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The Asia Pacific Wi-Fi Module Market would witness market growth of 12.4% CAGR during the forecast period (2018 - 2024). A Wi-Fi module is an independent system on a chip (SoC), integrated using TCPIP stack, which provides access to the Wi-Fi networks. Adoption of cloud computing and rapid growth in telecommunication, residential, and commercial sectors are contributing to the growth of the market.
However, privacy and security issues would limit market growth significantly. Based on Type, the market is segmented into Router Scheme and Embedded. Based on Application, the market is segmented into Smart Grid & Smart Appliance, Handheld Mobile Device, Medical & Industrial Testing Instrument, and Others. Based on countries, the Wi-Fi Module market segments the market into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stakeholders of the Asia Pacific Wi-Fi Module Market. Key companies profiled in the report include Murata Manufacturing Co., Ltd., Microchip Technology Incorporated, Taiyo Yuden Co., Ltd., AzureWave Technologies, Inc., Silicon Laboratories, Inc., Laird PLC,, BroadLink, Advantech Co., Ltd. (Advantech B+B SmartWorx Inc.), Shanghai MXCHIP Information Technology Co., Ltd. and Silex Technology, Inc.