Advanced Packaging Market in LAMEA would register a CAGR of 14.9% during 2020-2026

10-Jul-2020 | Report Format: Electronic (PDF)

Growth, Trends and Report Highlights

According to a new report LAMEA Advanced Packaging Market, published by KBV research, the LAMEA Advanced Packaging Market would witness market growth of 14.9% CAGR during the forecast period (2020-2026).

The Brazil market dominated the LAMEA Industrial Advanced Packaging Market by Country 2019, thereby, achieving a market value of $106.6 million by 2026. The Argentina market would witness a CAGR of 17.3% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 16.3% during (2020 - 2026).

The Flip-Chip Ball Grid Array market dominated the Saudi Arabia Advanced Packaging Market by Type 2019, growing at a CAGR of 13.9 % during the forecast period. The Flip Chip CSP market is expected to grow at a CAGR of 14.8% during (2020 - 2026). Additionally, The Wafer Level CSP market is expected to witness CAGR of 16.2% during (2020 - 2026).

The Consumer Electronics market dominated the South Africa Advanced Packaging Market by End User 2019, growing at a CAGR of 14.8 % during the forecast period. The Automotive market would exhibit a CAGR of 16.3% during (2020 - 2026). The Industrial market is witnessing a CAGR of 17.5% during (2020 - 2026). Additionally, The Aerospace & Defense market is showcasing a CAGR of 18.1% during (2020 - 2026).

Structural Insights: https://www.kbvresearch.com/lamea-advanced-packaging-market/

The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.

LAMEA Advanced Packaging Market Segmentation

By Type

  • Flip-Chip Ball Grid Array
  • Flip Chip CSP
  • Wafer Level CSP
  • 5D/3D
  • Others

By End-User

  • Consumer Electronics
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare & Life Sciences
  • Others

By Country

  • Brazil Advanced Packaging Market
  • Argentina Advanced Packaging Market
  • UAE Advanced Packaging Market
  • Saudi Arabia Advanced Packaging Market
  • South Africa Advanced Packaging Market
  • Nigeria Advanced Packaging Market
  • Rest of LAMEA Advanced Packaging Market

Companies Profiled

  • Qualcomm, Inc.
  • Intel Corporation
  • IBM Corporation
  • Texas Instruments, Inc.
  • Analog Devices, Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Amkor Technology, Inc.
  • Brewer Science, Inc.
  • Microchip Technology, Inc.

Unique Offerings from KBV Research

  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Advanced Packaging Market Related Reports:

Global Market

North America Market

Europe Market

Asia Pacific Market

SPECIAL PRICING & DISCOUNTS


  • Buy Sections of This Report
  • Buy Country Level Reports
  • Request for Historical Data
  • Discounts Available for Start-Ups & Universities
HAVE A QUESTION?

HAVE A QUESTION?

Call: +1(646) 600-5072

SPECIAL PRICING & DISCOUNTS


  • Buy Sections of This Report
  • Buy Country Level Reports
  • Request for Historical Data
  • Discounts Available for Start-Ups & Universities
HAVE A QUESTION?

HAVE A QUESTION?

Call: +1(646) 600-5072

Unique Offerings Unique Offerings


  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Support with 10% customization free after sale