Europe Gate Driver IC Market By Transistor Type (MOSFET, IGBT), By Semiconductor Material (SiC, GaN), By Mode of Attachment ( On-chip, Discrete), By End User (Industrial, Commercial, Residential)
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Market Report Description
The Europe Gate Driver IC Market Size would witness market growth of 7.2% CAGR during the forecast period (2018 – 2024).
The gate driver's supply chain is evolving, driven by higher integration needs as well as a growing need for more comprehensive product solutions. A much higher percentage of home appliances, electric vehicles, hybrid vehicles, including mild hybrids, and renewable energy products have introduced dedicated power semiconductor devices on board in recent years.
In addition to gate driver IC manufacturers, other players surfaced along the supply chain to offer additional solutions for several power management needs. Intelligent Power Modules (IPMs) and Plug-and-Play (PnP) gate driver boards are two of the most notable solutions. An IPM integrates control, protection, gate driver and power switching devices into a single package to resolve the need for compact, efficient, and application-specific power management requirements.
Based on Transistor Type, the market is segmented into MOSFET and IGBT. Based on Semiconductor Material, the market is segmented into SiC and GaN. Based on Mode of Attachment, the market is segmented into On-chip and Discrete. Based on End User, the market is segmented into Industrial, Commercial and Residential. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Infineon Technologies AG, Mitsubishi Electric Corporation, Nxp Semiconductor, On Semiconductor, Rohm Semiconductors, Renesas Electronics, Stmicroelectronics, Semtech Corporation, Texas Instruments, Toshiba Corporation, and Dialog Semiconductor PLC.
Scope of the Study
By Transistor Type
By Semiconductor Material
By Mode of Attachment
By End User
- Rest of Europe
- Infineon Technologies AG
- Mitsubishi Electric Corporation
- Nxp Semiconductor
- On Semiconductor
- Rohm Semiconductors
- Renesas Electronics
- Semtech Corporation
- Texas Instruments
- Toshiba Corporation
- Dialog Semiconductor PLC
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