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LAMEA High-Density Interconnect (HDI) PCB Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications), By Application, By Country and Growth Forecast, 2023 - 2030

Published Date : 31-Jul-2023

Pages: 109

Formats: PDF

The Latin America, Middle East and Africa High-Density Interconnect (HDI) PCB Market would witness market growth of 14.0% CAGR during the forecast period (2023-2030).

PCB boards are employed in the development of four types of communication networks: fixed-line broadband, data communications, wireless networks, and transmission networks. Particularly for backplanes, high-frequency PCB boards, as well as high-speed multilayer PCBs, PCBs were in great demand during the early stages of 5G construction for wireless networks as well as transmission networks. The increasing number of 5G high-bandwidth commercial applications, including mobile high-definition video, automobile networking, and AR/VR, will significantly affect the capacity of data centers for data processing and interchange in the middle and end phases of 5G development.

Domestic data centers are anticipated to transition from 10G - 100G and 400G ultra-large data centers in the upcoming years. All of these developments will also propel the development and expansion of the HDI PCB technology, providing the market with lucrative growth prospects. Electrical performance is enhanced with HDI PCB. Electrical performance may be enhanced by closer spacing between parts and more transistors. Signal integrity is improved as a result of these features reduced power requirements. Greater reductions in total signal losses as well as crossing delays are associated with smaller diameters, which also speed up the signal transmission. The dependability of the board or the product may be increased by the reduced aspect ratios and the premium microvia construction.

By installing 5G networks, Latin American businesses may boost agricultural output, raise productivity, and improve the availability of services like health care, education, and other essentials in outlying locations. Brazil's switch to 5G wireless broadband will have a positive impact, especially on the Amazon region. By fusing the benefits of incredibly quick 5G networks with new opportunities for Brazilian companies to build network components, the strategy will increase employment and strengthen the country's economy. All of these elements are causing the regional market to grow.

The Brazil market dominated the LAMEA High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $481.7 million by 2029. The Argentina market is showcasing a CAGR of 14.7% during (2023 - 2030). Additionally, The UAE market would register a CAGR of 13.7% during (2023 - 2030).

Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

Free Valuable Insights: The Worldwide High-Density Interconnect (HDI) PCB Market is Projected to reach USD 26.9 Billion by 2030, at a CAGR of 10.9%

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.

Scope of the Study

Market Segments Covered in the Report:

By End User

  • Consumer Electronics
  • Automotive
  • Industrial Electronics
  • IT & Telecommunications
  • Others

By Application

  • Smartphone & Tablet
  • PC & Laptop
  • Smart Wearables
  • Others

By Country

  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • MEIKO ELECTRONICS CO., LTD.
  • DAP CORPORATION
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Unitech Printed Circuit Board Corp.
  • FICT LIMITED (Fujitsu Limited)
  • TTM Technologies, Inc.
  • UNIMICRON TECHNOLOGY CORP.
  • NCAB Group AB
  • Ibiden Co., Ltd.
  • Sierra Circuits, Inc.
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA High-Density Interconnect (HDI) PCB Market, by End User
1.4.2 LAMEA High-Density Interconnect (HDI) PCB Market, by Application
1.4.3 LAMEA High-Density Interconnect (HDI) PCB Market, by Country
1.5 Methodology for the research

Chapter 2. Market at a Glance
2.1 Key Highlights

Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis

Chapter 4. LAMEA High-Density Interconnect (HDI) PCB Market by End User
4.1 LAMEA Consumer Electronics Market by Country
4.2 LAMEA Automotive Market by Country
4.3 LAMEA Industrial Electronics Market by Country
4.4 LAMEA IT & Telecommunications Market by Country
4.5 LAMEA Others Market by Country

Chapter 5. LAMEA High-Density Interconnect (HDI) PCB Market by Application
5.1 LAMEA Smartphone & Tablet Market by Country
5.2 LAMEA PC & Laptop Market by Country
5.3 LAMEA Smart Wearables Market by Country
5.4 LAMEA Others Market by Country

Chapter 6. LAMEA High-Density Interconnect (HDI) PCB Market by Country
6.1 Brazil High-Density Interconnect (HDI) PCB Market
6.1.1 Brazil High-Density Interconnect (HDI) PCB Market by End User
6.1.2 Brazil High-Density Interconnect (HDI) PCB Market by Application
6.2 Argentina High-Density Interconnect (HDI) PCB Market
6.2.1 Argentina High-Density Interconnect (HDI) PCB Market by End User
6.2.2 Argentina High-Density Interconnect (HDI) PCB Market by Application
6.3 UAE High-Density Interconnect (HDI) PCB Market
6.3.1 UAE High-Density Interconnect (HDI) PCB Market by End User
6.3.2 UAE High-Density Interconnect (HDI) PCB Market by Application
6.4 Saudi Arabia High-Density Interconnect (HDI) PCB Market
6.4.1 Saudi Arabia High-Density Interconnect (HDI) PCB Market by End User
6.4.2 Saudi Arabia High-Density Interconnect (HDI) PCB Market by Application
6.5 South Africa High-Density Interconnect (HDI) PCB Market
6.5.1 South Africa High-Density Interconnect (HDI) PCB Market by End User
6.5.2 South Africa High-Density Interconnect (HDI) PCB Market by Application
6.6 Nigeria High-Density Interconnect (HDI) PCB Market
6.6.1 Nigeria High-Density Interconnect (HDI) PCB Market by End User
6.6.2 Nigeria High-Density Interconnect (HDI) PCB Market by Application
6.7 Rest of LAMEA High-Density Interconnect (HDI) PCB Market
6.7.1 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by End User
6.7.2 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by Application

Chapter 7. Company Profiles
7.1 MEIKO ELECTRONICS CO., LTD.
7.1.1 Company Overview
7.1.2 SWOT Analysis
7.2 DAP CORPORATION
7.2.1 Company Overview
7.2.2 SWOT Analysis
7.3 Unitech Printed Circuit Board Corp.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 SWOT Analysis
7.4 FICT LIMITED (Fujitsu Limited)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.4.5 SWOT Analysis
7.5 UNIMICRON TECHNOLOGY CORP.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 NCAB Group AB
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 SWOT Analysis
7.7 Ibiden Co., Ltd.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Sierra Circuits, Inc.
7.8.1 Company Overview
7.8.2 SWOT Analysis
7.9 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 SWOT Analysis
7.10. TTM Technologies, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 SWOT Analysis
TABLE 1 LAMEA High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 2 LAMEA High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 3 LAMEA High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 4 LAMEA High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 5 LAMEA Consumer Electronics Market by Country, 2019 - 2022, USD Million
TABLE 6 LAMEA Consumer Electronics Market by Country, 2023 - 2030, USD Million
TABLE 7 LAMEA Automotive Market by Country, 2019 - 2022, USD Million
TABLE 8 LAMEA Automotive Market by Country, 2023 - 2030, USD Million
TABLE 9 LAMEA Industrial Electronics Market by Country, 2019 - 2022, USD Million
TABLE 10 LAMEA Industrial Electronics Market by Country, 2023 - 2030, USD Million
TABLE 11 LAMEA IT & Telecommunications Market by Country, 2019 - 2022, USD Million
TABLE 12 LAMEA IT & Telecommunications Market by Country, 2023 - 2030, USD Million
TABLE 13 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 14 LAMEA Others Market by Country, 2023 - 2030, USD Million
TABLE 15 LAMEA High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 16 LAMEA High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 17 LAMEA Smartphone & Tablet Market by Country, 2019 - 2022, USD Million
TABLE 18 LAMEA Smartphone & Tablet Market by Country, 2023 - 2030, USD Million
TABLE 19 LAMEA PC & Laptop Market by Country, 2019 - 2022, USD Million
TABLE 20 LAMEA PC & Laptop Market by Country, 2023 - 2030, USD Million
TABLE 21 LAMEA Smart Wearables Market by Country, 2019 - 2022, USD Million
TABLE 22 LAMEA Smart Wearables Market by Country, 2023 - 2030, USD Million
TABLE 23 LAMEA Others Market by Country, 2019 - 2022, USD Million
TABLE 24 LAMEA Others Market by Country, 2023 - 2030, USD Million
TABLE 25 LAMEA High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2022, USD Million
TABLE 26 LAMEA High-Density Interconnect (HDI) PCB Market by Country, 2023 - 2030, USD Million
TABLE 27 Brazil High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 28 Brazil High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 29 Brazil High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 30 Brazil High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 31 Brazil High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 32 Brazil High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 33 Argentina High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 34 Argentina High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 35 Argentina High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 36 Argentina High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 37 Argentina High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 38 Argentina High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 39 UAE High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 40 UAE High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 41 UAE High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 42 UAE High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 43 UAE High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 44 UAE High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 45 Saudi Arabia High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 46 Saudi Arabia High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 47 Saudi Arabia High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 48 Saudi Arabia High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 49 Saudi Arabia High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 50 Saudi Arabia High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 51 South Africa High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 52 South Africa High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 53 South Africa High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 54 South Africa High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 55 South Africa High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 56 South Africa High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 57 Nigeria High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 58 Nigeria High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 59 Nigeria High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 60 Nigeria High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 61 Nigeria High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 62 Nigeria High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 63 Rest of LAMEA High-Density Interconnect (HDI) PCB Market, 2019 - 2022, USD Million
TABLE 64 Rest of LAMEA High-Density Interconnect (HDI) PCB Market, 2023 - 2030, USD Million
TABLE 65 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2022, USD Million
TABLE 66 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by End User, 2023 - 2030, USD Million
TABLE 67 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2022, USD Million
TABLE 68 Rest of LAMEA High-Density Interconnect (HDI) PCB Market by Application, 2023 - 2030, USD Million
TABLE 69 Key Information – MEIKO ELECTRONICS CO., LTD.
TABLE 70 Key Information – DAP CORPORATION
TABLE 71 Key Information – Unitech Printed Circuit Board Corp.
TABLE 72 Key Information – FICT LIMITED
TABLE 73 Key Information – UNIMICRON TECHNOLOGY CORP.
TABLE 74 Key Information – NCAB Group AB
TABLE 75 Key Information – Ibiden Co., Ltd.
TABLE 76 Key Information – Sierra Circuits, Inc.
TABLE 77 Key Information – AT&S Group
TABLE 78 Key Information – TTM Technologies, Inc.

List of Figures
FIG 1 Methodology for the research
FIG 2 LAMEA High-Density Interconnect (HDI) PCB Market, 2019 - 2030, USD Million
FIG 3 Key Factors Impacting High-Density Interconnect (HDI) PCB Market
FIG 4 Porter’s Five Forces Analysis – High-Density Interconnect (HDI) PCB Market
FIG 5 LAMEA High-Density Interconnect (HDI) PCB Market share by End User, 2022
FIG 6 LAMEA High-Density Interconnect (HDI) PCB Market share by End User, 2030
FIG 7 LAMEA High-Density Interconnect (HDI) PCB Market by End User, 2019 - 2030, USD Million
FIG 8 LAMEA High-Density Interconnect (HDI) PCB Market share by Application, 2022
FIG 9 LAMEA High-Density Interconnect (HDI) PCB Market share by Application, 2030
FIG 10 LAMEA High-Density Interconnect (HDI) PCB Market by Application, 2019 - 2030, USD Million
FIG 11 LAMEA High-Density Interconnect (HDI) PCB Market share by Country, 2022
FIG 12 LAMEA High-Density Interconnect (HDI) PCB Market share by Country, 2030
FIG 13 LAMEA High-Density Interconnect (HDI) PCB Market by Country, 2019 - 2030, USD Million
FIG 14 SWOT Analysis: MEIKO ELECTRONICS CO., LTD.
FIG 15 SWOT Analysis: DAP CORPORATION
FIG 16 SWOT Analysis: Unitech Printed Circuit Board Corp.
FIG 17 SWOT Analysis: FICT LIMITED
FIG 18 SWOT Analysis: UNIMICRON TECHNOLOGY CORP.
FIG 19 SWOT Analysis: NCAB Group AB
FIG 20 SWOT Analysis: Ibiden Co., Ltd.
FIG 21 SWOT Analysis: Sierra Circuits, Inc.
FIG 22 SWOT Analysis: AT& S Austria Technologie & Systemtechnik Aktiengesellschaft
FIG 23 SWOT Analysis: TTM Technologies, Inc.

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