The Europe Wafer Level Packaging Market would witness market growth of 16.9% CAGR during the forecast period (2022-2028).
Manufacturers will continue to invest in this technology due to market trends, such as lower circuit packaging costs, better design increased flexibility and physical performance, and higher investment in research and development operations. STATS ChipPAC, an advanced packaging and semiconductor testing service provider, stated in 2020 that their integrated Wafer-Level Ball Grid Array technology would be expanded to rebuild 300mm wafers. As they added capabilities through 300mm wafer manufacturing, STATS ChipPAC's customers did benefit from the productivity and cost advantages of eWLB technology on the bigger 300mm reconstructed wafer format, which offers higher efficiency and economies of scale than the existing 200mm eWLB wafer format.
The European Semiconductor Industry Association, or ESIA, is the European Semiconductor Industry's representative. Its aim is to advocate and promote the common interests of Europe's semiconductor sector to European Institutions as well as stakeholders in order to ensure a stable business climate and boost global competitiveness. The industry offers novel solutions for the development of regional industries, boosting the economic progress and reacting to critical societal concerns as a provider of key supporting technologies. The European Semiconductor Ecosystem supports around 200.000 direct jobs and up to 1.000.000 affected jobs in systems, applications, and services in Europe, according to the European Commission, making it the most R&D-intensive sector. Overall, micro and nanoelectronics enable Europe along with the rest of the world to generate at least 10% of GDP.
The Germany market dominated the Europe Wafer Level Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $806.1 million by 2028. The UK market is anticipated to grow at a CAGR of 15.9% during (2022 - 2028). Additionally, The France market would showcase a CAGR of 17.7% during (2022 - 2028).
Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. Based on Technology, the market is segmented into Fan IN and Fan OUT. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
Free Valuable Insights: The Global Wafer Level Packaging Market will Hit $14.1 Billion by 2028, at a CAGR of 17.7%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.
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