According to a new report North America Advanced Packaging Market, published by KBV research, the North America Advanced Packaging Market would witness market growth of 11.6% CAGR during the forecast period (2020-2026).
The US market dominated the North America Advanced Packaging Flip Chip CSP Market by Country 2019, growing at a CAGR of 10.2 % during the forecast period. The Canada market is poised to grow at a CAGR of 13.5% during (2020 - 2026). Additionally, The Mexico market would witness a CAGR of 12.5% during (2020 - 2026).
The Consumer Electronics market dominated the Canada Advanced Packaging Market by End User 2019, growing at a CAGR of 13.3 % during the forecast period. The Automotive market would witness a CAGR of 14.7% during (2020 - 2026). The Industrial market is exhibiting a CAGR of 15.9% during (2020 - 2026). Additionally, The Aerospace & Defense market is anticipated to grow at a CAGR of 16.5% during (2020 - 2026).
The Flip-Chip Ball Grid Array market dominated the Mexico Advanced Packaging Market by Type 2019. The Flip Chip CSP market would showcase a CAGR of 12.5% during (2020 - 2026). Additionally, The Wafer Level CSP market is expected to witness CAGR of 14.1% during (2020 - 2026).
Report Structural Insights: https://www.kbvresearch.com/north-america-advanced-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
By Type
By End-User
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