North America Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2), 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031

The North America Advanced Packaging Market would witness market growth of 8.4% CAGR during the forecast period (2024-2031).

The US market dominated the North America Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $13,735.8 million by 2031. The Canada market is experiencing a CAGR of 10.8% during (2024 - 2031). Additionally, The Mexico market would exhibit a CAGR of 9.8% during (2024 - 2031).

Advanced packaging refers to cutting-edge techniques and technologies used in the semiconductor industry to integrate and package electronic chips to enhance their performance, efficiency, and functionality. Unlike traditional packaging methods, which primarily focus on protecting the chips and providing electrical connections, advanced packaging is designed to meet the increasing demands for miniaturization, high-speed data transfer, low power consumption, and effective thermal management. It is crucial in enabling modern electronic devices to deliver superior performance in compact form factors.

At its core, advanced packaging involves the arrangement and interconnection of semiconductor components, such as processors, memory, and sensors, into a single package. This integration is achieved using innovative techniques like System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), and 3D Integrated Circuits (3D IC). These methods allow multiple chips or components to be combined in a compact design, enabling faster communication between components, improved energy efficiency, and enhanced reliability. Advanced packaging also facilitates heterogeneous integration, where chips of different types, functionalities, or process technologies are integrated into a single unit.

The U.S. government’s strong support for domestic semiconductor manufacturing further bolsters the advanced packaging market. For example, the CHIPS for America Act funds the development of semiconductors and advanced packaging fabrication facilities nationwide, fostering innovation and production capabilities. The National Institute of Standards and Technology (NIST) also extended its funding programs through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures underscore the growing need for robust advanced packaging solutions to optimize electronic system performance and meet escalating market demands. As a result, North America remains a lucrative and rapidly growing region for the advanced packaging market throughout the forecast period.

Free Valuable Insights: The Advanced Packaging Market is Predict to reach USD 73.16 Billion by 2031, at a CAGR of 9.2%

Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

List of Key Companies Profiled

• Qualcomm Incorporated (Qualcomm Technologies, Inc.)
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Microchip Technology Incorporated
• Infineon Technologies AG
• Samsung Electronics Co., Ltd. (Samsung Group)
• Renesas Electronics Corporation
• VMware, Inc. (Broadcom Inc.)

North America Advanced Packaging Market Report Segmentation

By Type

• Flip-Chip Ball Grid Array
• Fan-out WLP
• Flip chip CSP
• Wafer level CSP
• 5D/3D
• Other Type

By End User

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End User

By Country

• US
• Canada
• Mexico
• Rest of North America

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Advanced Packaging Market, by Type
1.4.2 North America Advanced Packaging Market, by End User
1.4.3 North America Advanced Packaging Market, by Country
1.5 Methodology for the research

Chapter 2. Market at a Glance
2.1 Key Highlights

Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges

Chapter 4. Competition Analysis – Global
4.1 Market Share Analysis, 2023
4.2 Strategies Deployed in Advanced Packaging Market
4.3 Porter Five Forces Analysis

Chapter 5. North America Advanced Packaging Market by Type
5.1 North America Flip-Chip Ball Grid Array Market by Country
5.2 North America Fan-out WLP Market by Country
5.3 North America Flip chip CSP Market by Country
5.4 North America Wafer level CSP Market by Country
5.5 North America 2.5D/3D Market by Country
5.6 North America Other Type Market by Country

Chapter 6. North America Advanced Packaging Market by End User
6.1 North America Consumer Electronics Market by Country
6.2 North America Automotive Market by Country
6.3 North America Industrial Market by Country
6.4 North America Healthcare Market by Country
6.5 North America Aerospace & Defense Market by Country
6.6 North America Other End User Market by Country

Chapter 7. North America Advanced Packaging Market by Country
7.1 US Advanced Packaging Market
7.1.1 US Advanced Packaging Market by Type
7.1.2 US Advanced Packaging Market by End User
7.2 Canada Advanced Packaging Market
7.2.1 Canada Advanced Packaging Market by Type
7.2.2 Canada Advanced Packaging Market by End User
7.3 Mexico Advanced Packaging Market
7.3.1 Mexico Advanced Packaging Market by Type
7.3.2 Mexico Advanced Packaging Market by End User
7.4 Rest of North America Advanced Packaging Market
7.4.1 Rest of North America Advanced Packaging Market by Type
7.4.2 Rest of North America Advanced Packaging Market by End User

Chapter 8. Company Profiles
8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Intel Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expenses
8.2.5 Recent strategies and developments:
8.2.5.1 Partnerships, Collaborations, and Agreements:
8.2.5.2 Acquisition and Mergers:
8.2.6 SWOT Analysis
8.3 IBM Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.3.5.2 Product Launches and Product Expansions:
8.3.6 SWOT Analysis
8.4 Texas Instruments, Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Analog Devices, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 SWOT Analysis
8.6 Microchip Technology Incorporated
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 SWOT Analysis
8.7 Infineon Technologies AG
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 SWOT Analysis
8.8 Samsung Electronics Co., Ltd. (Samsung Group)
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expenses
8.8.5 SWOT Analysis
8.9 Renesas Electronics Corporation
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. VMware, Inc. (Broadcom Inc.)
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Segmental and Regional Analysis
8.10.4 Research & Development Expense
8.10.5 SWOT Analysis

TABLE 1 North America Advanced Packaging Market, 2020 - 2023, USD Million
TABLE 2 North America Advanced Packaging Market, 2024 - 2031, USD Million
TABLE 3 North America Advanced Packaging Market by Type, 2020 - 2023, USD Million
TABLE 4 North America Advanced Packaging Market by Type, 2024 - 2031, USD Million
TABLE 5 North America Flip-Chip Ball Grid Array Market by Country, 2020 - 2023, USD Million
TABLE 6 North America Flip-Chip Ball Grid Array Market by Country, 2024 - 2031, USD Million
TABLE 7 North America Fan-out WLP Market by Country, 2020 - 2023, USD Million
TABLE 8 North America Fan-out WLP Market by Country, 2024 - 2031, USD Million
TABLE 9 North America Flip chip CSP Market by Country, 2020 - 2023, USD Million
TABLE 10 North America Flip chip CSP Market by Country, 2024 - 2031, USD Million
TABLE 11 North America Wafer level CSP Market by Country, 2020 - 2023, USD Million
TABLE 12 North America Wafer level CSP Market by Country, 2024 - 2031, USD Million
TABLE 13 North America 2.5D/3D Market by Country, 2020 - 2023, USD Million
TABLE 14 North America 2.5D/3D Market by Country, 2024 - 2031, USD Million
TABLE 15 North America Other Type Market by Country, 2020 - 2023, USD Million
TABLE 16 North America Other Type Market by Country, 2024 - 2031, USD Million
TABLE 17 North America Advanced Packaging Market by End User, 2020 - 2023, USD Million
TABLE 18 North America Advanced Packaging Market by End User, 2024 - 2031, USD Million
TABLE 19 North America Consumer Electronics Market by Country, 2020 - 2023, USD Million
TABLE 20 North America Consumer Electronics Market by Country, 2024 - 2031, USD Million
TABLE 21 North America Automotive Market by Country, 2020 - 2023, USD Million
TABLE 22 North America Automotive Market by Country, 2024 - 2031, USD Million
TABLE 23 North America Industrial Market by Country, 2020 - 2023, USD Million
TABLE 24 North America Industrial Market by Country, 2024 - 2031, USD Million
TABLE 25 North America Healthcare Market by Country, 2020 - 2023, USD Million
TABLE 26 North America Healthcare Market by Country, 2024 - 2031, USD Million
TABLE 27 North America Aerospace & Defense Market by Country, 2020 - 2023, USD Million
TABLE 28 North America Aerospace & Defense Market by Country, 2024 - 2031, USD Million
TABLE 29 North America Other End User Market by Country, 2020 - 2023, USD Million
TABLE 30 North America Other End User Market by Country, 2024 - 2031, USD Million
TABLE 31 North America Advanced Packaging Market by Country, 2020 - 2023, USD Million
TABLE 32 North America Advanced Packaging Market by Country, 2024 - 2031, USD Million
TABLE 33 US Advanced Packaging Market, 2020 - 2023, USD Million
TABLE 34 US Advanced Packaging Market, 2024 - 2031, USD Million
TABLE 35 US Advanced Packaging Market by Type, 2020 - 2023, USD Million
TABLE 36 US Advanced Packaging Market by Type, 2024 - 2031, USD Million
TABLE 37 US Advanced Packaging Market by End User, 2020 - 2023, USD Million
TABLE 38 US Advanced Packaging Market by End User, 2024 - 2031, USD Million
TABLE 39 Canada Advanced Packaging Market, 2020 - 2023, USD Million
TABLE 40 Canada Advanced Packaging Market, 2024 - 2031, USD Million
TABLE 41 Canada Advanced Packaging Market by Type, 2020 - 2023, USD Million
TABLE 42 Canada Advanced Packaging Market by Type, 2024 - 2031, USD Million
TABLE 43 Canada Advanced Packaging Market by End User, 2020 - 2023, USD Million
TABLE 44 Canada Advanced Packaging Market by End User, 2024 - 2031, USD Million
TABLE 45 Mexico Advanced Packaging Market, 2020 - 2023, USD Million
TABLE 46 Mexico Advanced Packaging Market, 2024 - 2031, USD Million
TABLE 47 Mexico Advanced Packaging Market by Type, 2020 - 2023, USD Million
TABLE 48 Mexico Advanced Packaging Market by Type, 2024 - 2031, USD Million
TABLE 49 Mexico Advanced Packaging Market by End User, 2020 - 2023, USD Million
TABLE 50 Mexico Advanced Packaging Market by End User, 2024 - 2031, USD Million
TABLE 51 Rest of North America Advanced Packaging Market, 2020 - 2023, USD Million
TABLE 52 Rest of North America Advanced Packaging Market, 2024 - 2031, USD Million
TABLE 53 Rest of North America Advanced Packaging Market by Type, 2020 - 2023, USD Million
TABLE 54 Rest of North America Advanced Packaging Market by Type, 2024 - 2031, USD Million
TABLE 55 Rest of North America Advanced Packaging Market by End User, 2020 - 2023, USD Million
TABLE 56 Rest of North America Advanced Packaging Market by End User, 2024 - 2031, USD Million
TABLE 57 Key Information – Qualcomm Incorporated
TABLE 58 Key Information – Intel Corporation
TABLE 59 Key Information – IBM Corporation
TABLE 60 Key Information – Texas Instruments, Inc.
TABLE 61 key information – Analog Devices, Inc.
TABLE 62 Key Information – Microchip Technology Incorporated
TABLE 63 Key Information – Infineon Technologies AG
TABLE 64 Key Information – Samsung Electronics Co., Ltd.
TABLE 65 Key Information – Renesas Electronics Corporation
TABLE 66 Key Information – VMware, Inc.

List of Figures
FIG 1 Methodology for the research
FIG 2 North America Advanced Packaging Market, 2020 - 2031, USD Million
FIG 3 Key Factors Impacting Advanced Packaging Market
FIG 4 Market Share Analysis, 2023
FIG 5 Porter’s Five Forces Analysis – Advanced Packaging Market
FIG 6 North America Advanced Packaging Market share by Type, 2023
FIG 7 North America Advanced Packaging Market share by Type, 2031
FIG 8 North America Advanced Packaging Market by Type, 2020 - 2031, USD Million
FIG 9 North America Advanced Packaging Market share by End User, 2023
FIG 10 North America Advanced Packaging Market share by End User, 2031
FIG 11 North America Advanced Packaging Market by End User, 2020 - 2031, USD Million
FIG 12 North America Advanced Packaging Market share by Country, 2023
FIG 13 North America Advanced Packaging Market share by Country, 2031
FIG 14 North America Advanced Packaging Market by Country, 2020 - 2031, USD Million
FIG 15 SWOT Analysis: QUALCOMM Incorporated
FIG 16 Recent strategies and developments: Intel corporation
FIG 17 SWOT Analysis: Intel corporation
FIG 18 Recent strategies and developments: IBM Corporation
FIG 19 SWOT Analysis: IBM Corporation
FIG 20 SWOT Analysis: Texas Instruments, Inc.
FIG 21 SWOT Analysis: Analog Devices, Inc.
FIG 22 SWOT Analysis: Microchip Technology Incorporated
FIG 23 SWOT Analysis: Infineon Technologies AG
FIG 24 SWOT Analysis: Samsung Electronics Co., Ltd.
FIG 25 SWOT Analysis: Renesas Electronics Corporation
FIG 26 SWOT Analysis: VMware, Inc.