According to a new report LAMEA Advanced Packaging Market, published by KBV research, the LAMEA Advanced Packaging Market would witness market growth of 14.9% CAGR during the forecast period (2020-2026).
The Brazil market dominated the LAMEA Industrial Advanced Packaging Market by Country 2019, thereby, achieving a market value of $106.6 million by 2026. The Argentina market would witness a CAGR of 17.3% during (2020 - 2026). Additionally, The UAE market is experiencing a CAGR of 16.3% during (2020 - 2026).
The Flip-Chip Ball Grid Array market dominated the Saudi Arabia Advanced Packaging Market by Type 2019, growing at a CAGR of 13.9 % during the forecast period. The Flip Chip CSP market is expected to grow at a CAGR of 14.8% during (2020 - 2026). Additionally, The Wafer Level CSP market is expected to witness CAGR of 16.2% during (2020 - 2026).
The Consumer Electronics market dominated the South Africa Advanced Packaging Market by End User 2019, growing at a CAGR of 14.8 % during the forecast period. The Automotive market would exhibit a CAGR of 16.3% during (2020 - 2026). The Industrial market is witnessing a CAGR of 17.5% during (2020 - 2026). Additionally, The Aerospace & Defense market is showcasing a CAGR of 18.1% during (2020 - 2026).
Structural Insights: https://www.kbvresearch.com/lamea-advanced-packaging-market/
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the mentioned countries. The key impacting factors of the market have been discussed in the report with the elaborated company profiles of Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
By Type
By End-User
By Country
Companies Profiled
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