Europe ASIC Chip Market By Application (Data Processing Systems, Consumer Electronics, Telecommunication Systems, Aerospace Subsystem & Sensors, Medical Instrumentation and Others) By Type (Semi- Based Custom, Programmable Logic Devices and Others) By Country, Industry Analysis and Forecast, 2019 - 2025
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe ASIC Chip Market, by Application
1.4.2 Europe ASIC Chip Market, by Type
1.4.3 Europe ASIC Chip Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Mergers & Acquisitions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2015-2019)
3.3.2 Key Strategic Move: (Collaborations, Partnerships and Agreements : 2019-Oct – 2017-Dec) Leading Players
3.3.3 Key Strategic Move: (Product Launches and Product Expansions: 2019-Nov – 2015-Aug) Leading Players
Chapter 4. Europe ASIC Chip Market by Application
4.1 Europe ASIC Chip Data Processing Systems Market by Country
4.2 Europe ASIC Chip Consumer Electronics Market by Country
4.3 Europe ASIC Chip Telecommunication Systems Market by Country
4.4 Europe ASIC Chip Aerospace Subsystem & Sensors Market by Country
4.5 Europe ASIC Chip Medical Instrumentation Market by Country
4.6 Europe Other Application ASIC Chip Market by Country
Chapter 5. Europe ASIC Chip Market by Type
5.1 Europe Semi- Based Custom Market by Country
5.2 Europe Programmable Logic Devices Market by Country
5.3 Europe ASIC Chip Others Market by Country
Chapter 6. Europe ASIC Chip Market by Country
6.1 Germany ASIC Chip Market
6.1.1 Germany ASIC Chip Market by Application
6.1.2 Germany ASIC Chip Market by Type
6.2 UK ASIC Chip Market
6.2.1 UK ASIC Chip Market by Application
6.2.2 UK ASIC Chip Market by Type
6.3 France ASIC Chip Market
6.3.1 France ASIC Chip Market by Application
6.3.2 France ASIC Chip Market by Type
6.4 Russia ASIC Chip Market
6.4.1 Russia ASIC Chip Market by Application
6.4.2 Russia ASIC Chip Market by Type
6.5 Spain ASIC Chip Market
6.5.1 Spain ASIC Chip Market by Application
6.5.2 Spain ASIC Chip Market by Type
6.6 Italy ASIC Chip Market
6.6.1 Italy ASIC Chip Market by Application
6.6.2 Italy ASIC Chip Market by Type
6.7 Rest of Europe ASIC Chip Market
6.7.1 Rest of Europe ASIC Chip Market by Application
6.7.2 Rest of Europe ASIC Chip Market by Type
Chapter 7. Company Profiles
7.1 Advanced Micro Devices, Inc.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expenses
7.2 Samsung Electronics Co., Ltd. (Samsung Group)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Partnerships, Collaborations, and Agreements:
7.2.6 SWOT Analysis
7.3 ON Semiconductor Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.3.6 SWOT Analysis
7.4 Xilinx, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.5.2 Acquisition and Mergers:
7.5 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expenses
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Product Launches and Product Expansions:
7.6.5.2 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 Infineon Technologies AG
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.7.6 SWOT Analysis
7.8 Bitmain Technologies Holding Company
7.8.1 Company Overview
7.8.2 Recent strategies and developments:
7.8.2.1 Partnerships, Collaborations, and Agreements:
7.8.2.2 Product Launches and Product Expansions:
7.9 Nvidia Corporation
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Acquisition and Mergers:
7.9.6 SWOT Analysis
7.1 Texas Instruments, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expense
7.10.5 Recent strategies and developments:
7.10.5.1 Partnerships, Collaborations, and Agreements:
7.10.6 SWOT Analysis