North America System in Package (SiP) Technology Market expected to grow at a CAGR of 11.7% during 2016-2022

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According to a new report, North America System in Package (SiP) Technology Market , published by KBV Research, the North America System in Package (SiP) Technology Market expected to grow at a CAGR of 11.7% during 2016 -2022.The U.S market dominated the North America System in Package (SiP) Technology Market in 2015, and would reach a market size of $4.3 billion by 2022, growing at a CAGR of 11% during the forecast period. The Canada market is expected to attain a market size of $851 million by 2022. However, Mexico market is expected to grow at CAGR of 13.3% during 2016-2022.

The 2.5-D IC Packaging market contributed the larger revenue share to the North America System in Package (SiP) Technology Market in 2015, and would reach a market size of $2.5 billion by 2022, growing at a CAGR of 10.4% during the forecast period. The Consumer Electronics market is anticipated to grow at a CAGR of 8.7% during the forecast period. The Flip Chip market dominated the North America System in Package (SiP) Technology Market in 2015. The Wire Bond market is expected attain a market size of $2.2 billion by 2022.

The report highlights the adoption of System in Package (SiP) Technology in North America.Based on the Type, the Global System in Package (SiP) Technology market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging segments. Based on the Packaging Type, the market is bifurcated into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages and Other Packaging segments. The North America System in Package (SiP) Technology market is further segmented into Wire Bond, Flip Chip segments based on the Interconnection Technology. Further, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace &Defense and Other segments based on the various applications.The countries included in the report are U.S, Canada, Mexico and Rest of North America.

Key Players profiled in the report includes Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technology Inc., Ase Group, Renesas Electronics Corporation, Samsung Electronics Co. Ltd. and Toshiba Corporation.

Full report: https://www.kbvresearch.com/north-america-system-in-package-sip-technology-market/

Research Scope

The market is segmented based on Type, Packaging Type, Interconnection Technology, Application and Country.

North America System in Package (SiP) Technology Market, by Type

  • 2-D IC Packaging
  • 5-D IC Packaging
  • 3-D IC Packaging

North America System in Package (SiP) Technology Market, by Packaging Type

  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Small Outline Packages
  • Other Packaging

North America System in Package (SiP) Technology Market, by Interconnection Technology

  • Wire Bond
  • Flip Chip

North America System in Package (SiP) Technology Market, by Application

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace &Defense
  • Others

North America System in Package (SiP) Technology Market, by Country

  • U.S
  • Canada
  • Mexico
  • Rest of North America

Company Profiles

  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Chipmos Technologies Inc.
  • Powertech Technology Inc.
  • Ase Group
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • Toshiba Corporation

Related Reports:

Asia Pacific System in Package (SiP) Technology Market

Europe System in Package (SiP) Technology Market

Global Systems in Package (SiP) Technology Market

Lamea System in Package (SiP) Technology Market

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