Global System in Package (SiP) Technology Market By Type (2-D IC, 2.5-D IC, 3-D IC), Packaging Type (Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages), Interconnection Technology (Wire Bond Packaging, Flip Chip Packaging), Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense)
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Market Report Description
The Global System in Package (SiP) Technology Market Size is expected to reach $29.3 billion by 2022, growing at a CAGR of 10.9% during 2016 -2022. SiP is a packaging technology, containing multiple die within a single module. It is a combination of different integrated circuits in a compact size, reducing the cost of development and assembling of a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps. Several applications such as consumer electronics, automotive, and telecommunication incorporate SiP due to superior efficiency levels and durability. Integrating circuits and bringing together multiple package assemblies are the key strengths of the SiP technology.
The System in Packaging gives faster time to market, lower research and development cost, more integration adaptability and lower research and development cost, more integration adaptability and lower product cost than system on chip (SOC). The System in Packaging has grown into a fastest growing packaging technology segment, facilitating devices such as cellular phones, laptops, cameras and commercial products. The global system in package (SiP) technology market would witness significant growth during the forecast period due to growing demand for portable electronic devices and growing popularity of Internet of Things (IoT). Printed circuit board (PCB) based ICs were mostly used in industrial systems for data transmission. However, other industries such as consumer electronics, energy & power, inverter & UPS, and automotive, have shifted to SiP to efficiently manage data transfer. The report highlights the adoption of System in Package (SiP) Technology, globally.
Based on the Type, the Global System in Package (SiP) Technology market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging segments. Based on the Packaging Type, the market is bifurcated into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages and Other Packaging segments. The global System in Package (SiP) Technology market is further segmented into Wire Bond, Flip Chip segments based on the Interconnection Technology. Further, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense and Other segments based on the various applications. The geographies included in the report are North America, Europe, Asia Pacific and LAMEA (Latin America, Middle East and Africa).
Key Players profiled in the report includes Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technology Inc., Ase Group, Renesas Electronics Corporation, Samsung Electronics Co. Ltd. and Toshiba Corporation.