation
TABLE 95 Key Information – EV Group
TABLE 96 Key Information – panasonic holdings corporation
TABLE 97 Key Information – Tokyo Electron Ltd.
TABLE 98 key Information – Mitsubishi Electric Corporation
TABLE 99 Key Information – Intel Corporation
TABLE 100 Key Information – SÜSS MicroTec SE
TABLE 101 Key Information – Fuji Corporation
TABLE 102 Key Information – Shibuara Mechatronics Corporation
List of Figures
FIG 1 Methodology for the research
FIG 2 North America Semiconductor Bonding Market, 2019 - 2030, USD Million
FIG 3 Key Impacting Factors semiconductor bonding market
FIG 4 Porter’s Five Force Analysis: Semiconductor Bonding Market
FIG 5 North America Semiconductor Bonding Market share by Application, 2022
FIG 6 North America Semiconductor Bonding Market share by Application, 2030
FIG 7 North America Semiconductor Bonding Market by Application, 2019 - 2030, USD Million
FIG 8 North America Semiconductor Bonding Market share by Type, 2022
FIG 9 North America Semiconductor Bonding Market share by Type, 2030
FIG 10 North America Semiconductor Bonding Market by Type, 2019 - 2030, USD Million
FIG 11 North America Semiconductor Bonding Market share by Bonding Technology, 2022
FIG 12 North America Semiconductor Bonding Market share by Bonding Technology, 2030
FIG 13 North America Semiconductor Bonding Market by Bonding Technology, 2019 - 2030, USD Million
FIG 14 North America Semiconductor Bonding Market share by Process Type, 2022
FIG 15 North America Semiconductor Bonding Market share by Process Type, 2030
FIG 16 North America Semiconductor Bonding Market by Process Type, 2019 - 2030, USD Million
FIG 17 North America Semiconductor Bonding Market share by Country, 2022
FIG 18 North America Semiconductor Bonding Market share by Country, 2030
FIG 19 North America Semiconductor Bonding Market by Country, 2019 - 2030, USD Million
FIG 20 SWOT Analysis: Mycronic AB
FIG 21 SWOT Analysis: TDK Corporation
FIG 22 SWOT Analysis: EV Group
FIG 23 SWOT Analysis: Panasonic Holdings Corporation
FIG 24 SWOT Analysis: Tokyo Electron Ltd.
FIG 25 SWOT Analysis: Mitsubishi Electric Corporation
FIG 26 SWOT Analysis: Intel corporation
FIG 27 Recent strategies and developments: SÜSS MicroTec SE
FIG 28 SWOT Analysis: SÜSS MicroTec SE
FIG 29 SWOT Analysis: FUJI CORPORATION
FIG 30 SWOT Analysis: Shibuara Mechatronics Corporation