Asia Pacific Rugged IC Market Size, Share & Industry Trends Analysis Report By Level (Fully Rugged, Semi Rugged and Others), By End Use, By Application, By Country, Historical Data and Growth Forecast, 2021 - 2027
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Market Report Description
The Asia Pacific Rugged IC Market would witness market growth of 5.7% CAGR during the forecast period (2021-2027).
Ruggedized mobile devices are proving to be increasingly beneficial in some industrial industries, like manufacturing sector. Companies with field teams that work in harsh labour and weather situations have discovered a broad range of benefits of rugged devices in a variety of circumstances. These gadgets not only streamline operations but also allow for managed mobility without compromising productivity or quality of work.
Analog integrated circuits, digital integrated circuits, and mixed integrated circuits are the three types of integrated circuits. Digital integrated circuits, which are made up of numerous digital logic gates and other electrical circuit components, are used in computers, microprocessors, digital signal processors, and other frequency counters. Analog integrated circuits (ICs) can be linear or RF, and are typically found in operational amplifiers with a high voltage gain.
The presence of various developing nations like China and India which have a significant manufacturing sector would create opportunities for the market players to invest in this region to expand their revenue share. The industrial supply chain in this region is a vast sector in which complicated actions that need to be take care of at many levels, which involve a wide range of stakeholders who are responsible for specific tasks and outputs.
The China market dominated the Asia Pacific Rugged IC Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $98.7 million by 2027. The Japan market would showcase a CAGR of 5.1% during (2021 - 2027). Additionally, The India market is anticipated to grow a CAGR of 6.3% during (2021 - 2027).
Based on Level, the market is segmented into Fully Rugged, Semi Rugged and Others. Based on End Use, the market is segmented into Consumer Electronics, Manufacturing, Healthcare, Industrial, Automotive and Others. Based on Application, the market is segmented into Mobile Phones, Tablets, Scanners and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
Free Valuable Insights: The Worldwide Rugged IC Market is Projected to reach USD 1.1 Billion by 2027, at a CAGR of 5.6%
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Crystal Group, Inc., NXP Semiconductors N.V., Qualcomm, Inc., Honeywell International, Inc., Analog Devices, Inc., Infineon Technologies AG, STMicroelectronics N.V., Texas Instruments, Inc., MediaTek, Inc., and General Dynamics Corporation.
Scope of the Study
Market Segments Covered in the Report:
- Fully Rugged
- Semi Rugged and
By End Use
- Consumer Electronics
- Automotive and
- Mobile Phones
- Scanners and
- South Korea
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Crystal Group, Inc.
- NXP Semiconductors N.V.
- Qualcomm, Inc.
- Honeywell International, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- STMicroelectronics N.V.
- Texas Instruments, Inc.
- MediaTek, Inc.
- General Dynamics Corporation
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