Asia Pacific System in Package (SiP) Technology Market is expected to grow at a CAGR of 8.5% during2016-2022

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According to a new report, Asia Pacific System in Package (SiP) Technology Market, published by KBV Research, the Asia Pacific System in Package (SiP) Technology Market is expected to grow at a CAGR of 8.5% during 2016 -2022.The 2.5-D IC Packaging market dominated the Asia Pacific System in Package (SiP) Technology Market in 2015, and would grow at a CAGR of 7.3% during the forecast period. The 2-D IC PACKAGING market is expected attain a market size of $3.9 billion by 2022.

The Flat Packages market dominated the Asia Pacific System in Package (SiP) Technology Market in 2015, and would reach a market size of $3.2 billion by 2022, growing at a CAGR of 6.9% during the forecast period. The Flip Chip market contributed the larger revenue share, the Asia Pacific System in Package (SiP) Technology Market in 2015, and would grow at a CAGR of 9.8% during the forecast period. The Consumer Electronics market would grow at a CAGR of 5.6% during the forecast period.

The report highlights the adoption of System in Package (SiP) Technology in Asia Pacific.Based on the Type, the Asia Pacific System in Package (SiP) Technology market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging segments. Based on the Packaging Type, the market is bifurcated into Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages and Other Packaging segments. The Asia Pacific System in Package (SiP) Technology market is further segmented into Wire Bond, Flip Chip segments based on the Interconnection Technology. Further, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace &Defense and Other segments based on the various applications.The countries included in the report are China, Japan, India, South Korea, Singapore, Malaysia and Rest of Asia Pacific.

Key Players profiled in the report includes Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Chipmos Technologies Inc., Powertech Technology Inc., Ase Group, Renesas Electronics Corporation, Samsung Electronics Co. Ltd. and Toshiba Corporation.

Full report - https://www.kbvresearch.com/asia-pacific-system-in-package-sip-technology-market/

Research Scope

The market is segmented based on Type, Packaging Type, Interconnection Technology, Application and Country.

Asia Pacific System in Package (SiP) Technology Market, by Type

  • 2-D IC Packaging
  • 5-D IC Packaging
  • 3-D IC Packaging

Asia Pacific System in Package (SiP) Technology market, by Packaging Type

  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Small Outline Packages
  • Other Packaging

Asia Pacific System in Package (SiP) Technology market, by Interconnection Technology

  • Wire Bond
  • Flip Chip

Asia Pacific System in Package (SiP) Technology market, by Application

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace &Defense
  • Others

Asia Pacific System in Package (SiP) Technology market, by Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Company Profiles

  • Amkor Technology Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Chipmos Technologies Inc.
  • Powertech Technology Inc.
  • Ase Group
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • Toshiba Corporation

Related Reports-

Europe System in Package (SiP) Technology Market

North America System in Package (SiP) Technology Market

Global Systems in Package (SiP) Technology Market

Lamea System in Package (SiP) Technology Market

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