Asia Pacific Semiconductor Wafer Market By Wafer Size (6 Inch, 8 Inch, 12 inch, and others), By Technology (Packaging & Assembly, Wafer Bumping, Testing & inspection, and others), By product type (Processor, Memory, Analog, and others), By end User (Consumer Electronics, Automotive, Industrial, Telecommunications, and others), By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027
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Market Report Description
The Asia Pacific Semiconductor Wafer Market would witness market growth of 4.6% CAGR during the forecast period (2021-2027).
Factors such as the rise in utilization of semiconductor wafers in power amplifiers for sending ultra-high radio frequency, rapid electronic switching, and fast signals applications are expected to create lucrative growth opportunities for the players operating in the overall semiconductor wafer market during the forecasting period.
The demand for small-sized gadgets has fuelled the requirement for a large number of features from a single device. Thus, an IC chip should now have a greater number of transistors in order to complement a large number of functionalities.
The APAC is a promising region for the semiconductor wafer market. Among all the nations, China would be the crucial country over the forthcoming years, especially across the consumer electronics and automotive segments. The Chinese automotive market is the biggest around the globe, manufacturing and delivering millions of passengers as well as light commercial vehicles in 2017.
The Packaging & Assembly market dominated the Asia Pacific Semiconductor Wafer Market by Technology 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $3,284.9 million by 2027. The Wafer Bumping market would exhibit a CAGR of 4.9% during (2021 - 2027). Additionally, the Testing & Inspection market is anticipated to grow highest CAGR of 5.2% during (2021 - 2027).
Based on Wafer Size, the market is segmented into 6 Inch, 8 Inch, 12 inch, and others. Based on Technology, the market is segmented into Packaging & Assembly, Wafer Bumping, Testing & inspection, and others. Based on product type, the market is segmented into Processor, Memory, Analog, and others. Based on end User, the market is segmented into Consumer Electronics, Automotive, Industrial, Telecommunications, and others. Based on countries, the market is segmented into China, Japan, Taiwan, India, South Korea, Singapore, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASM International N.V., Shin-Etsu Chemical Co., Ltd., Okmetic Oy (National Silicon Industry Group NSIG), GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.), ASML Holding N.V., Elkem ASA, Lanco Infratech, Applied Materials, Inc., and Sumco Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Wafer Size
- 6 Inch
- 8 Inch
- 12 inch
- Packaging & Assembly
- Wafer Bumping
- Testing & inspection
By Product Type
By End User
- Consumer Electronics
- South Korea
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- ASM International N.V.
- Shin-Etsu Chemical Co., Ltd.
- Okmetic Oy (National Silicon Industry Group NSIG)
- GlobalWafers Singapore Pte. Ltd. (Sino-American Silicon Products Inc.)
- ASML Holding N.V.
- Elkem ASA
- Lanco Infratech
- Applied Materials, Inc.
- Sumco Corporation
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