Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Board-to-Board Connectors Market, by Type
1.4.2 North America Board-to-Board Connectors Market, by Pitch
1.4.3 North America Board-to-Board Connectors Market, by Application
1.4.4 North America Board-to-Board Connectors Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2020, Jan – 2023, Jul) Leading Players
4.5 Porter’s Five Force Analysis
Chapter 5. North America Board-to-Board Connectors Market by Type
5.1 North America Pin Headers Market by Country
5.2 North America Board-to-Board Connectors Market by Pin Headers Type
5.2.1 North America Stacked Header Market by Country
5.2.2 North America Shrouded Header Market by Country
5.3 North America Socket Market by Country
Chapter 6. North America Board-to-Board Connectors Market by Pitch
6.1 North America 1 mm to 2 mm Market by Country
6.2 North America Greater Than 2 mm Market by Country
6.3 North America Less Than 1 mm Market by Country
Chapter 7. North America Board-to-Board Connectors Market by Application
7.1 North America Consumer Electronics Market by Country
7.2 North America Automotive Market by Country
7.3 North America Industrial Automation Market by Country
7.4 North America Healthcare Market by Country
7.5 North America Telecommunication Market by Country
7.6 North America Others Market by Country
Chapter 8. North America Board-to-Board Connectors Market by Country
8.1 US Board-to-Board Connectors Market
8.1.1 US Board-to-Board Connectors Market by Type
8.1.1.1 US Board-to-Board Connectors Market by Pin Headers Type
8.1.2 US Board-to-Board Connectors Market by Pitch
8.1.3 US Board-to-Board Connectors Market by Application
8.2 Canada Board-to-Board Connectors Market
8.2.1 Canada Board-to-Board Connectors Market by Type
8.2.1.1 Canada Board-to-Board Connectors Market by Pin Headers Type
8.2.2 Canada Board-to-Board Connectors Market by Pitch
8.2.3 Canada Board-to-Board Connectors Market by Application
8.3 Mexico Board-to-Board Connectors Market
8.3.1 Mexico Board-to-Board Connectors Market by Type
8.3.1.1 Mexico Board-to-Board Connectors Market by Pin Headers Type
8.3.2 Mexico Board-to-Board Connectors Market by Pitch
8.3.3 Mexico Board-to-Board Connectors Market by Application
8.4 Rest of North America Board-to-Board Connectors Market
8.4.1 Rest of North America Board-to-Board Connectors Market by Type
8.4.1.1 Rest of North America Board-to-Board Connectors Market by Pin Headers Type
8.4.2 Rest of North America Board-to-Board Connectors Market by Pitch
8.4.3 Rest of North America Board-to-Board Connectors Market by Application
Chapter 9. Company Profiles
9.1 Amphenol Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 TE Connectivity Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expense
9.2.5 Recent strategies and developments:
9.2.5.1 Acquisition and Mergers:
9.2.5.2 Product Launches and Product Expansions:
9.2.5.3 Partnerships, Collaborations, and Agreements:
9.2.6 SWOT Analysis
9.3 Molex, LLC (Koch Industries, Inc.)
9.3.1 Company Overview
9.3.2 Recent strategies and developments:
9.3.2.1 Product Launches and Product Expansions:
9.3.2.2 Acquisition and Mergers:
9.3.3 SWOT Analysis
9.4 Kyocera Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.6 SWOT Analysis
9.5 HARTING Technology Group
9.5.1 Company Overview
9.5.2 Recent strategies and developments:
9.5.2.1 Partnerships, Collaborations, and Agreements:
9.5.3 SWOT Analysis
9.6 Omron Corporation
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Product Launches and Product Expansions:
9.6.6 SWOT Analysis
9.7 Japan Aviation Electronics Industry, Limited
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental Analysis
9.7.4 Recent strategies and developments:
9.7.4.1 Product Launches and Product Expansions:
9.7.5 SWOT Analysis
9.8 Hirose Electric Co., Ltd
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Recent strategies and developments:
9.8.4.1 Partnerships, Collaborations, and Agreements:
9.8.4.2 Product Launches and Product Expansions:
9.8.5 SWOT Analysis
9.9 Samtec
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. FIT Hon Teng Limited (Foxconn (Far East) Limited)
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis
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