The Latin America, Middle East and Africa Chiplet Market would witness market growth of 80.5% CAGR during the forecast period (2023-2030).
One of the most prominent trends in the market is heterogeneous integration. This approach combines chiplets with diverse functions into a single package. For instance, central processing unit (CPU) chiplets can be combined with graphic processing units (GPUs), artificial intelligence accelerators, and memory chiplets. This enables highly specialized and efficient designs tailored to specific applications. Chiplets are inherently scalable, allowing for more straightforward customization of semiconductor solutions. In data centers and high-performance computing, where power efficiency and performance are paramount, chiplets enable mixing and matching components to meet specific workloads.
Chiplets encourage a modular approach to chip design. Companies can develop individual chiplets independently, optimizing each for a specific function. This modularity simplifies the design process and promotes innovation. The ability to design and optimize chiplets independently can significantly decrease the time to industry for new semiconductor solutions. This can be a game-changer in rapidly evolving industries like consumer electronics and cloud computing. The chiplet model can lead to economic efficiency, as it reduces waste in semiconductor manufacturing. Still, viable components can be reused in new designs, potentially reducing costs and environmental impact. Ensuring seamless communication between chiplets is a critical challenge. Developing industry standards for chiplet interfaces and interconnect technologies is a trend that could help unlock the full potential of chiplet technology.
The International Trade Administration estimated that in 2020, Saudi Arabia accounted for nearly 52% of all vehicles sold in the Gulf Cooperation Council (GCC) and 35% in the MENA region. In 2019 and 2020, Saudi Arabia sold 556 thousand and 436 thousand vehicles, respectively. Sales are expected to reach 543,000 units by 2025, with only 32,000 being electric vehicles (EVs). The expansion of the electric vehicle industry in Saudi Arabia is closely linked to the development and adoption of chiplet technology in EVs. As the country continues reducing emissions, conserving energy, and transitioning to sustainable transportation options, further growth and innovation is expected to take place in the usage of chiplets. Chiplets make electric vehicles more efficient, connected, and environmentally friendly. Due to such factors, the market's growth across the region is expected to continue in the coming years.
The Brazil market dominated the LAMEA Chiplet Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $6,893.1 million by 2030. The Argentina market is showcasing a CAGR of 81.5% during (2023 - 2030). Additionally, The UAE market would register a CAGR of 80.1% during (2023 - 2030).
Based on Processor, the market is segmented into Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), AI-ASIC Coprocessor, and Application Processing Unit (APU). Based on End-use, the market is segmented into Enterprise Electronics, Consumer Electronics, Industrial Automation, Automotive, Healthcare, Military & Aerospace, and Others. Based on Packaging Technology, the market is segmented into2.5D/3D, System-in-Package (SiP), Wafer-Level Chip Scale Package (WLCSP), Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), and Fan-Out (FO). Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
Free Valuable Insights: The Worldwide Chiplet Market is Projected to reach USD 373.4 Billion by 2030, at a CAGR of 75.7%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Advanced Micro Devices, Inc., Apple Inc., IBM Corporation, Marvell Technology Group Ltd., MediaTek, Inc., NVIDIA Corporation, Achronix Semiconductor Corporation, ASE Technology Holding Co., Ltd. (ASE Group), and NXP Semiconductors N.V.
By Processor
By End-use
By Packaging Technology
By Country
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