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According to a new report Asia Pacific Wi-Fi Module Market, published by KBV research, the Asia Pacific Wi-Fi Module Market Size would witness market growth of 12.4% CAGR during the forecast period (2018 - 2024).
The China market dominated the Asia Pacific Wi-Fi Module Router Scheme Market by Country in 2017, growing at a CAGR of 8.6 % during the forecast period. The Japan market is expected to witness a CAGR of 8.8% during (2018 - 2024). Additionally, The India market is expected to witness a CAGR of 12.3% during (2018 - 2024).
The Smart Grid & Smart Appliance market dominated the Japan Wi-Fi Module Market by Application in 2017, thereby, achieving a market value of $1,184.1 million by 2024. The Handheld Mobile Device market is expected to witness a CAGR of 11.1% during (2018 - 2024). Additionally, The Medical & Industrial Testing Instrument market is expected to witness a CAGR of 11.3% during (2018 - 2024).
The market research report has exhaustive quantitative insights providing a clear picture of the market potential in various segments across the countries in the region. The key impacting factors of the Asia Pacific Wi-Fi Module Market have been discussed in the report with the elaborated company profiles of Murata Manufacturing Co., Ltd., Microchip Technology Incorporated, Taiyo Yuden Co., Ltd., AzureWave Technologies, Inc., Silicon Laboratories, Inc., Laird PLC,, BroadLink, Advantech Co., Ltd. (Advantech B+B SmartWorx Inc.), Shanghai MXCHIP Information Technology Co., Ltd. and Silex Technology, Inc.
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